公开(公告)号：US20070265797A1

公开(公告)日：2007-11-15

申请号：US11782760

申请日：2007-07-25

申请人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

发明人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

IPC分类号： G06F15/00

CPC分类号： G01N21/274 ,  G01N21/47 ,  G01N21/4738 ,  G01N21/8806 ,  G01N21/94 ,  G01N21/95 ,  G01N21/956 ,  G01N2021/8854

摘要： An apparatus for inspecting particles and/or pattern defects of an object under inspection. Data processing means obtains information on size of the particles and/or the pattern defects from an intensity of the scattered light detected by the light detecting means by referring to a relationship between an intensity of scattered light from a standard particle and a size of the standard particle, and using a calibration coefficient for compensating for a change in intensity of the light of the illuminating means from a predetermined intensity.

摘要翻译： 一种用于检查被检查物体的颗粒和/或图案缺陷的装置。 数据处理装置通过参考来自标准粒子的散射光的强度与标准尺寸之间的关系，从光检测装置检测到的散射光的强度获得关于颗粒尺寸和/或图案缺陷的信息 并且使用用于从预定强度补偿照明装置的光的强度变化的校准系数。

公开(公告)号：US20070146697A1

公开(公告)日：2007-06-28

申请号：US11681996

申请日：2007-03-05

申请人： Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Shunichi Matsumoto ,  Yukio Kembo ,  Ryouji Matsunaga ,  Keiji Sakai ,  Takanori Ninomiya ,  Tetsuya Watanabe ,  Hisato Nakamura ,  Takahiro Jingu ,  Yoshio Morishige ,  Shuichi Chikamatsu

发明人： Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Shunichi Matsumoto ,  Yukio Kembo ,  Ryouji Matsunaga ,  Keiji Sakai ,  Takanori Ninomiya ,  Tetsuya Watanabe ,  Hisato Nakamura ,  Takahiro Jingu ,  Yoshio Morishige ,  Shuichi Chikamatsu

IPC分类号： G01N21/88

CPC分类号： B82Y15/00 ,  G01N21/94 ,  G01N21/95623 ,  G01N21/95684 ,  G01N2021/8822 ,  G01R31/308 ,  H01J37/00 ,  H01J2237/022 ,  H01J2237/0225 ,  H01L21/67253 ,  H01L21/67288 ,  H01L21/681 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： A defect inspection apparatus includes an illumination optical unit for obliquely illuminating an object with a slit-like shaped laser, a first detection optical unit for detecting a first image formed by light reflected from the object by the illumination of the slit-like shaped laser and reflected in a first direction substantially normal to a surface of the object, a second detection optical unit for detecting a second image formed by light reflected from the object by the illumination of the slit-like shaped laser and reflected in a second direction inclined to the normal direction to the surface of the object, an image signal processing unit which processes a signal outputted from the first detection optical unit and a signal outputted from the second detection optical unit, and an output unit which outputs information processed by the image signal processing unit.

摘要翻译： 缺陷检查装置包括：用狭缝状激光器对物体进行倾斜照明的照明光学单元;第一检测光学单元，用于检测由所述狭缝状激光的照射而从物体反射的光形成的第一图像;以及 反射在基本上垂直于物体的表面的第一方向上;第二检测光学单元，用于检测由通过照射狭缝状激光而从物体反射的光形成的第二图像，并以与第二方向倾斜的第二方向反射 对象物的表面的正常方向，处理从第一检测光学单元输出的信号的图像信号处理单元和从第二检测光学单元输出的信号，以及输出单元，其输出由图像信号处理单元处理的信息 。

公开(公告)号：US20070146696A1

公开(公告)日：2007-06-28

申请号：US11681981

申请日：2007-03-05

申请人： Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Shunichi Matsumoto ,  Yukio Kembo ,  Ryouji Matsunaga ,  Keiji Sakai ,  Takanori Ninomiya ,  Tetsuya Watanabe ,  Hisato Nakamura ,  Takahiro Jingu ,  Yoshio Morishige ,  Shuichi Chikamatsu

