Abstract:
A latch mechanism for use with an electronic module, such as an opto-electronic transceiver module. The latch mechanism allows the user to selectively extract the transceiver module from the port by moving an attached bail between a first and second position. Specifically, the bail is connected to, and configured to translate, a pair of sliders that are configured and arranged to engage, and disengage from, corresponding structure of the port. When the bail is in the first position, the sliders releasably engage corresponding structure of the port. When the bail is moved from the first position to a second position, the sliders disengage from the corresponding structure of the port, thereby enabling unhindered extraction of the module from the port.
Abstract:
A latch mechanism for use with an electronic module, such as an opto-electronic transceiver module. The latch mechanism allows the user to selectively extract the transceiver module from the port by moving an attached bail between a first and second position. Specifically, the bail is connected to, and configured to translate, a pair of sliders that are configured and arranged to engage, and disengage from, corresponding structure of the port. When the bail is in the first position, the sliders releasably engage corresponding structure of the port. When the bail is moved from the first position to a second position, the sliders disengage from the corresponding structure of the port, thereby enabling unhindered extraction of the module from the port.
Abstract:
A communications device with integrated case temperature measurement includes a case having at least one thermally conductive wall and a circuit board at least partially disposed within the case. At least one electronic component is mounted on the circuit board and a temperature sensor is mounted on the circuit board. At least one thermally conductive protrusion extends from the wall and is thermally coupled to the temperature sensor.
Abstract:
A communications device with integrated case temperature measurement includes a case having at least one thermally conductive wall and a circuit board at least partially disposed within the case. At least one electronic component is mounted on the circuit board and a temperature sensor is mounted on the circuit board. At least one thermally conductive protrusion extends from the wall and is thermally coupled to the temperature sensor.
Abstract:
An apparatus for increasing the blood perfusion in skin by elevating the temperature, and for providing superior heat sinking to the skin of thermally dissipative devices is disclosed. The increased perfusion gives rise to improved thermal transport properties near the site of elevated temperature which is advantageously used by thermally connecting the dissipative devices to the skin. The heat generated by the thermally dissipative devices can supplement or replace separate heating elements to elevate the skin temperature. Alternatively, thermal isolation of the heated area of the skin from the heat sinks of the dissipative devices can minimize the temperature of the skin in contact with the heat sinks.
Abstract:
An apparatus is disclosed wherein laser radiation illuminates a sample using all reflective optics and wherein in-elastically scattered light from the sample is collected using the identical elements. The apparatus obviates the problem of contaminating the laser radiation with unwanted spectra from transmissive optics while providing very high rejection of the laser radiation with respect to the in-elastically scattered light. In addition, the apparatus can collect and launch light with high numerical aperture and large field of view.
Abstract:
In one example embodiment, a host device includes a front panel, a bezel assembly, a floating PCB, and two host guides. The front panel defines an opening configured to receive a pluggable module in a plugging direction. The bezel assembly defines an opening configured to align with the front panel opening and to receive the pluggable module, the bezel assembly rigidly secured to the front panel. The host guides are rigidly secured to the floating PCB and are configured to guide the pluggable module when it is plugged into the host device. The host guides and bezel assembly operate together to allow the floating PCB to float with respect to the front panel in the plugging direction while remaining substantially aligned with the front panel in directions normal to the plugging direction.
Abstract:
The principles of the present invention provide for a plastic ROSA that has a metallic EMI shroud covering a portion of the plastic ROSA. The combination of the plastic ROSA and the EMI shroud provides the unexpected result of having EMI shielding substantially similar to a metal ROSA.
Abstract:
Integrated optical subassemblies (OSA) such as integrated transmit and receive optical subassemblies that may be implemented with an optical transceiver module that includes a molded body. The integrated OSA includes a mounting surface defined on a vertical portion of the molded body, a wall extending about the mounting surface, at least one optoelectronic device, such as a laser diode or a photodiode mounted on a transimpendence amplifier, positioned on the mounting surface, a plurality of bond pads included on the mounting surface in electrical connection with the at least one optoelectronic device, a plurality of conductive feedthroughs defined through the mounting surface, each feedthrough being in electrical communication with a corresponding one of the bond pads; and an optical fiber port that engages the wall extending about the mounting surface, wherein the optical fiber port is configured for receiving an optical fiber cable.
Abstract:
In one example, a host system includes a PCB, a plurality of rails disposed on the PCB, and a connector disposed on the PCB. The PCB, rails and connector define a slot configured to receive an optoelectronic module. The host system further includes means for removably mounting a modular heatsink to the host system such that the host system directly contacts the optoelectronic module when the optoelectronic module is fully inserted into the slot. The means for removably mounting has a standardized arrangement such that any modular heatsink having a mounting arrangement that is complementary to the standardized arranged can be removably mounted to the host system.