公开(公告)号：US07898808B2

公开(公告)日：2011-03-01

申请号：US12052596

申请日：2008-03-20

Applicant: Charles Steven Joiner ,  Joshua Moore

Inventor： Charles Steven Joiner ,  Joshua Moore

IPC: H05K7/20 ,  H04B10/02

CPC classification number: H05K7/20418 ,  H05K7/20445

Abstract: Mechanisms and systems for dissipating heat from an optical transceiver module to a module card cage system. In one embodiment, a thermal conductive label having at least one raised portion is attached to a surface of the module. The raised portion is configured to contact at least a portion of the card cage to dissipate heat from the module to the card cage. In another embodiment, the card cage has a protruding depression formed on a part of its surface that is above a slot configured to receive an optical transceiver module. The protruding depression is configured to contact at least a portion of the module to dissipate heat from the module to the card cage.

Abstract translation: 从光收发器模块向模块卡笼系统散热的机构和系统。 在一个实施例中，具有至少一个凸起部分的导热标签附接到模块的表面。 凸起部分构造成接触卡笼的至少一部分以将热量从模块散发到卡笼。 在另一个实施例中，卡笼具有形成在其表面的一部分上的突出凹陷，该凹陷在配置成接收光收发器模块的槽的上方。 突出的凹陷构造成接触模块的至少一部分以将热量从模块散发到卡笼。

公开(公告)号：US20110026229A1

公开(公告)日：2011-02-03

申请号：US12690841

申请日：2010-01-20

Applicant: Wei-Kai Hsiao ,  Ming-Tang Yang

Inventor： Wei-Kai Hsiao ,  Ming-Tang Yang

IPC: H05K5/00

CPC classification number: H05K7/20445

Abstract: An electronic device includes a casing, a circuit board and a cushioning member. The circuit board is disposed within the casing. The cushioning member is disposed within the casing and includes a sustaining element and a supporting element. The sustaining element is supported by the supporting element and disposed on the circuit board. When the casing is subject to an impact, the sustaining element is sustained against the casing to prevent from fracture of the casing.

Abstract translation: 电子设备包括壳体，电路板和缓冲构件。 电路板设置在壳体内。 缓冲构件设置在壳体内，并且包括维持元件和支撑元件。 支撑元件由支撑元件支撑并设置在电路板上。 当壳体受到冲击时，维持元件抵抗壳体，以防止壳体断裂。

公开(公告)号：US20100263851A1

公开(公告)日：2010-10-21

申请号：US12760849

申请日：2010-04-15

Applicant: Maiko YASUI

Inventor： Maiko YASUI

IPC: F28F7/00

CPC classification number: H01L23/433 ,  H01L23/4006 ,  H01L2924/0002 ,  H05K7/20445 ,  H05K7/2049 ,  H01L2924/00

Abstract: A heat-transfer mechanism which transfers heat of a heat-generating component mounted on a board to a housing includes a heat-transfer plate having a bottom face portion which has contact with the heat-generating component, a first heat-transfer portion which is screwed near one end portion of the housing and a second heat-transfer portion which is screwed near the other end portion of the housing.

Abstract translation: 将安装在板上的发热部件的热量传递到壳体的传热机构包括具有与发热部件接触的底面部的传热板，第一传热部 在壳体的一个端部附近拧紧，第二传热部分在壳体的另一个端部附近旋入。

公开(公告)号：US20100091460A1

公开(公告)日：2010-04-15

申请号：US12287560

申请日：2008-10-10

Applicant: Lee R. Hinze ,  G. Venkata Krishnan ,  Scott E. Wilson

Inventor： Lee R. Hinze ,  G. Venkata Krishnan ,  Scott E. Wilson

IPC: H05K7/20 ,  H05K7/14

CPC classification number: H05K7/20409 ,  H01L23/367 ,  H01L23/4006 ,  H01L2023/4068 ,  H01L2023/4087 ,  H01L2924/0002 ,  H05K7/20445 ,  H01L2924/00

Abstract: An electronic module includes a printed circuit board with a heat producing electrical component assembled in an insulating housing. The component is adjacent a thermally conducting heat sink with a thermally conductive material disposed therebetween. Integral with the heat sink is a thermally conductive runner, partially encased in the housing wall, connecting the heat sink to a thermally conductive port. The port is coupled to a base structure when the housing is attached to the base, forming a heat conduction path from the component to the base. This conductive path may also provide an electrical ground path from the printed circuit board to the base.