发明人： Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Shunichi Matsumoto ,  Yukio Kembo ,  Ryouji Matsunaga ,  Keiji Sakai ,  Takanori Ninomiya ,  Tetsuya Watanabe ,  Hisato Nakamura ,  Takahiro Jingu ,  Yoshio Morishige ,  Shuichi Chikamatsu

IPC分类号： G01N21/88

CPC分类号： B82Y15/00 ,  G01N21/94 ,  G01N21/95623 ,  G01N21/95684 ,  G01N2021/8822 ,  G01R31/308 ,  H01J37/00 ,  H01J2237/022 ,  H01J2237/0225 ,  H01L21/67253 ,  H01L21/67288 ,  H01L21/681 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for detecting defects on a specimen includes mounting a specimen on a table with which is movable, obliquely projecting a laser as a line onto a surface of the specimen, detecting with an image sensor an image of light formed by light reflected from the specimen and passed through a filter which blocks scattered light resulting from repetitive patterns formed on the specimen, processing a signal outputted from the image sensor to extract defects of the specimen, and a displaying information of defects extracted by the signal processor.

摘要翻译： 一种检测试样缺陷的方法，其特征在于，将试样安装在可移动的台面上，将作为线的激光线倾斜投射到试样的表面上，用图像传感器检测由试样反射的光形成的光的图像 通过滤波器，该滤波器阻挡由样本上形成的重复图案产生的散射光，处理从图像传感器输出的信号，提取样本的缺陷，以及由信号处理器提取的缺陷的显示信息。

公开(公告)号：US07115892B2

公开(公告)日：2006-10-03

申请号：US11302847

申请日：2005-12-13

申请人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

发明人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

IPC分类号： G01N21/88

CPC分类号： G01N21/4738 ,  G01N21/8806 ,  G01N21/93 ,  G01N21/94 ,  G01N21/9501 ,  G01N2015/1486 ,  G01N2015/1493

摘要： Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

公开(公告)号：US07098055B2

公开(公告)日：2006-08-29

申请号：US11244078

申请日：2005-10-06

申请人： Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Shunichi Matsumoto ,  Yukio Kembo ,  Ryouji Matsunaga ,  Keiji Sakai ,  Takanori Ninomiya ,  Tetsuya Watanabe ,  Hisato Nakamura ,  Takahiro Jingu ,  Yoshio Morishige ,  Shuichi Chikamatsu

发明人： Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Shunichi Matsumoto ,  Yukio Kembo ,  Ryouji Matsunaga ,  Keiji Sakai ,  Takanori Ninomiya ,  Tetsuya Watanabe ,  Hisato Nakamura ,  Takahiro Jingu ,  Yoshio Morishige ,  Shuichi Chikamatsu

IPC分类号： H01L21/66 ,  G01R31/26

CPC分类号： B82Y15/00 ,  G01N21/94 ,  G01N21/95623 ,  G01N21/95684 ,  G01N2021/8822 ,  G01R31/308 ,  H01J37/00 ,  H01J2237/022 ,  H01J2237/0225 ,  H01L21/67253 ,  H01L21/67288 ,  H01L21/681 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： A defect inspection method includes radiating an illumination slit-shaped beam having lights substantially parallel to a longitudinal direction to a substrate having circuit patterns in a direction inclined at a predetermined gradient relative to the direction of a line normal to the substrate and inclined at a predetermined gradient on a surface with respect to a group of main straight lines of the circuit patterns with its longitudinal direction oriented almost perpendicularly to a direction of a movement of the substrate. Scattered light reflected by a defect such as a foreign particle existing on the illuminated substrate is received and converted into a detection signal by using an image sensor, and defect judging is effected of an extracted a signal indicating a defect such as a foreign particle on the basis of the detection signal output.

