公开(公告)号：US08193258B2

公开(公告)日：2012-06-05

申请号：US12546862

申请日：2009-08-25

Applicant: Jauder Jeng ,  Man-Lin Chen ,  Pei-Ching Liu ,  Tien-Shou Shieh

Inventor： Jauder Jeng ,  Man-Lin Chen ,  Pei-Ching Liu ,  Tien-Shou Shieh

IPC: C08F2/50 ,  C08L63/10

CPC classification number: C08G59/186 ,  C08G59/5073 ,  C08K5/07 ,  C08K5/5397 ,  C08L63/10 ,  C08L2666/22 ,  C09J163/10

Abstract: A sealant composition is provided. The sealant composition includes (a) an oligomer including an unsaturated mono-carboxylic acid modified bisphenol A epoxy resin and an unsaturated mono-carboxylic acid modified bisphenol F epoxy resin, wherein an equivalence ratio of the bisphenol A epoxy resin to the bisphenol F epoxy resin is 0.05:0.95 to 0.3:0.7, the bisphenol A epoxy resin has a melting point higher than 40° C. and the bisphenol F epoxy resin has a melting point lower than 40° C.; (b) an epoxy resin having at least two or more than two epoxy groups; and (c) a photoinitiator.

Abstract translation: 提供密封剂组合物。 密封剂组合物包含（a）包含不饱和单羧酸改性双酚A环氧树脂和不饱和单羧酸改性双酚F环氧树脂的低聚物，其中双酚A环氧树脂与双酚F环氧树脂的当量比 为0.05:0.95至0.3:0.7，双酚A环氧树脂的熔点高于40℃，双酚F环氧树脂的熔点低于40℃。 （b）具有至少两个或多于两个环氧基团的环氧树脂; 和（c）光引发剂。

公开(公告)号：US06632372B1

公开(公告)日：2003-10-14

申请号：US09717081

申请日：2000-11-22

Applicant: Man-Lin Chen ,  Hsien-Kuang Lin ,  Chuang-Shin Chiou ,  Tien-Shou Shieh ,  Pey-Ching Liou

Inventor： Man-Lin Chen ,  Hsien-Kuang Lin ,  Chuang-Shin Chiou ,  Tien-Shou Shieh ,  Pey-Ching Liou

IPC: H01B1300

CPC classification number: H05K3/0017 ,  H05K3/4602 ,  H05K2203/025 ,  H05K2203/0582

Abstract: The invention discloses a method of forming via-holes in multilayer circuit boards. The process includes forming covering substances in predetermined spots in a multilayer circuit board and thereafter applying an insulating layer upon the circuit board. The predetermined spots are then uncovered and the covering substances are removed to form via-holes.

Abstract translation: 本发明公开了一种在多层电路板中形成通孔的方法。 该方法包括在多层电路板中的预定点形成覆盖物质，然后在电路板上施加绝缘层。 然后将预定的点未被覆盖，并且去除覆盖物质以形成通孔

公开(公告)号：US6119338A

公开(公告)日：2000-09-19

申请号：US44969

申请日：1998-03-19

Applicant: Tsung-Hsiung Wang ,  Man-Lin Chen ,  Chuang-Shin Chiou ,  Ming-Shun Chan ,  Pei-Wen Ding

Inventor： Tsung-Hsiung Wang ,  Man-Lin Chen ,  Chuang-Shin Chiou ,  Ming-Shun Chan ,  Pei-Wen Ding

IPC: H05K3/00 ,  H05K3/04 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H01K3/10

CPC classification number: H05K3/421 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0554 ,  H05K2203/085 ,  H05K3/0035 ,  H05K3/0094 ,  H05K3/045 ,  H05K3/4644 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method for making high-density multilayer printed circuit boards is disclosed. It includes the steps of: (a) forming a pair of first conductive layers on top and bottom sides of a dielectric substrate; (b) forming first via holes through one of the first electrically conductive layers; (c) forming a blind hole through the dielectric substrate using a conformal laser drilling technique and filling the blind hole with an electrically conductive material; (d) forming a circuit pattern from the first electrically conductive layer; (e) forming a first electrically insulating layer on the first electrically conductive layer; (f) forming second via holes through the first electrically insulating layer using a non-conformal laser drilling technique; (g) forming a second electrically conductive layer covering the top surface of the circuit pattern, the first electrically insulating layer, and the side surface of the second via holes by electroplating; (h) forming a second electrically insulating layer on the first electrically conductive layer and filling the second via hole with the same electrically insulating material; (i) removing the second electrically insulating layer and the second electrically conductive layer above the second via hole; (j) forming a third electrically conductive layer on the first electrically insulating layer, wherein the third electrically conductive layer is in contact with the top edges of the second electrically conductive layer remaining on the cylindrical surface of the second via; (k) forming another circuit pattern on the third electrically conductive layer. Steps(e) through (k) can be repeated for more circuit patterns.

