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公开(公告)号：US07214122B2
公开(公告)日：2007-05-08
申请号：US11274112
申请日：2005-11-16
申请人： Kazuto Hirokawa , Shunsuke Nakai , Shinrou Ohta , Yutaka Wada , Yoichi Kobayashi
发明人： Kazuto Hirokawa , Shunsuke Nakai , Shinrou Ohta , Yutaka Wada , Yoichi Kobayashi
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12 , H01L21/30625
摘要： A substrate polishing apparatus is used to polish a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table and a polishing pad mounted on the polishing table for polishing a semiconductor substrate. The polishing pad has a through hole formed therein. The substrate polishing apparatus also has a light emission and reception device for emitting measurement light through the through hole formed in the polishing pad to the semiconductor substrate and receiving reflected light from the semiconductor substrate so as to measure a film on the semiconductor substrate. The light emission and reception device is disposed in the polishing table. The substrate polishing apparatus includes a supply passage for supplying a fluid to a path of the measurement light. The supply passage has an outlet portion detachably mounted on the polishing table. The substrate polishing apparatus also includes a protection cover mounted on the polishing table and fitted into the through hole when the polishing pad is attached to the polishing table.
摘要翻译： 基板抛光装置用于将诸如半导体晶片的基板的表面抛光到平面镜面。 基板研磨装置具有安装在研磨台上的用于研磨半导体基板的研磨台和研磨垫。 抛光垫在其中形成有通孔。 基板研磨装置还具有发光和接收装置，用于通过形成在抛光垫中的通孔将测量光发射到半导体衬底并接收来自半导体衬底的反射光，以测量半导体衬底上的膜。 发光和接收装置设置在抛光台中。 衬底抛光装置包括用于将流体供应到测量光的路径的供给通道。 供给通道具有可拆卸地安装在抛光台上的出口部分。 衬底抛光装置还包括安装在抛光台上并当抛光垫附接到抛光台时装配到通孔中的保护盖。
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公开(公告)号：US07507144B2
公开(公告)日：2009-03-24
申请号：US11727727
申请日：2007-03-28
申请人： Kazuto Hirokawa , Shunsuke Nakai , Shinrou Ohta , Yutaka Wada , Yoichi Kobayashi
发明人： Kazuto Hirokawa , Shunsuke Nakai , Shinrou Ohta , Yutaka Wada , Yoichi Kobayashi
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12 , H01L21/30625
摘要： A substrate polishing apparatus is used to polish a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table and a polishing pad mounted on the polishing table for polishing a semiconductor substrate. The polishing pad has a through hole formed therein. The substrate polishing apparatus also has a light emission and reception device for emitting measurement light through the through hole formed in the polishing pad to the semiconductor substrate and receiving reflected light from the semiconductor substrate so as to measure a film on the semiconductor substrate. The light emission and reception device is disposed in the polishing table. The substrate polishing apparatus includes a supply passage for supplying a fluid to a path of the measurement light. The supply passage has an outlet portion detachably mounted on the polishing table. The substrate polishing apparatus also includes a protection cover mounted on the polishing table and fitted into the through hole when the polishing pad is attached to the polishing table.
