公开(公告)号：US06406364B1

公开(公告)日：2002-06-18

申请号：US09355895

申请日：1999-10-25

申请人： Norio Kimura ,  Hirokuni Hiyama ,  Yutaka Wada ,  Kiyotaka Kawashima ,  Manabu Tsujimura ,  Takayoshi Kawamoto

发明人： Norio Kimura ,  Hirokuni Hiyama ,  Yutaka Wada ,  Kiyotaka Kawashima ,  Manabu Tsujimura ,  Takayoshi Kawamoto

IPC分类号： B24B5700

CPC分类号： B24B37/04 ,  B24B57/02 ,  Y10S451/91

摘要： The object of the present invention is to provide a polishing apparatus that can supply a polishing solution having a non-varying distribution of abrading particles sizes at a steady rate. An apparatus (20) for delivering a polishing solution to a polishing apparatus (22) is disclosed. The apparatus (20) comprises: a solution passage for transporting the polishing solution; and an ultrasonic vibrator (72) being provided in at least one location of the solution passage.

摘要翻译： 本发明的目的是提供一种抛光装置，其能够以稳定的速度供给研磨粒子尺寸不变的抛光液。 公开了一种用于将抛光溶液输送到抛光装置（22）的装置（20）。 装置（20）包括：用于输送抛光溶液的溶液通道; 和超声波振动器（72）设置在溶液通道的至少一个位置。

公开(公告)号：US06398626B1

公开(公告)日：2002-06-04

申请号：US09612216

申请日：2000-07-07

申请人： Hisanori Matsuo ,  Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa ,  Tetsuji Togawa

发明人： Hisanori Matsuo ,  Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa ,  Tetsuji Togawa

IPC分类号： B24B100

CPC分类号： B24B37/345 ,  B24B53/017 ,  B24D7/14 ,  B24D13/147

摘要： A polishing apparatus is used for polishing a plate-like workpiece, such as a semiconductor wafer or a glass substrate. The polishing apparatus has a polishing table having a polishing surface thereon, a plurality of workpiece holders each for holding a workpiece and pressing the workpiece against the polishing surface, and a dresser for dressing the polishing surface by pressing a desired position of the polishing surface.

公开(公告)号：US06261162B1

公开(公告)日：2001-07-17

申请号：US09276146

申请日：1999-03-25

申请人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo

发明人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo

IPC分类号： B24B500

CPC分类号： B24B37/14 ,  B24B37/12 ,  B24B37/245 ,  B24B49/14 ,  B24D9/085

摘要： A grinding plate has abrasive particles dispersed uniformly. The grinding plate is made by applying ultrasonic vibration when dispersing the abrasive particles in an organic solvent containing a binder material. The grinding plate is fixed on a base section in a wetted state. The grinding plate is divided into a plurality of segments and is fixed to a flat surface of the base section, and the segments are separated by a given distance.

摘要翻译： 研磨板具有均匀分散的磨料颗粒。 研磨板通过在将磨料颗粒分散在含有粘合剂材料的有机溶剂中时施加超声波振动而制成。 研磨板在润湿状态下固定在基部上。 研磨板被分成多个段，并且固定到基部的平坦表面，并且段被分开给定的距离。

公开(公告)号：US06217411B1

公开(公告)日：2001-04-17

申请号：US09276922

申请日：1999-03-26

申请人： Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa ,  Hisanori Matsuo

发明人： Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa ,  Hisanori Matsuo

IPC分类号： B24B4900

CPC分类号： B24B37/005 ,  B24B41/061 ,  B24B49/10 ,  B24B49/16

摘要： A polishing apparatus includes a rotatable polishing pad having a polishing surface, a carrier for carrying an article to be polished and a support for stationarily supporting the carrier in such a manner that the article carried by the carrier is engaged with the polishing surface. A universal joint is provided between the carrier and the support. A sensor device senses a friction force generated between the article and the polishing surface as the polishing pad is rotated and imposed on the carrier. A pressing device has a plurality of pushers arranged around the joint to apply pressures to the carrier towards the polishing pad. A control unit determines magnitudes of pressures applied to the carrier by the respective pushers on the basis of the friction force sensed by the sensor device so that a total pressure applied to the carrier against the flat polishing surface including the pressures applied by the pushers compensates an angular moment acting on the carrier about the joint which is generated by the friction force acting between the article and the flat polishing surface.