Abstract translation: 公开了一种制造高密度多层印刷电路板的方法。 它包括以下步骤：（a）在电介质基片的顶面和底面上形成一对第一导电层; （b）通过所述第一导电层之一形成第一通孔; （c）使用共形激光钻孔技术通过介电基片形成盲孔，并用导电材料填充盲孔; （d）从第一导电层形成电路图案; （e）在第一导电层上形成第一电绝缘层; （f）使用非共形激光钻孔技术通过所述第一电绝缘层形成第二通孔; （g）通过电镀形成覆盖电路图案的顶表面，第一电绝缘层和第二通孔的侧表面的第二导电层; （h）在所述第一导电层上形成第二电绝缘层并用相同的电绝缘材料填充所述第二通孔; （i）在所述第二通孔上方去除所述第二电绝缘层和所述第二导电层; （j）在所述第一电绝缘层上形成第三导电层，其中所述第三导电层与残留在所述第二通孔的圆柱形表面上的所述第二导电层的顶部边缘接触; （k）在第三导电层上形成另一个电路图案。 可以重复步骤（e）至（k）以获得更多的电路图案。

公开(公告)号：US20130084454A1

公开(公告)日：2013-04-04

申请号：US13554138

申请日：2012-07-20

Applicant: Hsien-Kuang Lin ,  Man-Lin Chen ,  Sue-May Chen ,  Jauder Jeng

Inventor： Hsien-Kuang Lin ,  Man-Lin Chen ,  Sue-May Chen ,  Jauder Jeng

IPC: C08L67/04 ,  B32B7/12 ,  C09D11/10 ,  C08K5/1515 ,  C09J167/04

CPC classification number: C08L91/00 ,  C09D11/10 ,  C09J7/20 ,  C09J2491/00 ,  Y10T428/2852

Abstract: A resin composition, a resin and a method for manufacturing the same. The resin composition includes a plant oil derivative, and a multifunctional carboxylic acid, anhydride compound or a copolymer containing anhydride. The multifunctional carboxylic acid, the anhydride compound or the copolymer containing anhydride has an amount of 5-60 parts by weight relative to 100 parts by weight of the plant oil derivative.

Abstract translation: 树脂组合物，树脂及其制造方法。 树脂组合物包括植物油衍生物和多官能羧酸，酸酐化合物或含有酸酐的共聚物。 多官能羧酸，酸酐化合物或含有酸酐的共聚物相对于植物油衍生物100重量份为5-60重量份。

公开(公告)号：US06841266B2

公开(公告)日：2005-01-11

申请号：US10092427

申请日：2002-03-08

Applicant: Man-Lin Chen ,  Hsien-Kuang Lin ,  Pa-Yen Lu ,  Wen-Kuo Weng ,  Chun-Neng Ku

Inventor： Man-Lin Chen ,  Hsien-Kuang Lin ,  Pa-Yen Lu ,  Wen-Kuo Weng ,  Chun-Neng Ku

IPC: H01L27/32 ,  H05B33/00

CPC classification number: H01L27/3246 ,  H01L27/3283 ,  Y10S428/917 ,  Y10T428/24479 ,  Y10T428/2457 ,  Y10T428/26

Abstract: Fabrication device of organic light emitting diode (OLED) includes a Substrate, a transparent conductive layer, an insulating film layer, an organic light-emitting layer, and a conductive layer; when a suitable potential is applied thereto, an organic light-emitting layer emits a visible light, however, it usually occurs breakdown between cathode and anode or bad signal, therefore, the present invention provides a positive insulating film photoresist with an easily inclining obtuse angle, smooth surface, and easily controlled fabrication condition to cover the edge of a transparent electrode (anode) in order to avoid that when the edge of ITO transparent electrode is sharp it causes an organic light-emitting layer film breakdown and results from signal lost or weaken to increase the yields.