公开(公告)号：US06597448B1

公开(公告)日：2003-07-22

申请号：US09644069

申请日：2000-08-23

申请人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Tetsuya Watanabe ,  Hisato Nakamura ,  Takahiro Jingu ,  Yuko Inoue ,  Keiichi Saiki ,  Kenji Watanabe

发明人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Tetsuya Watanabe ,  Hisato Nakamura ,  Takahiro Jingu ,  Yuko Inoue ,  Keiichi Saiki ,  Kenji Watanabe

IPC分类号： G01N2188

CPC分类号： G01N21/898

摘要： A system and method of inspecting a foreign particle or a defect on a sample are provided. Such a method comprises irradiating light to an object to be inspected; detecting reflected light or scattered light from the object to be inspected irradiated with the light; detecting a signal of the foreign particle or the defect from the detected signal; providing information related to a size of the foreign particle or the defect from the signal of the detected foreign particle or the defect; and outputting information on a display screen a distribution of the size of the foreign particle or defect with information indicating a cause of the distribution of the foreign particle or defect.

摘要翻译： 提供了检查样品上的外来颗粒或缺陷的系统和方法。 这种方法包括将光照射到被检测物体上; 检测来自被检查物体的反射光或散射光用光照射; 从检测到的信号中检测外来粒子或缺陷的信号; 从检测到的异物或缺陷的信号提供与异物或缺陷的尺寸有关的信息; 并且在显示屏幕上输出外来粒子或缺陷的大小的分布，其中指示出异物或缺陷的分布原因的信息。

公开(公告)号：US09602780B2

公开(公告)日：2017-03-21

申请号：US13997496

申请日：2011-11-02

申请人： Masaaki Ito ,  Hidetoshi Nishiyama ,  Takahiro Jingu

发明人： Masaaki Ito ,  Hidetoshi Nishiyama ,  Takahiro Jingu

IPC分类号： H04N7/18 ,  G01N21/47 ,  G01N21/956 ,  H01L21/66 ,  G01N21/95

CPC分类号： H04N7/18 ,  G01N21/47 ,  G01N21/9501 ,  G01N21/956 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： In a defect inspecting apparatus, the strength of a fatal defect signal decreases due to miniaturization. Thus, in order to assure a high SN ratio, it is necessary to reduce noises caused by scattered light from a wafer. Roughness of a pattern edge and surface roughness which serve as a scattered-light source are spread over the entire wafer. The present invention has discovered the fact that reduction of an illuminated area is a technique effective for decreasing noises. That is to say, the present invention has discovered the fact that creation of an illuminated area having a spot shape and reduction of the dimension of a spot beam are effective. A plurality of temporally and spatially divided spot beams are radiated to the wafer serving as a sample.

公开(公告)号：US09310190B2

公开(公告)日：2016-04-12

申请号：US14240669

申请日：2012-07-27

申请人： Masaaki Ito ,  Takahiro Jingu ,  Hisashi Hatano

发明人： Masaaki Ito ,  Takahiro Jingu ,  Hisashi Hatano

IPC分类号： G01B11/24 ,  G01N21/55 ,  G01B11/30 ,  G01N21/47 ,  G01N21/95

CPC分类号： G01B11/303 ,  G01B11/24 ,  G01B2210/56 ,  G01N21/4738 ,  G01N21/55 ,  G01N21/9501 ,  G01N2201/12

摘要： In related art, consideration is not given to that a spatial distribution of scattered light changes in various direction such as forward/backward/sideways according to a difference in micro roughness. Particularly, although a step-terrace structure appearing on an epitaxial growth wafer produces anisotropy in the scattered light distribution, consideration is not given to this point in the related art. The invention includes a process in which light is illuminated to a sample surface, plural detection optical systems mutually different in directions of optical axes detect a spatial distribution of scattered light, and a spatial frequency spectrum of the sample surface is calculated.

