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公开(公告)号:US06520845B2
公开(公告)日:2003-02-18
申请号:US09813323
申请日:2001-03-21
申请人: Kazuto Hirokawa , Hirokuni Hiyama , Yutaka Wada , Hisanori Matsuo
发明人: Kazuto Hirokawa , Hirokuni Hiyama , Yutaka Wada , Hisanori Matsuo
IPC分类号: B24B2900
CPC分类号: B24B37/30 , B24B7/228 , B24B37/105 , B24B41/068 , B24B49/16
摘要: A polishing apparatus comprises a polishing member that has a wide stable polishing range to perform effective polishing, even if a rotation axis moves away from the edge of a workpiece. A polishing member holder holds the polishing member, and a workpiece holder holds the workpiece to be polished. A drive device produces a relative sliding motion between the polishing member and the workpiece. At least one holder of either the polishing member holder or the workpiece holder is rotatable about a rotation axis and is tiltable with respect to other holder. Such one holder is provided with a pressing mechanism to stabilize orientation or desired posture of the one holder by applying an adjusting pressure to the one holder at a location away from the rotation axis.
摘要翻译: 抛光装置包括抛光构件,其具有宽的稳定的抛光范围以进行有效的抛光,即使旋转轴线远离工件的边缘移动。 抛光构件保持器保持抛光构件,并且工件保持器保持待抛光的工件。 驱动装置在抛光构件和工件之间产生相对滑动运动。 抛光构件保持器或工件保持器中的至少一个保持器可围绕旋转轴线旋转并且可相对于其他保持器倾斜。 这种一个保持器设置有按压机构,以通过在远离旋转轴线的位置向一个保持器施加调节压力来稳定一个保持器的取向或期望姿势。
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公开(公告)号:US06220945B1
公开(公告)日:2001-04-24
申请号:US09296567
申请日:1999-04-22
申请人: Kazuto Hirokawa , Hirokuni Hiyama , Yutaka Wada , Hisanori Matsuo
发明人: Kazuto Hirokawa , Hirokuni Hiyama , Yutaka Wada , Hisanori Matsuo
IPC分类号: B24B2900
CPC分类号: B24B37/30 , B24B7/228 , B24B37/105 , B24B41/068 , B24B49/16
摘要: A polishing apparatus comprises a polishing member that has a wide stable polishing range to perform effective polishing, even if a rotation axis moves away from the edge of a workpiece. A polishing member holder holds the polishing member, and a workpiece holder holds the workpiece to be polished. A drive device produces a relative sliding motion between the polishing member and the workpiece. At least one holder of either the polishing member holder or the workpiece holder is rotatable about a rotation axis and is tiltable with respect to other holder. Such one holder is provided with a pressing mechanism to stabilize orientation or desired posture of the one holder by applying an adjusting pressure to the one holder at a location away from the rotation axis.
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公开(公告)号:US06402588B1
公开(公告)日:2002-06-11
申请号:US09300383
申请日:1999-04-27
申请人: Hisanori Matsuo , Hirokuni Hiyama , Yutaka Wada , Kazuto Hirokawa
发明人: Hisanori Matsuo , Hirokuni Hiyama , Yutaka Wada , Kazuto Hirokawa
IPC分类号: B24B4900
CPC分类号: B24B41/068 , B24B7/228 , B24B37/30 , B24B49/04 , B24B53/017
摘要: The object of the present invention is to provide a polishing apparatus having a grinding member in a compact design that can provide high efficiency for both polishing and dressing operations, and prevents tilting of the grinding member even if the rotation axis thereof is moved away from the outer periphery of the object. A polishing apparatus for an object, comprises: an object holder for holding an object to be polished, such that a surface of the object to be polished faces upward; a dresser disk holder for holding a dresser disk for dressing, such that a dressing surface thereof faces upward; and a grinding member for polishing the object, and for being dressed by the dresser disk, by pressing and sliding the grinding member relative to the object and the dresser disk. Thereby, the surface to be polished and the dressing surface are arranged so as to be coploanar, and the grinding member having an abrasive surface facing downward, is disposed so as to straddle the surface to be polished of the object and the dressing surface of the dresser disk to perform polishing of the surface to be polished and dressing of the abrasive surface of the grinding member.