摘要翻译： 基板抛光装置用于将诸如半导体晶片的基板的表面抛光到平面镜面。 基板研磨装置具有安装在研磨台上的用于研磨半导体基板的研磨台和研磨垫。 抛光垫在其中形成有通孔。 基板研磨装置还具有发光和接收装置，用于通过形成在抛光垫中的通孔将测量光发射到半导体衬底并接收来自半导体衬底的反射光，以测量半导体衬底上的膜。 发光和接收装置设置在抛光台中。 衬底抛光装置包括用于将流体供应到测量光的路径的供给通道。 供给通道具有可拆卸地安装在抛光台上的出口部分。 衬底抛光装置还包括安装在抛光台上并当抛光垫附接到抛光台时装配到通孔中的保护盖。
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公开(公告)号：US20060105679A1
公开(公告)日：2006-05-18
申请号：US11274112
申请日：2005-11-16
申请人： Kazuto Hirokawa , Shunsuke Nakai , Shinrou Ohta , Yutaka Wada , Yoichi Kobayashi
发明人： Kazuto Hirokawa , Shunsuke Nakai , Shinrou Ohta , Yutaka Wada , Yoichi Kobayashi
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12 , H01L21/30625
摘要： A substrate polishing apparatus is used to polish a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table and a polishing pad mounted on the polishing table for polishing a semiconductor substrate. The polishing pad has a through hole formed therein. The substrate polishing apparatus also has a light emission and reception device for emitting measurement light through the through hole formed in the polishing pad to the semiconductor substrate and receiving reflected light from the semiconductor substrate so as to measure a film on the semiconductor substrate. The light emission and reception device is disposed in the polishing table. The substrate polishing apparatus includes a supply passage for supplying a fluid to a path of the measurement light. The supply passage has an outlet portion detachably mounted on the polishing table. The substrate polishing apparatus also includes a protection cover mounted on the polishing table and fitted into the through hole when the polishing pad is attached to the polishing table.
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公开(公告)号：US20070173177A1
公开(公告)日：2007-07-26
申请号：US11727727
申请日：2007-03-28
申请人： Kazuto Hirokawa , Shunsuke Nakai , Shinrou Ohta , Yutaka Wada , Yoichi Kobayashi
发明人： Kazuto Hirokawa , Shunsuke Nakai , Shinrou Ohta , Yutaka Wada , Yoichi Kobayashi
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12 , H01L21/30625
摘要： A substrate polishing apparatus is used to polish a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table and a polishing pad mounted on the polishing table for polishing a semiconductor substrate. The polishing pad has a through hole formed therein. The substrate polishing apparatus also has a light emission and reception device for emitting measurement light through the through hole formed in the polishing pad to the semiconductor substrate and receiving reflected light from the semiconductor substrate so as to measure a film on the semiconductor substrate. The light emission and reception device is disposed in the polishing table. The substrate polishing apparatus includes a supply passage for supplying a fluid to a path of the measurement light. The supply passage has an outlet portion detachably mounted on the polishing table. The substrate polishing apparatus also includes a protection cover mounted on the polishing table and fitted into the through hole when the polishing pad is attached to the polishing table.
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公开(公告)号：US07547242B2
公开(公告)日：2009-06-16
申请号：US10558257
申请日：2004-05-19
CPC分类号： B24B37/013 , B24B37/205 , B24B49/08 , B24B49/12 , H01L21/30625 , H01L21/31053 , H01L21/3212
摘要： A substrate polishing apparatus polishes a substrate to a flat mirror finish. The substrate polishing apparatus has a polishing table against which a substrate is pressed, a light-emitting and light-receiving device to emit measurement light from the polishing table to the substrate and to receive reflected light from the substrate for measuring a film on the substrate, a fluid supply passage for supplying a measurement fluid, through which the measurement light and the reflected light pass, to a fluid chamber provided at a light-emitting and light-receiving position of the polishing table, and a fluid supply control device for controlling supply of the measurement fluid to the fluid chamber.
摘要翻译： 基板研磨装置将基板抛光成平面镜面。 基板研磨装置具有：被加压基板的研磨台，发光和受光装置，用于将来自研磨台的测量光发射到基板，并接收来自基板的反射光，以测量基板上的膜 用于将测量光和反射光通过的测量流体供应到设置在抛光台的发光和光接收位置处的流体室的流体供给通道和用于控制的流体供应控制装置 将测量流体供应到流体室。
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公开(公告)号：US20070042679A1
公开(公告)日：2007-02-22
申请号：US10558257
申请日：2004-05-19
CPC分类号： B24B37/013 , B24B37/205 , B24B49/08 , B24B49/12 , H01L21/30625 , H01L21/31053 , H01L21/3212
摘要： A substrate polishing apparatus (10) polishes a substrate (20) to a flat mirror finish. The substrate polishing apparatus (10) has a polishing table (12) against which a substrate (20) is pressed, a light-emitting and light-receiving device (24) to emit measurement light from the polishing table (12) to the substrate (20) and to receive reflected light from the substrate (20) for measuring a film on the substrate (20), a fluid supply passage (42) for supplying a measurement fluid, through which the measurement light and the reflected light pass, to a fluid chamber (68) provided at a light-emitting and light-receiving position of the polishing table (12), and a fluid supply control device (56, 58) for controlling supply of the measurement fluid to the fluid chamber (68).