Abstract translation: 电子模块包括具有组装在绝缘壳体中的发热电气部件的印刷电路板。 该部件与导热散热器相邻，导热散热器之间设置有导热材料。 与散热器成一体是导热流道，部分地封装在壳体壁中，将散热器连接到导热端口。 当壳体附接到基座时，端口连接到基部结构，形成从部件到基部的热传导路径。 该导电路径还可以提供从印刷电路板到底座的电接地路径。

公开(公告)号：US20100072952A1

公开(公告)日：2010-03-25

申请号：US12516168

申请日：2007-11-22

Applicant: Masayoshi NAKAJIMA

Inventor： Masayoshi NAKAJIMA

IPC: H02J7/04 ,  H05K7/20

CPC classification number: H04B1/036 ,  H04B1/3883 ,  H04M1/026 ,  H04M1/0262 ,  H05K7/20445

Abstract: To provide a structure to dissipate heat from an internal heating component efficiently for a miniaturized, thin portable electronic apparatus. The portable electronic apparatus comprises a housing 1, a circuit board 7 accommodated in the housing and mounted with an electronic component on a surface on one side of the circuit board, a thermally conductive member 6 arranged opposite to the surface on one side of the circuit board and having thermal conductive property, and a battery accommodated in a battery chamber 8 formed in the housing. The thermally conductive member 6 forms at least a part of the battery chamber 8.

Abstract translation: 为了提供一种用于有效地为小型化的便携式电子设备散热来自内部加热部件的结构。 便携式电子设备包括壳体1，容纳在壳体中并且在电路板的一侧的表面上安装有电子部件的电路板7，与电路的一侧上的表面相对布置的导热构件6 并且具有导热性，以及容纳在形成在壳体中的电池室8中的电池。 导热构件6形成电池室8的至少一部分。

公开(公告)号：US20100033934A1

公开(公告)日：2010-02-11

申请号：US12341282

申请日：2008-12-22

Applicant: Liang-Wei CHEN

Inventor： Liang-Wei CHEN

IPC: H05K7/20

CPC classification number: H05K7/20445 ,  H05K1/141 ,  H05K3/301 ,  H05K3/366 ,  H05K7/2049

Abstract: A fixing heat dissipating unit that is disposed in an electronic device is connected to a substrate and a heat source. The fixing heat dissipating unit includes a fixing element and a heat conducting element. The fixing element is connected to the substrate to hold the substrate in the electronic device. The heat conducting element is respectively connected to the heat source and the fixing element. The heat source is a part of the electronic device and the fixing element is integrated with the heat conducting element as a single component. An electronic device having the fixing heat dissipating unit is also disclosed.

Abstract translation: 设置在电子设备中的固定散热单元连接到基板和热源。 固定散热单元包括固定元件和导热元件。 固定元件连接到基板以将基板保持在电子设备中。 导热元件分别连接到热源和固定元件。 热源是电子设备的一部分，并且固定元件作为单个部件与导热元件集成。 还公开了一种具有固定散热单元的电子设备。

公开(公告)号：US07586189B2

公开(公告)日：2009-09-08

申请号：US11212106

申请日：2005-08-26

Applicant: Satoshi Yamauchi ,  Akihiro Mizutani

Inventor： Satoshi Yamauchi ,  Akihiro Mizutani

IPC: H01L23/10

CPC classification number: H05K7/20445 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K7/20436 ,  H01L2924/00

Abstract: A circuit board mounting electronic components including a heat generating element is accommodated in a casing. A heat dissipation member is disposed between the heat generating element and an inner surface of the casing. The heat dissipation member is thermally bonded to the heat generating element and to the casing. The heat dissipation member is a polymeric material having fluidity. A film for preventing a shifting of the heat dissipation member is disposed between the heat dissipation member and the casing. And, the film is chemically or electrically bonded to the heat dissipation member and to the casing.