摘要翻译: 本发明的目的是提供一种研磨装置,其具有紧凑设计的研磨构件,其可以为抛光和修整操作提供高效率,并且防止研磨构件的倾斜,即使其旋转轴线远离 物体的外围。 一种物体的抛光装置,包括:用于保持被抛光物体的物体保持器,使得待抛光物体的表面朝上; 修整器盘保持器,用于保持修整器盘用于修整,使得其修整面朝上; 以及研磨构件,用于抛光所述物体,并且由所述修整器盘修整,通过相对于所述物体和所述修整器盘压下并滑动所述研磨构件。 由此,被抛光面和修整面被配置成为共面的,并且具有面向下方的研磨面的研磨构件配置成跨越物体的被研磨面和修整面 修整器盘以执行抛光表面的抛光和研磨构件的研磨表面的修整。
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公开(公告)号:US06712678B1
公开(公告)日:2004-03-30
申请号:US09890880
申请日:2001-09-21
申请人: Yutaka Wada , Hirokuni Hiyama , Kazuto Hirokawa , Hisanori Matsuo
发明人: Yutaka Wada , Hirokuni Hiyama , Kazuto Hirokawa , Hisanori Matsuo
IPC分类号: B24B2900
CPC分类号: B24B53/017 , B24B57/02
摘要: It is an object of the present invention to provide a mechanism for effectively discharging debris produced when a substrate is polished by a bonded-abrasive element, and a polishing apparatus. According to the present invention, a polishing apparatus presses a surface of a substrate against a bonded-abrasive surface and moves the surface to be polished and the bonded-abrasive surface relative to each other to polish the surface. A mechanism is provided for discharging debris produced on the bonded-abrasive surface when the surface to be polished is polished.
摘要翻译: 本发明的目的是提供一种用于有效地排出当通过粘结研磨元件抛光基底时产生的碎屑的机构和抛光装置。 根据本发明,抛光装置将基板的表面压靠在粘合研磨表面上,并使被研磨表面和粘结研磨表面相对于彼此移动以抛光表面。 当抛光表面被抛光时,提供了用于排出在粘合研磨表面上产生的碎屑的机构。
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公开(公告)号:US06579148B2
公开(公告)日:2003-06-17
申请号:US10166093
申请日:2002-06-11
IPC分类号: B24B4900
CPC分类号: B24B37/16 , B24B37/013 , B24B49/14 , B24B49/16 , B24B57/02
摘要: A polishing apparatus is used for polishing a surface of a workpiece such as a semiconductor wafer or a glass substrate. The polishing apparatus comprises a polishing table having a polishing surface thereon, a plurality of workpiece holders each for holding a workpiece and pressing the workpiece against the polishing surface, and a controller for controlling the workpiece holders individually so that polishing operations of the workpiece holders are controlled independently of each other.
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公开(公告)号:US06458012B1
公开(公告)日:2002-10-01
申请号:US09612215
申请日:2000-07-07
IPC分类号: B24B4900
CPC分类号: B24B37/16 , B24B37/013 , B24B49/14 , B24B49/16 , B24B57/02
摘要: A polishing apparatus is used for polishing a surface of a workpiece such as a semiconductor wafer or a glass substrate. The polishing apparatus comprises a polishing table having a polishing surface thereon, a plurality of workpiece holders each for holding a workpiece and pressing the workpiece against the polishing surface, and a controller for controlling the workpiece holders individually so that polishing operations of the workpiece holders are controlled independently of each other.
摘要翻译: 抛光装置用于抛光诸如半导体晶片或玻璃基板的工件的表面。 抛光装置包括:抛光台,其上具有研磨面,多个工件保持件,每个工件保持件用于保持工件并将工件压靠在抛光表面上;以及控制器,其分别控制工件保持器,使得工件保持器的抛光操作 相互独立地控制。
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公开(公告)号:US06942548B2
公开(公告)日:2005-09-13
申请号:US09916305
申请日:2001-07-30
申请人: Yutaka Wada , Hirokuni Hiyama , Kazuto Hirokawa , Hisanori Matsuo
发明人: Yutaka Wada , Hirokuni Hiyama , Kazuto Hirokawa , Hisanori Matsuo
IPC分类号: B24B1/00 , B24B37/04 , B24B37/24 , B24B53/017 , B24D3/32 , H01L21/304
CPC分类号: B24B37/245 , B24B37/042 , B24B53/017 , B24D3/32 , H01L21/31053 , H01L21/3212
摘要: An abrading plate has a self-stopping capability such that when an object, such as a semiconductor wafer having a device structure that includes raised regions and depressed regions fabricated on the surface, is being polished, the raised regions are removed and polishing stops automatically. The abrading plate, to produce a flat and mirror polished surface on the an object, has abrasive particles having a chemical purity of not less than 90% and a particle size of not more than two micrometers, a binder material, and a given volume of porosity. A ratio of the abrasive particles and the binder material is not less than 1:0.5 by volume, and proportions of abrasive particles, a binder material and porosity are, respectively, not less than 10%, not more than 60% and 10-40% by volume. A surface is polished for a given duration with a liquid not containing abrasive particles so as to eliminate the raised regions and to obtain a flat surface. Additional surface removal is performed by supplying abrasive particles to the polishing interface to remove surface material uniformly from the entire surface.