摘要翻译： 在现有技术中，不考虑散射光的空间分布根据微粗糙度的差异而在各种方向如前后/侧面变化。 特别地，虽然出现在外延生长晶片上的台阶平台结构在散射光分布中产生各向异性，但是在现有技术中没有考虑到这一点。 本发明包括将光照射到样品表面的方法，在光轴方向上彼此不同的多个检测光学系统检测散射光的空间分布，并且计算样品表面的空间频谱。

公开(公告)号：US09007581B2

公开(公告)日：2015-04-14

申请号：US13621121

申请日：2012-09-15

申请人： Izuo Horai ,  Hirokazu Koyabu ,  Yuta Urano ,  Takahiro Jingu

发明人： Izuo Horai ,  Hirokazu Koyabu ,  Yuta Urano ,  Takahiro Jingu

IPC分类号： G01J3/00 ,  G01N21/00 ,  G01N21/95 ,  G01N21/65 ,  G01N21/47 ,  G01N21/88

CPC分类号： G01N21/9501 ,  G01N21/65 ,  G01N21/9505 ,  G01N2021/4711 ,  G01N2021/473 ,  G01N2021/8861 ,  G01N2021/8864

摘要： An inspection method and an inspection device, or apparatus each capable of conducting composition analysis of a defect detected by elastic or stokes scattered light, an inspection surface or defect on the surface of the inspection surface, or a defect on the surface of the inspection object and its internal composition. A surface inspection method for optically detecting elastic or stokes scattering or inelastic or anti-stokes scattered light from inside the surface of the inspection object, for detecting existence of defects of the inspection object and features of the defects, for detecting positions of the detected defects on the surface of the inspection object, classifying and analyzing the detected defects in accordance with their features on the basis of the positions of the defects and the features of the defects or the classification result of the defects.

摘要翻译： 检查方法和检查装置或装置，其能够对由检查表面的弹性或sto kes散射光，检查面或缺陷检测到的缺陷或检​​查对象的表面上的缺陷进行组成分析 及其内在组成。 一种表面检查方法，用于光学检测来自检查对象的表面内的弹性或斯托克斯散射或非弹性或反射散射光，用于检测检查对象的缺陷的存在和缺陷的特征，用于检测检测到的缺陷的位置 在检查对象的表面上，根据缺陷的位置和缺陷的特征或缺陷的分类结果，根据其特征对检测到的缺陷进行分类和分析。

公开(公告)号：US08958076B2

公开(公告)日：2015-02-17

申请号：US13993630

申请日：2011-11-30

申请人： Kazuo Takahashi ,  Takahiro Jingu

发明人： Kazuo Takahashi ,  Takahiro Jingu

IPC分类号： G01B11/30 ,  G01N21/95 ,  G01N21/94 ,  H01L21/66

CPC分类号： G01N21/9501 ,  G01B11/303 ,  G01N21/94 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： Surface states have traditionally been measured with apparatuses such as an atomic force microscope (AFM), and these measurements have been high in resolution but low in speed. In conventional apparatuses for inspecting the foreign matter sticking to a wafer surface, and for inspecting defects present on the wafer surface, the inspection has had a tendency to be restricted in a region of the highest noise level arising from the roughness of the surface, the surface state, and/or crystal orientations, and thereby to reduce detection sensitivity in a region of lower noise levels. In these conventional techniques, signal processing of the light scattered from the object to be inspected has been based only upon the intensity of the light.This invention acquires three-dimensional data by, during such signal processing, adding detection intervals and the frequency of detection, as well as the intensity of light. The invention measures surface roughness of a target object (wafer) by creating region-specific three-dimensional maps from the three-dimensional data, then estimating the surface state of the wafer from analytical results, processing this estimated surface state as physical quantities, and analyzing the data.

摘要翻译： 传统上用诸如原子力显微镜（AFM）的装置测量表面状态，并且这些测量结果分辨率高，而且速度低。 在用于检查粘附于晶片表面的异物和用于检查存在于晶片表面上的缺陷的常规设备中，检查具有在表面粗糙度产生的最高噪声水平的区域中被限制的倾向， 表面状态和/或晶体取向，从而降低噪声水平较低的区域的检测灵敏度。 在这些常规技术中，从被检查物体散射的光的信号处理仅基于光的强度。 本发明在这种信号处理期间通过增加检测间隔和检测频率以及光的强度来获取三维数据。 本发明通过从三维数据中创建区域特定的三维图来测量目标物体（晶片）的表面粗糙度，然后从分析结果估计晶片的表面状态，将该估计的表面状态处理为物理量，以及 分析数据。