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    Ink container
    76.
    发明授权
    Ink container 有权

    公开(公告)号：US11292263B2

    公开(公告)日：2022-04-05

    申请号：US16316287

    申请日：2016-09-30

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Boon Bing Ng ,  Michael W. Cumbie ,  Yee Kiat Ng

    IPC: B41J2/175

    Abstract: Aspects relating to an ink container for an image reproduction device are described herein. The ink container includes a body and an electrical connection. The body is formed by molding a polymer material having a metal seed layer. The electrical connection is formed by metallizing a plurality of traces in the metal seed layer. The electrical connection extends from an inside wall of the ink container to an outer wall. A width of the electrical connection on the inside wall of the ink container gradually varies from a bottom of the ink container to a rim.

    Fluid feed hole port dimensions
    77.
    发明授权
    Fluid feed hole port dimensions 有权

    公开(公告)号：US11285731B2

    公开(公告)日：2022-03-29

    申请号：US16764368

    申请日：2019-01-09

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Garrett E. Clark ,  Michael W. Cumbie

    IPC: B41J2/19 ,  B41J2/14

    Abstract: A fluid ejection device may include fluid actuators, ejection chambers adjacent the fluid actuators, nozzles extending from the ejection chambers, and fluid feed holes to supply fluid from a fluid supply passage to the ejection chambers. The fluid feed holes have ports connected to the ejection chambers. The ports are sized to pass bubbles formed by the fluid actuators out of the ejection chambers.

    Chip to chip fluidic interconnect
    78.
    发明授权
    Chip to chip fluidic interconnect 有权

    公开(公告)号：US11278892B2

    公开(公告)日：2022-03-22

    申请号：US16494856

    申请日：2017-04-21

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Michael W. Cumbie ,  Viktor Shkolnikov ,  Chien-Hua Chen

    IPC: B01L3/00 ,  B01L7/00 ,  G01N35/00 ,  G01N35/10

    Abstract: A device may include a substrate, a first fluid processing chip, a second fluid processing chip, a tapered channel, and a fluid actuator. The first fluid processing chip may be disposed on the substrate and may process a micro-volume of fluid. The second fluid processing chip may be disposed on the substrate and co-planar with the first fluid processing chip. The second fluid processing chip may process at least a portion of the micro-volume of fluid. The tapered channel may be disposed between the first and second fluid processing chips to transport the at least the portion of the micro-volume of fluid from the first fluid processing chip to the second fluid processing chip. The fluid actuator may be disposed proximate to the tapered channel and may control movement of the at least the portion of the micro-volume of fluid within the tapered channel.

    Die for a printhead
    79.
    发明授权
    Die for a printhead 有权

    公开(公告)号：US11267243B2

    公开(公告)日：2022-03-08

    申请号：US16766527

    申请日：2019-02-06

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： James Michael Gardner ,  Anthony M. Fuller ,  Michael W. Cumbie

    IPC: B41J2/14 ,  B41J2/16

    Abstract: A die for a printhead is described herein. The die includes fluid feed holes disposed in a line parallel to a longitudinal axis of the die. The fluid feed holes are formed through a substrate of the die. Fluidic actuators are proximate to the fluid feed holes, to eject fluid received from the fluid feed holes. Field-effect transistors are parallel to the fluid feed holes. Each fluidic actuator is powered by an associated field effect transistor. Logic circuitry to actuate the field-effect transistors is disposed on an opposite side of the fluid feed holes from the field-effect transistors. Traces, disposed between the fluid feed holes, electrically couple the logic circuitry to the field-effect transistors. The die has a repeating structure including one fluid feed hole, two fluidic actuators, and two field-effect transistors placed at an interval of two times a dot pitch in a line along the die.

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