Abstract:
According to some embodiments, a conducting layer is formed on a first wafer. An insulating layer is formed on a second wafer. The insulating layer includes a cavity and a conducting area may be formed in the second wafer proximate to the cavity. The side of the conducting layer opposite the first wafer is bonded to the side of the insulating layer opposite the second wafer. At least some of the first wafer is then removed, without removing at least some of the conducting layer, to form a conducting diaphragm that is substantially parallel to the second wafer. In this way, an amount of capacitance between the diaphragm and the conducting area may be measured to determine an amount of pressure being applied to the diaphragm.
Abstract:
A device includes at least one semiconductor switching circuit connected to a power source and a load and at least one breaker switch integrated with the at least one semiconductor switching circuit. The breaker circuit may be connected in series with the at least one semiconductor switching circuit and the at least one breaker switch is configured to create an open circuit in less than about twenty microseconds of receipt of a predetermined threshold of semiconductor switch current to thereby prevent damage to the at least one semiconductor switching circuit or housing. A method of preventing damage to a semiconductor switching circuit or device is also presented.
Abstract:
A MEMS switch includes a substrate, a movable actuator coupled to the substrate, a substrate contact, a substrate electrode, and a conductive stopper electrically coupled to the movable actuator and structured to prevent the movable actuator from contacting the substrate electrode while allowing the movable actuator to make contact with the substrate contact.
Abstract:
A programmable logic controller is disclosed. The programmable logic controller includes control circuitry integrally arranged with a current path and at least one micro electromechanical system (MEMS) switch disposed in the current path. The programmable logic controller further includes a hybrid arcless limiting technology (HALT) circuit connected in parallel with the at least one MEMS switch facilitating the opening of the at least one MEMS switch. The programmable logic controller also may include a MEMS switch and a voltage sensor for measuring the voltage across the MEMS switch. The MEMS switches are arranged to transmit or receive logic signals.
Abstract:
A current control device is disclosed. The current control device includes control circuitry integrally arranged with a current path and at least one micro electromechanical system (MEMS) switch pair disposed in the current path. The current control device further includes a hybrid arcless limiting technology (HALT) circuit connected in parallel with the at least one MEMS switch pair facilitating the opening of the at least one MEMS switch pair.
Abstract:
HVAC systems implementing micro-electromechanical system based switching devices. Exemplary embodiments include a HVAC system, including a load motor, a main breaker micro electromechanical system (MEMS) switch, and a variable frequency drive (VFD) disposed between and electrically coupled to the load motor and the main breaker MEMS switch.
Abstract:
According to some embodiments, a conducting layer is formed on a first wafer. An insulating layer is formed on a second wafer. The insulating layer includes a cavity and a conducting area may be formed in the second wafer proximate to the cavity. The side of the conducting layer opposite the first wafer is bonded to the side of the insulating layer opposite the second wafer. At least some of the first wafer is then removed, without removing at least some of the conducting layer, to form a conducting diaphragm that is substantially parallel to the second wafer. In this way, an amount of capacitance between the diaphragm and the conducting area may be measured to determine an amount of pressure being applied to the diaphragm.
Abstract:
A sensor, in accordance with aspects of the present technique, is provided. The sensor comprises a membrane formed of gallium nitride. The membrane is disposed on a substrate, which is wet-etched to form a closed cavity. The membrane exhibits both a capacitive response and a piezo-response to an external stimulus. The sensor further includes a circuit for measuring at least one of the capacitive response or the piezo-response. In certain aspects, the sensor may be operable to measure external stimuli, such as, pressure, force and mechanical vibration.
Abstract:
According to some embodiments, an apparatus includes a substrate that defines a plane. The apparatus also includes a first conducting plate that is substantially normal to the substrate and a second conducting plate that is (i) substantially normal to the substrate and (ii) deformable in response to a pressure.
Abstract:
According to some embodiments, an apparatus includes a substrate that defines a plane. The apparatus also includes a first conducting plate that is substantially normal to the substrate and a second conducting plate that is (i) substantially normal to the substrate and (ii) deformable in response to a pressure.