Abstract translation: 将包括发热元件的电子部件的电路板容纳在壳体中。 散热构件设置在发热元件和壳体的内表面之间。 散热构件热连接到发热元件和壳体。 散热构件是具有流动性的聚合材料。 在散热构件和壳体之间设置有用于防止散热构件的移动的膜。 并且，该膜与散热构件和壳体化学或电连接。

公开(公告)号：US07583505B2

公开(公告)日：2009-09-01

申请号：US12016646

申请日：2008-01-18

Applicant: Kenichi Wakabayashi ,  Chitoshi Takayama ,  Tadashi Shiozaki

Inventor： Kenichi Wakabayashi ,  Chitoshi Takayama ,  Tadashi Shiozaki

IPC: H05K7/20

CPC classification number: G06K19/07735 ,  B41J29/377 ,  G06K19/077 ,  G06K19/07741 ,  G06K19/07743 ,  H05K5/0208 ,  H05K5/0256 ,  H05K7/20445

Abstract: A processor apparatus is disclosed. The apparatus includes a case with air passages, and a heat dissipation plate structure having a thermally conductive material within the case. It includes a processor having a major surface, where the processor generates heat when energized, and where the heat dissipation plate structure is adapted to dissipate heat from the processor. It also includes an array of pins, where the pins in the array of pins are substantially perpendicular to the major surface of the processor and are operatively coupled to the processor. It also includes a socket assembly, and a circuit board, where the socket assembly is on the circuit board. The pins in the array of pins are configured to be received in the socket assembly.

Abstract translation: 公开了一种处理器装置。 该装置包括具有空气通道的壳体和在壳体内具有导热材料的散热板结构。 它包括具有主表面的处理器，其中处理器在通电时产生热量，并且散热板结构适于散发来自处理器的热量。 它还包括引脚阵列，其中引脚阵列中的引脚基本上垂直于处理器的主表面并且可操作地耦合到处理器。 它还包括插座组件和电路板，其中插座组件在电路板上。 引脚阵列中的引脚被配置为接收在插座组件中。

公开(公告)号：US20090032218A1

公开(公告)日：2009-02-05

申请号：US11831603

申请日：2007-07-31

Applicant: Michael J. Wayman

Inventor： Michael J. Wayman

IPC: F28F7/00

CPC classification number: F28F13/00 ,  H05K7/20445 ,  H05K7/2049

Abstract: An apparatus for transferring heat between two surfaces is provided. The apparatus includes a first support plate, a sheet of thermal material adjacent the first support plate, and a second support plate adjacent the sheet of thermal material, wherein the sheet of thermal material is disposed between the first support plate and the second support plate. The apparatus also includes at least one bolt inserted through each of the first support member, the sheet of thermal material, and the second support plate, the at least one bolt configured to be secured into a chassis. Finally, at least one spring is disposed between a shoulder of the at least one bolt and the second support plate.

Abstract translation: 提供了一种用于在两个表面之间传递热量的装置。 该装置包括第一支撑板，与第一支撑板相邻的热材料片，以及与该热塑性材料片相邻的第二支撑板，其中该热塑性材料片设置在第一支撑板和第二支撑板之间。 该装置还包括插入穿过第一支撑构件，热板材料和第二支撑板中的每一个的至少一个螺栓，所述至少一个螺栓构造成固定到底盘中。 最后，至少一个弹簧设置在至少一个螺栓的肩部和第二支撑板之间。

公开(公告)号：US20080291646A1

公开(公告)日：2008-11-27

申请号：US12122842

申请日：2008-05-19

Applicant: Endrio FINO ,  Fulvio CICOGNATI

Inventor： Endrio FINO ,  Fulvio CICOGNATI

IPC: H05K5/00

CPC classification number: H05K7/20854 ,  H05K7/20445

Abstract: An electronic control unit presenting: a printed circuit board, which supports an electric circuit, a plurality of electric/electronic components electrically connected to the electric circuit, and at least one connector electrically connected to the electrical circuit; a housing, which accommodates therein the printed circuit board and comprises a base which inferiorly supports the printed circuit board and a lid which superiorly closes the base; and at least one pressing element, which is formed by elastically deformable material, is arranged in central position and is compressed between the lid and the printed circuit board for pressing with interference against the printed circuit board.

Abstract translation: 一种电子控制单元，具有：支撑电路的印刷电路板，与所述电路电连接的多个电气/电子部件，以及与所述电路电连接的至少一个连接器。 壳体，其容纳印刷电路板，并且包括下部支撑印刷电路板的基座和上部关闭基座的盖子; 并且由弹性变形材料形成的至少一个按压元件被布置在中心位置，并且被压缩在盖和印刷电路板之间，用于与印刷电路板的干涉压紧。