公开(公告)号：US20080121529A1

公开(公告)日：2008-05-29

申请号：US11793773

申请日：2005-12-21

申请人： Yasushi Tohma ,  Takayuki Saitoh ,  Tsukuru Suzuki ,  Akira Kodera ,  Yutaka Wada ,  Itsuki Kobata

发明人： Yasushi Tohma ,  Takayuki Saitoh ,  Tsukuru Suzuki ,  Akira Kodera ,  Yutaka Wada ,  Itsuki Kobata

IPC分类号： C25F3/16 ,  C25F7/00

CPC分类号： C25F3/02 ,  C25F7/00 ,  H01L21/32115 ,  H01L21/32125 ,  H01L21/7684

摘要： A flattening method can flatly process a surface of a metal film as an interconnect material over the entire film surface at a sufficiently high processing rate even when the metal film has initial surface irregularities. The flattening method for processing and flattening a surface of a metal film formed on a workpiece and having initial surface irregularities, including: coating only recessed portions of the initial surface irregularities of the metal film with a solid or pasty coating material; and processing the surface of the metal film by electrolytic processing using no abrasive.

摘要翻译： 平坦化方法即使当金属膜具有初始表面不规则性时，可以在足够高的处理速率下将整个膜表面上的金属膜的表面作为互连材料平整处理。 用于加工和平坦化在工件上形成的具有初始表面凹凸的金属膜的表面的平坦化方法，包括：用固体或糊状涂料仅仅涂覆金属膜初始表面凹凸的凹陷部分; 并且通过不使用研磨剂的电解处理来处理金属膜的表面。

公开(公告)号：US20070099426A1

公开(公告)日：2007-05-03

申请号：US11316845

申请日：2005-12-27

申请人： Manabu Tsujimura ,  Akira Fukunaga ,  Yutaka Wada ,  Itsuki Kobata

发明人： Manabu Tsujimura ,  Akira Fukunaga ,  Yutaka Wada ,  Itsuki Kobata

IPC分类号： H01L21/302 ,  H01L21/461

CPC分类号： H01L21/02074 ,  C25F7/00 ,  H01L21/3212 ,  H01L21/32125

摘要： A polishing method polishes a substrate so as to remove an interconnect metal film and a barrier film formed on portions other than interconnect recesses. The method includes performing a first polishing process of polishing a surface of the substrate After performing the first polishing process, the surface of the substrate is cleaned. After cleaning, a second polishing process is performed for further polishing the surface of the substrate. At least one of performing the first polishing process and performing the second polishing process includes performing electrolytic polishing.

摘要翻译： 抛光方法抛光衬底以去除互连金属膜和形成在互连凹槽之外的部分上的阻挡膜。 该方法包括进行抛光基板的表面的第一抛光处理。在进行第一抛光处理之后，清洁基板的表面。 在清洁之后，执行第二抛光工艺以进一步抛光衬底的表面。 执行第一抛光处理并执行第二抛光处理中的至少一个包括进行电解抛光。

公开(公告)号：US07108579B2

公开(公告)日：2006-09-19

申请号：US10485273

申请日：2003-02-20

申请人： Yutaka Wada ,  Tomohiko Akatsuka ,  Tatsuya Sasaki

发明人： Yutaka Wada ,  Tomohiko Akatsuka ,  Tatsuya Sasaki

IPC分类号： B24B49/00 ,  B24B1/00

CPC分类号： B24B53/017 ,  B24B7/228 ,  B24B37/04 ,  B24B37/044 ,  B24B49/12 ,  B24B53/02 ,  C09G1/00 ,  H01L21/31053

摘要： The present invention relates to a polishing method for polishing a workpiece by pressing the workpiece, to be polished, against a fixed abrasive and bringing the workpiece into sliding contact with the fixed abrasive. The polishing method includes a first step of polishing the workpiece while supplying a polishing liquid which contains an anionic surface-active agent and does not contain abrasive particles, and a second step of polishing the workpiece while supplying a polishing liquid which contains a cationic surface-active agent and does not contain abrasive particles.

摘要翻译： 抛光方法技术领域本发明涉及一种用于通过将待磨削的工件压在固定磨料上并使工件与固定磨料滑动接触来抛光工件的抛光方法。 抛光方法包括：在提供含有阴离子表面活性剂并且不含磨料颗粒的抛光液的同时抛光工件的第一步骤;以及第二步骤，在提供包含阳离子表面活性剂的抛光液的同时抛光工件， 活性剂，不含磨料颗粒。

公开(公告)号：US20060105679A1

公开(公告)日：2006-05-18

申请号：US11274112

申请日：2005-11-16

申请人： Kazuto Hirokawa ,  Shunsuke Nakai ,  Shinrou Ohta ,  Yutaka Wada ,  Yoichi Kobayashi

发明人： Kazuto Hirokawa ,  Shunsuke Nakai ,  Shinrou Ohta ,  Yutaka Wada ,  Yoichi Kobayashi

IPC分类号： B24B49/00

CPC分类号： B24B37/205 ,  B24B37/013 ,  B24B49/12 ,  H01L21/30625

摘要： A substrate polishing apparatus is used to polish a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table and a polishing pad mounted on the polishing table for polishing a semiconductor substrate. The polishing pad has a through hole formed therein. The substrate polishing apparatus also has a light emission and reception device for emitting measurement light through the through hole formed in the polishing pad to the semiconductor substrate and receiving reflected light from the semiconductor substrate so as to measure a film on the semiconductor substrate. The light emission and reception device is disposed in the polishing table. The substrate polishing apparatus includes a supply passage for supplying a fluid to a path of the measurement light. The supply passage has an outlet portion detachably mounted on the polishing table. The substrate polishing apparatus also includes a protection cover mounted on the polishing table and fitted into the through hole when the polishing pad is attached to the polishing table.

公开(公告)号：US5367239A

公开(公告)日：1994-11-22

申请号：US866367

申请日：1992-04-10

申请人： Tsuyoshi Matsushita ,  Eiichi Furuya ,  Narumi Kikuchi ,  Katsuya Endo ,  Yutaka Wada

发明人： Tsuyoshi Matsushita ,  Eiichi Furuya ,  Narumi Kikuchi ,  Katsuya Endo ,  Yutaka Wada

IPC分类号： B41J19/18 ,  G05B19/416 ,  G05B19/04

CPC分类号： G05B19/416 ,  G05B2219/35375 ,  G05B2219/43088 ,  G05B2219/43089 ,  G05B2219/43092 ,  G05B2219/45187 ,  Y10S388/904 ,  Y10S400/903

摘要： Disclosed is a method for driving a printer carrier. One power source is connected via a constant current circuit to the carrier motor. Data storing means stores the current command data corresponding to the acceleration, constant speed printing and deceleration of the carrier motor. According to the method, the current command data from the data storing means is latched in synchronism with a clock signal. The latched data is converted to a current reference voltage. The output current of the constant current drive circuit is varied in accordance with the current reference voltage. Changing the current command data as desired makes it possible to adjust freely the torque of the carrier motor for acceleration and deceleration on a constant voltage from one power source.

摘要翻译： 公开了一种驱动打印机托架的方法。 一个电源通过恒流电路连接到载体电机。 数据存储装置存储与载体电动机的加速度，恒速打印和减速相对应的当前指令数据。 根据该方法，来自数据存储装置的当前命令数据与时钟信号同步地锁存。 锁存的数据被转换为当前参考电压。 恒流驱动电路的输出电流根据电流参考电压而变化。 根据需要更改当前的指令数据，可以在一个电源的恒定电压下自由调节载波电机的加速和减速的转矩。