公开(公告)号：US20230123416A1

公开(公告)日：2023-04-20

申请号：US18085608

申请日：2022-12-21

Applicant: Microchip Technology Incorporated

Inventor： Stefan Weiers

IPC: H04W52/02 ,  G06F1/26 ,  H02M1/42 ,  G06F3/06

Abstract: A communication device for connection with a power source and a host device is provided. The communication device comprises a device controller and a converter circuit. The device controller is adapted for data communication with the host device and the converter circuit is configured to provide a virtual device ground at least to the device controller, so as to compensate a ground potential difference between the host device and the communication device.

公开(公告)号：US20230121985A1

公开(公告)日：2023-04-20

申请号：US17874407

申请日：2022-07-27

Applicant: Microchip Technology Incorporated

Inventor： Radhakrishna Pani

IPC: G05B19/4155

Abstract: A state machine motor controller (SMMC) interface comprises a plurality of states which defines a unique set of poles/motor phase/phases energized. Digital sensors capture the start of overlap of rotor poles with stator poles. The state change occurs when a rotor pole starts overlapping with a stator pole. The number of states depends on the number of phases and the design of the motor. The SMMC has up to four inputs to accept rotational information from digital sensors and can control motors having up to 16 states. A sequencer is used to keep track of state changes and provides a next state depending on forward/reverse direction setting and braking setting. A counter provides rotational speed based upon the number of clock pulses per time period for a state change. The sequencer checks for a faulty sensor(s) and generates a fault interrupt therefrom.

公开(公告)号：US11632425B2

公开(公告)日：2023-04-18

申请号：US17445523

申请日：2021-08-20

Applicant: Microchip Technology Incorporated

Inventor： Lars Ellegaard

IPC: H04L67/1095 ,  H04L43/0805 ,  H04L43/16 ,  H04L67/62

Abstract: Methods of synchronizing sequence numbers of a number of devices of a network are disclosed. A method may include incrementing, at each of a first device and a second device of a network, a sequence number, wherein the sequence number is indicative of a number of frames generated at the associated device since the timing event. The method may also include inserting, at each of the first device and the second device, the sequence number into an associated frame. Related networks and devices are also disclosed.

公开(公告)号：US20230115296A1

公开(公告)日：2023-04-13

申请号：US17903177

申请日：2022-09-06

Applicant: Microchip Technology Incorporated

Inventor： Ihab Jaser ,  Jack Wynne ,  Kwok Kong ,  Donia Sebastian ,  Xin Guo

IPC: G06F3/06

Abstract: An apparatus and method for scheduling memory requests including receiving a plurality of requests having a type and associating each request of the received plurality of requests with a corresponding target, which is associated with one channel of a plurality of channels. The method assigning a priority to each request, assigning a utilization cost to each request based on the request’s target and request type, and queueing each request of the plurality of requests for scheduling. The method selecting a first request of the received plurality of requests to be scheduled based on its priority, scheduling the first request for processing at a time when the first request utilization cost is less than or equal to a current value of a dynamic utilization counter, and debiting the dynamic utilization counter by the first request utilization cost.

公开(公告)号：US20230099856A1

公开(公告)日：2023-03-30

申请号：US17665749

申请日：2022-02-07

Applicant: Microchip Technology Incorporated

Inventor： Justin Sato ,  Bomy Chen ,  Yaojian Leng ,  Julius Kovats

IPC: H01L23/498 ,  H01L23/50 ,  H01L25/065

Abstract: An integrated circuit package module includes an integrated circuit package device including a contact element, and a bonding system formed on the integrated circuit package device. The bonding system includes a bonding system substrate and a bonding element formed in the bonding system substrate and conductively coupled to the contact element of the integrated circuit package device. The bonding element includes (a) a conduction component conductively connected to the contact element, the conduction component formed from a first metal having a first melting point, and (b) a bonding component formed from a second metal having a second melting point lower than the first melting point of the first metal.

