摘要:
A method and equipment which includes an illustrated-spot illumination-distribution data table for storing an illumination distribution within an illustrated spot and which calculates a coordinate position for a particle or a defect and the diameter of the particle on the basis of detection light intensity data about the particle or defect and the illustrated-spot illumination-distribution data table. Thus, even when the illumination distribution within the illustrated spot based on an actual illumination optical system is not a Gaussian distribution, the calculation of the particle diameter of the detected particle or defect and the calculation of a coordinate position on the surface of an object to be inspected can be attained with an increased accuracy.
摘要:
A method and equipment which includes an illustrated-spot illumination-distribution data table for storing an illumination distribution within an illustrated spot and which calculates a coordinate position for a particle or a defect and the diameter of the particle on the basis of detection light intensity data about the particle or defect and the illustrated-spot illumination-distribution data table. Thus, even when the illumination distribution within the illustrated spot based on an actual illumination optical system is not a Gaussian distribution, the calculation of the particle diameter of the detected particle or defect and the calculation of a coordinate position on the surface of an object to be inspected can be attained with an increased accuracy.
摘要:
A scatterometer-interferometer and method for detecting and distinguishing characteristics of surface artifacts provides improved artifact detection and increased scanning speed in interferometric measurement systems. A scatterometer and interferometer are combined in a single measurement head and may have overlapping, concentric or separate measurement spots. Interferometric sampling of a surface under measurement may be initiated in response to detection of a surface artifact by the scatterometer, so that continuous scanning of the surface under measurement can be performed until further information about the size and/or height of the artifact is needed.
摘要:
A method for defect detection includes: (i) scanning at least one wafer by a monitoring system and providing defect size information for each defect that belongs to a group of defects; (ii) scanning the at least one wafer by a wafer inspection system that includes multiple detectors and providing a set of defect detection signals for each defect of the group, wherein the wafer inspection system is characterized by lower resolution than the monitoring system; (iii) classifying the defects to defect classes; (iv) determining multiple relationships between defect types, defect sizes and sets of detection signals; (v) scanning a second wafer by the wafer inspection tool; and (vi) generating, for multiple defects, second wafer defect size information in response to the determined relationships and in response to multiple sets of detection signals generated during the scanning of the second wafer.
摘要:
A method for obtaining confidence measure of a ball grid array (BGA) model having a plurality of balls in semiconductor surface mounted devices is provided. The method comprises the steps of extracting BGA images from a real surface mounted device, generating a BGA ball model and a BGA body model, generating a first confidence measure of the BGA ball model wherein the first confidence measure includes a first standard deviation of the BGA ball model and a first local image contrast of each BGA ball, and generating a second confidence measure of the BGA body model wherein the second confidence measure includes a second standard deviation of the BGA body model and a second local image contrast of the BGA body.
摘要:
A multi-resolution inspection system and method of operation. The system may comprise a first scanning system having a first resolution, wherein the first scanning system is operable to perform a first resolution scan of a surface area of an object to identify a location of a surface abnormality in the object. The system may also comprise a second scanning system having a second resolution, the second resolution being smaller than the first resolution. The second scanning system is operable to receive the location of the surface abnormality from the first scanning system and to automatically perform a second resolution scan of a defined region of the object around the location of the surface abnormality.
摘要:
A visual inspection apparatus detects a defect candidate for each of captured images of a crown surface of a piston that are captured at a plurality of posture angles different from one another, locates a three-dimensional position of the defect candidate based on a two-dimensional position of the defect candidate detected from at least one captured image among the captured images captured at the plurality of posture angles, applies a perspective projection transformation on the three-dimensional position of the defect candidate to acquire a two-dimensional position of the defect candidate for each of the captured images captured at the plurality of posture angles, determines a feature amount regarding the defect candidate based on the two-dimensional position of the defect candidate for each of the captured images captured at the plurality of posture angles, and inspects the crown surface of the piston using the feature amount regarding the defect candidate.
摘要:
Provided is a method for inspecting surface deformation of a structure which enables easy measurement of the amount of deformation of the surface of a structure protection sheet attached to the surface of a structure such as concrete. The method for inspecting surface deformation of a structure includes: identifying a structure protection sheet attached to a surface of a structure using an individual identification means; digitally photographing a surface of a resin layer on an outermost surface of the structure protection sheet using a digital photography means; measuring a dimension of the surface of the resin layer based on image data obtained in the digital photography using a dimension measuring means; and calculating an amount of deformation of the surface of the resin layer based on data of the measured dimension using a calculation means.
摘要:
A defect inspection device according to one or more embodiments includes an inspection device for detecting a defect by line-scanning an object, and for generating review image data for the defect, a height measurer for acquiring a reference height of the defect and a height of the defect, and for generating height data of the defect, and a defect classifier for classifying the defect based on the review image data and the height data.
摘要:
A system for monitoring the tread of a shoe includes a frame member, a waveguide structured to support the shoe when an outer sole of shoe is in contact with a surface of the waveguide, a light source structured to provide light within an edge of the waveguide such that the light will be internally reflected within the waveguide, and an imaging device structured and configured to generate an image of the outer sole of the shoe when the outer sole of shoe is in contact with the waveguide and the light is being provided within the waveguide. The system also includes a controller structured and configured to: (i) receive image data based on the image of the outer sole; (ii) determine from the image data a largest worn region size for the shoe; and (iii) determine a slip risk for the shoe based on the largest worn region size.