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公开(公告)号:US20220203696A1
公开(公告)日:2022-06-30
申请号:US17699050
申请日:2022-03-18
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Si-Iam Choy , Michael W. Cumbie , Chien-Hua Chen
Abstract: A fluid circulation and ejection system may include a microfluidic die, a single orifice fluid ejector having a drive chamber in the microfluidic die and a pressurized fluid source remote from the microfluidic die to create a pressure gradient across the drive chamber to circulate fluid across the drive chamber.
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公开(公告)号:US11326200B2
公开(公告)日:2022-05-10
申请号:US16094360
申请日:2016-07-22
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Michael W. Cumbie , Devin Alexander Mourey , Si-Iam Choy
Abstract: A method of preparing a sample may include depositing an aqueous solution comprising copies of a primer into a layer of hydrophobic liquid on a substrate with a thermal inkjet device. A sample may include: a substrate; a layer of hydrophobic liquid on the substrate, the layer of hydrophobic liquid comprising a plurality of droplets of aqueous solution distributed in the layer, wherein the plurality of droplets contain: primers; a polymerase enzyme; deoxynucleotide triphosphates (dNTPs); and a target sequence for replication; and a cover, the cover contacting and covering the layer of hydrophobic liquid.
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公开(公告)号:US20210291547A1
公开(公告)日:2021-09-23
申请号:US17340570
申请日:2021-06-07
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Si-Iam Choy , Michael W. Cumbie , Chien-Hua Chen , Jeffrey R. Pollard
IPC: B41J2/18
Abstract: In one example in accordance with the present disclosure, a fluidic ejection die is described. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages.
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公开(公告)号:US11654680B2
公开(公告)日:2023-05-23
申请号:US17340570
申请日:2021-06-07
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Si-Iam Choy , Michael W. Cumbie , Chien-Hua Chen , Jeffrey R. Pollard
CPC classification number: B41J2/14145 , B41J2/14032 , B41J2/1603 , B41J2/1623 , B41J2/1628 , B41J2/17503 , B41J2/21 , B41J2202/12
Abstract: In one example in accordance with the present disclosure, a fluidic ejection die is described. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages.
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公开(公告)号:US11155086B2
公开(公告)日:2021-10-26
申请号:US16630020
申请日:2017-07-31
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Si-Iam Choy , Michael W Cumbie , Chien-Hua Chen , Jeffrey R Pollard
Abstract: In one example in accordance with the present disclosure, a fluidic ejection device is described. The device includes a fluidic ejection die embedded in a moldable material. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages. The device also includes the moldable material which includes supply slots to deliver fluid to and from the fluidic ejection die. A carrier substrate of the device supports the fluidic ejection die and moldable material.
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