摘要翻译: 研磨板具有自停能力,使得当正在抛光诸如具有包括凸起区域的器件结构和在表面上制造的凹陷区域的半导体晶片的物体时,抛光凸起区域并且抛光自动停止。 研磨板在物体上产生平坦且镜面抛光的表面,具有化学纯度不小于90%,粒度不大于2微米的磨料颗粒,粘合剂材料和给定体积的 孔隙度。 研磨粒子和粘合剂材料的比例为1〜0.5体积%以上,研磨粒子,粘合剂材料和孔隙率的比例分别为10%以上,60%以下,10〜40% 按体积计。 表面用不含磨料颗粒的液体抛光给定持续时间,以消除凸起区域并获得平坦表面。 通过将磨料颗粒提供给抛光界面以从整个表面均匀地去除表面材料来进行附加的表面去除。
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公开(公告)号:US06626739B1
公开(公告)日:2003-09-30
申请号:US09640981
申请日:2000-08-18
申请人: Yutaka Wada , Hirokuni Hiyama , Kazuto Hirokawa , Hisanori Matsuo
发明人: Yutaka Wada , Hirokuni Hiyama , Kazuto Hirokawa , Hisanori Matsuo
IPC分类号: B24B500
CPC分类号: B24B53/017
摘要: A method is provided for polishing a device wafer, which has projections and depressions formed on a surface thereof, with the use of an abrading plate. The method comprises polishing the device wafer while supplying a surface active agent and/or while dressing a surface of the abrading plate. This method for polishing the device wafer can always exhibit a self-stop function, without being restricted by the composition of the abrading plate, and without being restricted by the type of the substrate.
摘要翻译: 提供了一种用于研磨具有在其表面上形成有凹凸的器件晶片的方法。 该方法包括在提供表面活性剂的同时抛光装置晶片和/或在修整研磨板的表面时。 用于抛光装置晶片的这种方法可以始终呈现自动停止功能,而不受研磨板的组成的限制,并且不受基板的类型的限制。
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公开(公告)号:US06595831B1
公开(公告)日:2003-07-22
申请号:US09560562
申请日:2000-04-28
IPC分类号: B24B100
CPC分类号: H01L21/67161 , B08B1/04 , B24B37/042 , B24B37/245 , H01L21/67219 , H01L21/67745
摘要: A polishing method and apparatus can concurrently establish a stable removal rate, a small step height reduction rate, and reduction of detects on the polished surface for various kinds of polished subjects, while providing less environmental problems and requiring less processing costs. The method for polishing a surface of a semiconductor device wafer comprises first polishing a surface of the semiconductor wafer by a first fixed abrasive polishing method; and finish polishing the polished surface of the semiconductor wafer by a second fixed abrasive polishing method different from the first fixed abrasive polishing method.
摘要翻译: 抛光方法和装置可以同时建立各种抛光对象的抛光表面的稳定的去除率,小的台阶降低率和减少对抛光表面的检测,同时提供较少的环境问题并且需要更少的处理成本。 用于抛光半导体器件晶片的表面的方法包括:通过第一固定研磨抛光方法对半导体晶片的表面进行抛光; 并且通过与第一固定研磨抛光方法不同的第二固定研磨抛光方法来对半导体晶片的抛光表面进行抛光。
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公开(公告)号:US06413155B1
公开(公告)日:2002-07-02
申请号:US09758174
申请日:2001-01-12
申请人: Hisanori Matsuo , Hirokuni Hiyama , Yutaka Wada , Kazuto Hirokawa
发明人: Hisanori Matsuo , Hirokuni Hiyama , Yutaka Wada , Kazuto Hirokawa
IPC分类号: B24B100
摘要: A polishing apparatus polishes a workpiece to a planar mirror finish stably, and is prevented from being vibrated while polishing is carried out. The polishing apparatus has a holding member for holding the workpiece, and a bearing supporting an outer circumferential surface of the holding member, for suppressing vibrations transmitted to the holder while the workpiece is being polished.
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