摘要翻译： 抛光装置包括具有抛光表面的可旋转抛光垫，用于承载待抛光物品的托架和用于固定地支撑托架的支撑件，使得托架承载的物品与抛光表面接合。 在托架和支架之间提供万向节。 当抛光垫旋转并施加在载体上时，传感器装置感测在物品和抛光表面之间产生的摩擦力。 挤压装置具有围绕接头设置的多个推动器，以向载体施加压力以朝向抛光垫。 控制单元基于由传感器装置感测到的摩擦力来确定由相应的推动器施加到载体的压力的大小，使得施加到载体上的包括由推动器施加的压力的平坦抛光表面的总压力补偿 通过作用在制品和平坦抛光表面之间的摩擦力产生的关于作用于接头的载体的角力矩。

公开(公告)号：US06196904B1

公开(公告)日：2001-03-06

申请号：US09276148

申请日：1999-03-25

申请人： Hisanori Matsuo ,  Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa

发明人： Hisanori Matsuo ,  Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa

IPC分类号： B24B100

CPC分类号： B24B37/30

摘要： A polishing apparatus polishes a workpiece to a planar mirror finish stably, and is prevented from being vibrated while polishing is carried out. The polishing apparatus has a rotatable holding member for holding the workpiece, and a bearing supporting an outer circumferential surface of the holding member, for suppressing vibrations transmitted to the holder while the workpiece is being polished.

摘要翻译： 抛光装置稳定地将工件抛光到平面镜面，并且在进行抛光时防止其振动。 抛光装置具有用于保持工件的可旋转保持构件和支撑保持构件的外周面的轴承，用于在工件被抛光时抑制传递到保持器的振动。

公开(公告)号：US5838447A

公开(公告)日：1998-11-17

申请号：US683959

申请日：1996-07-19

申请人： Hirokuni Hiyama ,  Yutaka Wada

发明人： Hirokuni Hiyama ,  Yutaka Wada

IPC分类号： G01B11/06 ,  G01B11/30 ,  G01N21/84

CPC分类号： B24B37/205 ,  B24B49/12 ,  G01B11/0683 ,  G01B11/306

摘要： A polishing apparatus polishes a workpiece such as a semiconductor wafer while detecting a thickness or a flatness of a surface layer of the workpiece on a real-time basis. The polishing apparatus includes a turntable with a polishing cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and such workpiece against the polishing cloth. The polishing apparatus also has a thickness detector for detecting the thickness of a surface layer of the workpiece supported by the top ring while the workpiece is being polished without exposing the workpiece. The thickness detector includes a sensor mounted in the turntable and including at least one light-emitting element for emitting light toward the surface layer of the workpiece and at least one light-detecting element for detecting light reflected from the surface layer of the workpiece.

摘要翻译： 抛光装置在实时检测工件的表面层的厚度或平坦度的同时对半导体晶片等工件进行抛光。 抛光装置包括：转台，其具有安装在其上表面上的抛光布，以及设置在转盘上方的顶环，用于将抛光的工件支撑在抛光布上。 抛光装置还具有厚度检测器，用于在工件抛光而不暴露工件的同时检测由顶环支撑的工件的表面层的厚度。 厚度检测器包括安装在转盘中的传感器，并且包括用于向工件的表面层发射光的至少一个发光元件和用于检测从工件的表面层反射的光的至少一个光检测元件。

公开(公告)号：US5266012A

公开(公告)日：1993-11-30

申请号：US953851

申请日：1992-09-30

申请人： Hiroyuki Hashimoto ,  Hirokuni Hiyama ,  Toshiro Maekawa ,  Kazuyoshi Yamamoto

发明人： Hiroyuki Hashimoto ,  Hirokuni Hiyama ,  Toshiro Maekawa ,  Kazuyoshi Yamamoto

IPC分类号： F04F7/00 ,  F04B43/00

CPC分类号： F04F7/00

摘要： A vibrating column pump pumps liquid by making use of liquid vibration generated at the time when the vibrating pipe is vibrated in a longitudinal direction thereof. The vibrating column pump comprises a vibrating pipe for pumping liquid therethrough, flexible pipes for connecting both ends of the vibrating pipe with a stationary suction pipe and a stationary outlet pipe, vibrating means for vibrating the vibrating pipe in a longitudinal direction thereof, and retainer means for removably retaining the vibrating pipe in such a manner that the vibrating pipe is removably connected to the vibrating means. The liquid contacting unit including the vibrating pipe and the flexible pipes is separated from the vibrating means so that the liquid contacting unit is disposable and can be easily replaced with a new one.