Abstract translation: 有机发光二极管（OLED）的制造装置包括基板，透明导电层，绝缘膜层，有机发光层和导电层; 当施加适当的电位时，有机发光层发出可见光，但是通常会发生阴极与阳极之间的破坏或信号不良，因此本发明提供了具有容易倾斜钝角的正绝缘膜光致抗蚀剂 ，光滑的表面，易于控制的制造条件，以覆盖透明电极（阳极）的边缘，以避免当ITO透明电极的边缘是锋利的时，其引起有机发光层膜击穿，并且由于信号丢失或 削弱增加收益率。

公开(公告)号：US20100280143A1

公开(公告)日：2010-11-04

申请号：US12546862

申请日：2009-08-25

Applicant: Jauder Jeng ,  Man-Lin Chen ,  Pei-Ching Liu ,  Tien-Shou Shieh

Inventor： Jauder Jeng ,  Man-Lin Chen ,  Pei-Ching Liu ,  Tien-Shou Shieh

IPC: C08F2/46

CPC classification number: C08G59/186 ,  C08G59/5073 ,  C08K5/07 ,  C08K5/5397 ,  C08L63/10 ,  C08L2666/22 ,  C09J163/10

Abstract: A sealant composition is provided. The sealant composition includes (a) an oligomer including an unsaturated mono-carboxylic acid modified bisphenol A epoxy resin and an unsaturated mono-carboxylic acid modified bisphenol F epoxy resin, wherein an equivalence ratio of the bisphenol A epoxy resin to the bisphenol F epoxy resin is 0.05:0.95 to 0.3:0.7, the bisphenol A epoxy resin has a melting point higher than 40° C. and the bisphenol F epoxy resin has a melting point lower than 40° C.; (b) an epoxy resin having at least two or more than two epoxy groups; and (c) a photoinitiator.

Abstract translation: 提供密封剂组合物。 密封剂组合物包含（a）包含不饱和单羧酸改性双酚A环氧树脂和不饱和单羧酸改性双酚F环氧树脂的低聚物，其中双酚A环氧树脂与双酚F环氧树脂的当量比 为0.05:0.95至0.3:0.7，双酚A环氧树脂的熔点高于40℃，双酚F环氧树脂的熔点低于40℃。 （b）具有至少两个或多于两个环氧基团的环氧树脂; 和（c）光引发剂。

公开(公告)号：US06432613B1

公开(公告)日：2002-08-13

申请号：US09866727

申请日：2001-05-30

Applicant: Man-Lin Chen ,  Jing-Pin Pan ,  Hsien-Kuang Lin ,  Shur-Fen Liu

Inventor： Man-Lin Chen ,  Jing-Pin Pan ,  Hsien-Kuang Lin ,  Shur-Fen Liu

IPC: G03F7028

CPC classification number: G03F7/038

Abstract: The present invention discloses a photo-sensitive composition, used as a solder resist or a photosensitive material for insulation layers in the production of printed circuit boards. The photo-sensitive composition comprises a prepolymer containing carboxylic groups and unsaturated vinyl groups; photoinitiator; unsaturated photo-monomer; and the reaction adduct of bismaleimide derivative, barbituric acid derivative and epoxy compounds. The obtained photosensitive composition exhibits high adhesion towards PI substrates, in addition, it can be developed with alkaline water. The photosensitive composition obtained in the invention is very useful in packaging substrates, such as P-BGA, T-BGA and F-CSP due to its high heat resistance and solder resistance.

Abstract translation: 本发明公开了一种在制造印刷电路板中用作阻焊剂或用于绝缘层的感光材料的光敏组合物。 感光组合物包含含有羧基和不饱和乙烯基的预聚物; 光引发剂 不饱和光单体; 和双马来酰亚胺衍生物，巴比土酸衍生物和环氧化合物的反应加合物。 所得的感光性组合物对PI基材的粘合性高，另外可用碱性水显影。 本发明中得到的感光性组合物由于其高耐热性和耐焊性而在包装基材如P-BGA，T-BGA和F-CSP中非常有用。