摘要翻译： 基板研磨装置（10）将基板（20）抛光成平面镜面。 基板研磨装置（10）具有：被加压基板（20）的研磨台（12），从研磨台（12）向基板发射测定光的发光和受光装置（24） （20）接收来自基板（20）的反射光，用于测量基板（20）上的薄膜;流体供给通道（42），用于将测量光和反射光通过的测量流体通过， 设置在所述研磨台（12）的发光和受光位置处的流体室（68）和用于控制向所述流体室（68）供给所述测量流体的流体供应控制装置（56,58） 。
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公开(公告)号：US07101257B2
公开(公告)日：2006-09-05
申请号：US10617789
申请日：2003-07-14
CPC分类号： B24B37/12 , B24B37/013 , B24B49/12 , H01L21/30625
摘要： A substrate polishing apparatus polishes a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table against which a substrate is pressed and a light-emitting and light-receiving device to emit measurement light from the polishing table to the substrate and to receive reflected light from the substrate for measuring a film on the substrate. The substrate polishing apparatus also has a fluid supply passage for supplying a fluid for measurement, through which the measurement light and the reflected light pass, to a fluid chamber provided at a light-emitting and light-receiving position of the polishing table, and a fluid supply control device for controlling supply of the fluid for measurement to the fluid chamber.
摘要翻译： 衬底抛光装置将诸如半导体晶片的衬底抛光成平面镜面。 基板研磨装置具有：被加压基板的研磨台和发光和受光装置，用于将来自研磨台的测量光发射到基板，并接收来自基板的反射光，以测量基板上的膜 。 衬底抛光装置还具有用于将测量光和反射光通过的用于测量的流体供给到设置在抛光台的发光和光接收位置处的流体室的流体供给通道，以及 流体供应控制装置，用于控制向流体室供给测量用流体。
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8.发明授权公开(公告)号：US09068814B2
公开(公告)日：2015-06-30
申请号：US12285674
申请日：2008-10-10
申请人： Taro Takahashi , Yoichi Kobayashi , Shinrou Ohta , Akihiko Ogawa
发明人： Taro Takahashi , Yoichi Kobayashi , Shinrou Ohta , Akihiko Ogawa
IPC分类号： G01B7/06
CPC分类号： G01B7/105
摘要： A method monitors a change in thickness of a conductive film brought into sliding contact with a polishing surface of a polishing pad using an eddy current sensor. The output signal of the eddy current sensor includes two signals corresponding to a resistance component and an inductive reactance component of an impedance of an electric circuit including a coil of the eddy current sensor. The method includes acquiring the output signal of the eddy current sensor when the eddy current sensor is facing the conductive film, defining the two signals as coordinates on a coordinate system, repeating the acquiring of the output signal and the defining of the coordinates, determining a center of curvature of an arc specified by at least three sets of coordinates on the coordinate system, determining an angle of inclination of a line connecting the center of curvature and a latest one of the at least three sets of coordinates, and monitoring a change in thickness of the conductive film by monitoring a change in the angle of inclination.