公开(公告)号：US20230092814A1

公开(公告)日：2023-03-23

申请号：US18054100

申请日：2022-11-09

Applicant: Microchip Technology Incorporated

Inventor： Dixon Chen ,  John Junling Zang ,  Yanzi Xu ,  Venkatraman Iyer

IPC: H04W74/08 ,  H04L7/02 ,  H04L69/324 ,  H04L47/62 ,  H04L69/32

Abstract: On or more examples relate, generally, to an apparatus that includes a reconciliation sublayer of a physical layer, a reduced media independent interface (RMII) of the physical layer, and a logic circuit. Such a logic circuit may operate to receive a changed carrier sense signal provided by the reconciliation sublayer, generate a further changed carrier sense signal at least partially responsive to a prediction that the changed carrier sense signal would cause unintended signaling at the RMII, and provide the further changed carrier sense signal to the RMII.

公开(公告)号：US20230081749A1

公开(公告)日：2023-03-16

申请号：US17536597

申请日：2021-11-29

Applicant: Microchip Technology Incorporated

Inventor： Yaojian Leng

IPC: H01L27/01 ,  H01L23/522 ,  H01L21/768

Abstract: An integrated circuit structure including a metal-insulator-metal (MIM) capacitor module and a thin-film resistor (TFR) module is provided. The MIM capacitor module includes a bottom electrode base formed in a lower metal layer, a bottom electrode formed in a dielectric region between the lower metal layer and an upper metal layer, an insulator formed over the bottom electrode, and a top electrode formed in the upper metal layer over the insulator. The bottom electrode includes a cup-shaped bottom electrode component and a bottom electrode fill component formed in an interior opening defined by the cup-shaped bottom electrode component. The TFR module includes a pair of metal heads formed in the dielectric region and a resistor element connected across the pair of metal heads. Each metal head includes a cup-shaped head component and a head fill component formed in an interior opening defined by the cup-shaped head component.

公开(公告)号：US11604539B2

公开(公告)日：2023-03-14

申请号：US17301744

申请日：2021-04-13

Applicant: Microchip Technology Incorporated

Inventor： Torbjoern Loevseth Finnoey ,  Lei Zou

IPC: G06F3/041 ,  G06F3/044

Abstract: A charge compensation circuit is disclosed that provides amplified charge cancellation. A touch controller is disclosed that includes such a charge compensation circuit and may realize improved immunity to baseline capacitance signals that are much larger than a change in capacitance due to proximity of an object. Such a charge compensation circuit may include a capacitor, a driver circuit arranged to apply a pulsed voltage signal to the capacitor, and a current conveyor having a programmable gain and arranged to amplify an initial charge generated by the capacitor in response to the pulsed voltage signal and provide an amplified charge to an output of the charge cancellation circuit.

公开(公告)号：US11600566B2

公开(公告)日：2023-03-07

申请号：US17233311

申请日：2021-04-16

Applicant: Microchip Technology Incorporated

Inventor： Yaojian Leng

IPC: H01L23/525 ,  H01L21/768

Abstract: An electronic fuse (e-fuse) module may be formed in an integrated circuit device. The e-fuse module may include a pair of metal e-fuse terminals (e.g., copper terminals) and an e-fuse element formed directly on the metal e-fuse terminals to define a conductive path between the pair of metal e-fuse terminals through the e-fuse element. The metal e-fuse terminals may be formed in a metal interconnect layer, along with various interconnect elements of the integrated circuit device. The e-fuse element may be formed by depositing and patterning a diffusion barrier layer over the metal e-fuse terminals and interconnect elements formed in the metal interconnect layer. The e-fuse element may be formed from a material that provides a barrier against metal diffusion (e.g., copper diffusion) from each of the metal e-fuse terminals and interconnect elements. For example, the e-fuse element may be formed from titanium tungsten (TiW) or titanium tungsten nitride (TiW2N).

公开(公告)号：US20230055102A1

公开(公告)日：2023-02-23

申请号：US17889760

申请日：2022-08-17

Applicant: Microchip Technology Incorporated

Inventor： Bomy Chen ,  Justin Sato

IPC: H01L23/31 ,  H01L23/552 ,  H01L23/29 ,  H01L21/56 ,  H01L25/065 ,  H01L25/00

Abstract: An electronic device includes an integrated circuit package including a die mounted on a die carrier, a mold structure at least partially encapsulating the mounted die, and a heat transfer chimney formed on the die. The heat transfer chimney extends at least partially through the mold structure to transfer heat away from the die. The heat transfer chimney is formed from a thermally conductive compound including thermally conductive nanoparticles.