Method of enhancement of electrical conductivity for conductive polymer by use of field effect control
    72.
    发明授权
    Method of enhancement of electrical conductivity for conductive polymer by use of field effect control 有权
    通过场效应控制增强导电聚合物导电性的方法

    公开(公告)号:US06875480B2

    公开(公告)日:2005-04-05

    申请号:US10083366

    申请日:2002-02-27

    Abstract: The present invention is to provide a method of enhancement of electrical conductivity for conductive polymer by use of field effect control, wherein on the substrate, whose surface was treated with a field, was coated by a containing monomer or oligomer solution of conductive polymer, through a field mechanism a monomer or oligomer of conductive polymer can demonstrate the sequential order molecular structure layer on the substrate, on this molecular structure layer was coated by an available amount of oxidant to proceed the polymerization, it was subjected to a field during polymerization to form 3-dimensional order stacking structure in order to increase the functional characteristic and electrical conductivity for conductive polymer.

    Abstract translation: 本发明提供一种通过场效应控制来提高导电性聚合物的导电性的方法,其中在表面用场处理的基板上,用含有导电聚合物的单体或低聚物溶液涂覆,通过 导电聚合物的单体或低聚物的场机理可以证明衬底上的顺序分子结构层,在该分子结构层上涂覆可用量的氧化剂以进行聚合,在聚合过程中进行场 为了增加导电聚合物的功能特性和导电性,三维订购堆叠结构。

    Photosensitive composition
    74.
    发明授权
    Photosensitive composition 失效
    感光组合物

    公开(公告)号:US06432613B1

    公开(公告)日:2002-08-13

    申请号:US09866727

    申请日:2001-05-30

    CPC classification number: G03F7/038

    Abstract: The present invention discloses a photo-sensitive composition, used as a solder resist or a photosensitive material for insulation layers in the production of printed circuit boards. The photo-sensitive composition comprises a prepolymer containing carboxylic groups and unsaturated vinyl groups; photoinitiator; unsaturated photo-monomer; and the reaction adduct of bismaleimide derivative, barbituric acid derivative and epoxy compounds. The obtained photosensitive composition exhibits high adhesion towards PI substrates, in addition, it can be developed with alkaline water. The photosensitive composition obtained in the invention is very useful in packaging substrates, such as P-BGA, T-BGA and F-CSP due to its high heat resistance and solder resistance.

    Abstract translation: 本发明公开了一种在制造印刷电路板中用作阻焊剂或用于绝缘层的感光材料的光敏组合物。 感光组合物包含含有羧基和不饱和乙烯基的预聚物; 光引发剂 不饱和光单体; 和双马来酰亚胺衍生物,巴比土酸衍生物和环氧化合物的反应加合物。 所得的感光性组合物对PI基材的粘合性高,另外可用碱性水显影。 本发明中得到的感光性组合物由于其高耐热性和耐焊性而在包装基材如P-BGA,T-BGA和F-CSP中非常有用。

    Mixing barbituric acid-modified BMI with MEK solution of epoxy resin and elastomer
    75.
    发明授权
    Mixing barbituric acid-modified BMI with MEK solution of epoxy resin and elastomer 有权
    将巴比妥酸改性BMI与环氧树脂和弹性体的MEK溶液混合

    公开(公告)号:US06359039B1

    公开(公告)日:2002-03-19

    申请号:US09628061

    申请日:2000-07-25

    CPC classification number: C09J163/00 C08G59/4042 C08L79/08 C08L2666/08

    Abstract: An epoxy based adhesive composition contains: (i) a barbituric acid-modified bismaleimide; (ii) an epoxy resin selected from the group consisting of tetraglycidylmethylenedianiline, diglycidyl ortho-phthalate, diglycidyl ether of bisphenol A, polyglycidyl ether of novolac, and epoxy cresol novolac; (iii) an elastomer such as a carboxylated acrylontrile rubber containing between 19 and 41 wt % of acrylontrile; (v) a hardening agent and (vi) a catalyst.

    Abstract translation: 环氧基粘合剂组合物包含:(i)巴比妥酸改性双马来酰亚胺; (ii)选自四缩水甘油亚甲基二苯胺,邻苯二甲酸二缩水甘油酯,双酚A的二缩水甘油醚,酚醛清漆的聚缩水甘油醚和环氧甲酚酚醛清漆的环氧树脂; (iii)弹性体,例如含有19至41重量%的丙烯腈的羧化丙烯腈橡胶; (v)硬化剂和(vi)催化剂。

    Forming copper clad laminates
    76.
    发明授权
    Forming copper clad laminates 失效
    成型铜包层压板

    公开(公告)号:US5518779A

    公开(公告)日:1996-05-21

    申请号:US302570

    申请日:1994-09-08

    Abstract: An improved method for preparing copper clad laminates from a copper substrate without a conventional or infrared oven. The method contains the steps of: (a) preparing a precursory coating composition which can be subsequently cured to become polyimide; (b) coating the precursory coating composition on a copper substrate; and (c) exposing the precursory coating composition to an infrared heater provided in an infrared curing apparatus. The infrared heater is selected such that it emits infrared rays of wavelengths correponding to the absorption spectrum of the precursory coating composition. A plurality of infrared heaters can be provided in the infrared curing apparatus, each can be designed to have a different effective heating length and/or operated at a uniquely predetermined surface temperature for optimum energy efficiency. Preferably, the precursory coating composition contains an upper layer consisting essentially of polyamic acid and a lower layer disposed between the upper layer and the copper substrate, the lower layer being a blended mixture of the polyamic acid and a modified bismaleimide.

    Abstract translation: 一种用于从铜基底制备铜箔层压板而不使用常规或红外线烘箱的改进方法。 该方法包括以下步骤:(a)制备可随后固化成聚酰亚胺的前体涂料组合物; (b)将前体涂料组合物涂布在铜基材上; 和(c)将前体涂料组合物暴露于设置在红外固化装置中的红外加热器。 选择红外线加热器,使得其发射相应于前体涂料组合物的吸收光谱的波长的红外线。 红外线固化装置中可以设置多个红外加热器,每个红外线加热器可设计成具有不同的有效加热长度和/或在独特的预定表面温度下操作以获得最佳的能量效率。 优选地,前体涂料组合物包含基本上由聚酰胺酸组成的上层和设置在上层和铜基材之间的下层,下层是聚酰胺酸和改性双马来酰亚胺的共混混合物。

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