摘要翻译： 一种方法使用涡流传感器监测与抛光垫的抛光表面滑动接触的导电膜的厚度变化。 涡电流传感器的输出信号包括对应于包括涡流传感器的线圈的电路的阻抗的电阻分量和电抗分量的两个信号。 该方法包括当涡流传感器面向导电膜时获取涡流传感器的输出信号，将两个信号定义为坐标系上的坐标，重复获取输出信号和定义坐标，确定 由坐标系上的至少三组坐标指定的圆弧的曲率中心，确定连接曲率中心的直线和最小三个坐标系中的最近一个的线的倾斜角度， 通过监测倾斜角度的变化来确定导电膜的厚度。
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公开(公告)号：US07960188B2
公开(公告)日：2011-06-14
申请号：US12465024
申请日：2009-05-13
申请人： Shinrou Ohta , Mitsuo Tada , Noburu Shimizu , Yoichi Kobayashi , Taro Takahashi , Eisaku Hayashi , Hiromitsu Watanabe , Tatsuya Kohama , Itsuki Kobata
发明人： Shinrou Ohta , Mitsuo Tada , Noburu Shimizu , Yoichi Kobayashi , Taro Takahashi , Eisaku Hayashi , Hiromitsu Watanabe , Tatsuya Kohama , Itsuki Kobata
IPC分类号： H01L21/00 , H01L21/302 , G01R31/26
CPC分类号： H01L22/26 , H01L21/3212 , H01L21/67219 , H01L22/14
摘要： A method for polishing a substrate having a metal film thereon is described. The substrate has metal interconnects formed from part of the metal film. The polishing method includes performing a first polishing process of removing the metal film, after the first polishing process, performing a second polishing process of removing the barrier film, after the second polishing process, performing a third polishing process of polishing the insulating film. During the second polishing process and the third polishing process, a polishing state of the substrate is monitored with an eddy current sensor, and the third polishing process is terminated when an output signal of the eddy current sensor reaches a predetermined threshold.
摘要翻译： 描述了在其上抛光具有金属膜的基板的方法。 基板具有由金属膜的一部分形成的金属互连。 抛光方法包括进行第一抛光处理，在第一抛光处理之后，在第二抛光处理之后进行去除阻挡膜的第二抛光工艺，进行抛光绝缘膜的第三抛光工艺。 在第二抛光工艺和第三抛光工艺期间，用涡流传感器监测衬底的抛光状态，并且当涡流传感器的输出信号达到预定阈值时，第三抛光处理结束。
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公开(公告)号：US20090286332A1
公开(公告)日：2009-11-19
申请号：US12465024
申请日：2009-05-13
申请人： Shinrou OHTA , Mitsuo Tada , Noburu Shimizu , Yoichi Kobayashi , Taro Takahashi , Eisaku Hayashi , Hiromitsu Watanabe , Tatsuya Kohama , Itsuki Kobata
发明人： Shinrou OHTA , Mitsuo Tada , Noburu Shimizu , Yoichi Kobayashi , Taro Takahashi , Eisaku Hayashi , Hiromitsu Watanabe , Tatsuya Kohama , Itsuki Kobata
IPC分类号： H01L21/66
CPC分类号： H01L22/26 , H01L21/3212 , H01L21/67219 , H01L22/14
摘要： A method for polishing a substrate having a metal film thereon is described. The substrate has metal interconnects formed from part of the metal film. The polishing method includes performing a first polishing process of removing the metal film, after the first polishing process, performing a second polishing process of removing the barrier film, after the second polishing process, performing a third polishing process of polishing the insulating film, during the second polishing process and the third polishing process, monitoring a polishing state of the substrate with an eddy current sensor, and terminating the third polishing process when an output signal of the eddy current sensor reaches a predetermined threshold.
摘要翻译： 描述了在其上抛光具有金属膜的基板的方法。 基板具有由金属膜的一部分形成的金属互连。 抛光方法包括：进行第一抛光处理后的第一抛光处理，在第一抛光处理之后，在第二抛光处理之后执行去除阻挡膜的第二抛光工艺，进行抛光绝缘膜的第三抛光处理 第二抛光工艺和第三抛光工艺，用涡流传感器监测衬底的抛光状态，并且当涡流传感器的输出信号达到预定阈值时终止第三抛光处理。
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