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    FLUIDIC DIE ASSEMBLIES WITH RIGID BENT SUBSTRATES
    71.
    发明申请
    FLUIDIC DIE ASSEMBLIES WITH RIGID BENT SUBSTRATES 有权

    公开(公告)号：US20210323312A1

    公开(公告)日：2021-10-21

    申请号：US17251263

    申请日：2018-11-14

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Chien-Hua Chen ,  Michael W. Cumbie

    IPC: B41J2/175 ,  B41J2/16

    Abstract: In one example in accordance with the present disclosure, a fluidic die assembly is described. The fluidic die assembly includes a rigid substrate having a bend therein. A fluidic die is disposed on the rigid substrate. The fluidic die is to eject fluid from a reservoir fluidly coupled to the fluidic die. The fluidic die includes an array of ejection subassemblies. Each ejection subassembly includes an ejection chamber to hold a volume of fluid, an opening, and a fluid actuator to eject a portion of the volume of fluid through the opening. The fluidic die assembly also includes an electrical interface disposed on the rigid substrate to establish an electrical connection between the fluidic die and a controller. The fluidic die and the electrical interface are disposed on a same surface on opposite sides of the bend.

    FLUIDIC EJECTION DIES WITH ENCLOSED CROSS-CHANNELS
    74.
    发明申请
    FLUIDIC EJECTION DIES WITH ENCLOSED CROSS-CHANNELS 有权

    公开(公告)号：US20210291547A1

    公开(公告)日：2021-09-23

    申请号：US17340570

    申请日：2021-06-07

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Si-Iam Choy ,  Michael W. Cumbie ,  Chien-Hua Chen ,  Jeffrey R. Pollard

    IPC: B41J2/18

    Abstract: In one example in accordance with the present disclosure, a fluidic ejection die is described. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages.

    CARRIERS INCLUDING FLUID EJECTION DIES
    75.
    发明申请
    CARRIERS INCLUDING FLUID EJECTION DIES 有权

    公开(公告)号：US20210252859A1

    公开(公告)日：2021-08-19

    申请号：US17251856

    申请日：2018-09-27

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Michael Cumbie ,  Chien-Hua Chen

    IPC: B41J2/14

    Abstract: Examples include a fluid ejection device comprising a carrier, at least one fluid ejection die, and conductive traces at least partially embedded in the carrier. The carrier has a first portion and a second portion, where an angle of orientation between the first portion and the second portion is nonparallel. The first portion includes an array of openings formed through a top surface of the carrier. The second portion includes at least one die opening through a bottom surface of the carrier. The fluid ejection die is coupled to the second portion of the carrier. Fluid passages formed in a back surface of the fluid ejection die are exposed through the at least one die opening formed through the bottom surface of the carrier. The conductive traces have an array of contact points at first ends of the conductive traces. The array of contact points align with the array of openings of the first portion of the carrier such that the array of contact points are exposed through the array of openings. The conductive traces connect the fluid ejection die and the array of contact points.

    Fluid property sensing with electrodes
    77.
    发明授权
    Fluid property sensing with electrodes 有权

    公开(公告)号：US11009383B2

    公开(公告)日：2021-05-18

    申请号：US16092572

    申请日：2016-04-21

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Michael W. Cumbie ,  Chien-Hua Chen ,  Greg Scott Long

    IPC: G01F23/26 ,  B41J2/195 ,  B41J2/175 ,  G01N27/22 ,  G01N33/32 ,  G01F23/24

    Abstract: In one example in accordance with the present disclosure a fluid property sensing device is described. The fluid property sensing device includes a substrate having a trench formed therein. The trench includes a bottom surface and opposite side surfaces. A first electrode is disposed on a first side surface of the trench and a second electrode is disposed on a second side surface of the trench. The first electrode and second electrode form a capacitor to measure a complex impedance of a fluid that fills a space between the first electrode and the second electrode. This complex impedance indicates a property of the fluid. A fluid level sensing die, having a number of fluid level sensing components disposed thereon, may be attached to the substrate, preferably in such a way that the fluid level sensing die is surrounded by the trench. In this way the surface area of the electrodes provided in the trench can be increased. The number of level sensing components may be thermal sensing components.

    Liquid level sensing
    78.
    发明授权
    Liquid level sensing 有权

    公开(公告)号：US11009382B2

    公开(公告)日：2021-05-18

    申请号：US16092531

    申请日：2016-07-21

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Robert N. K. Browning

    IPC: G01F23/24 ,  B41J2/175

    Abstract: In one example a liquid level sensor is described. The sensor includes a carrier and a liquid level sensing interface disposed on the carrier. The liquid level sensing interface includes a number of liquid level sensing devices disposed on an elongated strip. The number of liquid level sensing devices detect a liquid level in a liquid container. The liquid level sensing interface also includes a number of thermal isolation components formed on the elongated strip to thermally isolate adjacent liquid level sensing devices.

    FLUID PROPERTY SENSOR
    79.
    发明申请
    FLUID PROPERTY SENSOR 有权

    公开(公告)号：US20210129550A1

    公开(公告)日：2021-05-06

    申请号：US16605088

    申请日：2017-10-18

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Chien-Hua Chen ,  Michael W Cumbie ,  Anthony D Studer

    IPC: B41J2/175

    Abstract: In one example, a fluid property sensor includes an electrical circuit assembly (ECA), an elongated circuit (EC), and an external interface. The EC is attached to the ECA and includes multiple point sensors distributed along a length of the EC. The external interface is electrically coupled to a proximal end of the EC. The EC and the external interface are packaged together with an encasement on both sides of the ECA to form the fluid property sensor.

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