摘要:
To provide an optically reconfigurable logic circuit in which a mount area of an optical circuit is reduced as much as possible and a high gate density is realized.In an optically reconfigurable logic circuit 1 provided with a plurality of configuration information input circuits 6 for converting an optical signal including logic circuit configuration information into an electric signal and holding and outputting this electric signal and a logic configuration variable circuit 7 for performing logic configuration on the basis of the logic circuit configuration information, the configuration information input circuits 6 holds the logic circuit configuration information as electric charge with use of a junction capacitance and a floating capacitance of a photoconductive device P. An inter-terminal voltage of the photoconductive device P is converted into binary data by a binary circuit and output as a circuit configuration signal. Then, the logic configuration variable circuit 7 is configured to execute a logic arithmetic processing before the inter-terminal voltage of the photoconductive device P drops to be equal to or lower than a logic threshold of the binary circuit due to a leak current.
摘要:
An image capture apparatus includes a plurality of pixels, each including a plurality of thin film transistors (T1, T2) having different operating resistances and a photo-electric conversion element (C11), a selection unit configured to select at least one of the thin film transistors, and a signal line (S1) on which electric charge generated by the photo-electric conversion elements is output via the thin film transistors selected by the selection unit.
摘要:
A radiation detecting apparatus capable of obtaining good images including decreased noises includes a plurality of pixels, each having a photoelectric conversion element for converting an incident radiation into an electric signal and a a first switch element connected to the photoelectric conversion element and a second switch element being not connected to the conversion element; a first signal line; a second signal line; and a drive line, wherein the first switch element has a first main electrode connected electrically to the first signal line, a second main electrode connected electrically to the photoelectric conversion element, and a gate electrode connected electrically to the drive line, the second switch element has a first main electrode connected to the second signal line and a gate electrode connected electrically to the drive wiring common to the first switch element, and a differential means for outputting a signal corresponding to a difference between outputs from the first and second switch elements.
摘要:
In a radiation detecting apparatus of the invention, plural pixels are arranged, and the pixel has a conversion element converting a radiation into an electric signal and a switching element connected to the conversion element. The conversion element includes a first electrode disposed on a first surface of an insulating substrate, a second electrode disposed on the first electrode, and a semiconductor layer disposed between the first electrode and the second electrode. The first electrode is made of a light-transmitting conductive material which transmits light emitted from a light source, and the first electrode is formed form a light transmitting electroconductive material transmitting light emitted form a light source disposed on a second surface of the insulating substrate opposite to the first surface. The switching element has a light shielding member which prevents incidence of the light from the light source to the switching element.
摘要:
The object of the invention is to realize a light radiation-detecting apparatus including a step of preparing a matrix array including a substrate, an insulating layer arranged on the substrate, a plurality of pixels arranged on the insulating layer, wherein the pixel includes a conversion element converting an incident radiation into an electric signal, and connection electrode arranged at a periphery of the plurality of pixels, fixing a flexible supporting member for covering the plurality of pixels to the matrix array at a side opposite to the substrate, and releasing the substrate from the matrix array.
摘要:
In a solid state image pickup apparatus with a photodetecting device and one or more thin film transistors connected to the photodetecting device formed in one pixel, a part of the photodetecting device is formed over at least a part of the thin film transistor, and the thin film transistor is constructed by a source electrode, a drain electrode, a first gate electrode, and a second gate electrode arranged on the side opposite to the first gate electrode with respect to the source electrode and the drain electrode, and the first gate electrode is connected to the second gate electrode every pixel, thereby, suppressing an adverse effect of the photodetecting device on the TFT, a leakage at turn-off TFT, variation in a threshold voltage of the TFT due to an external electric field, and accurately transferring photo carrier to a signal processing circuit.
摘要:
Sensitivity is freely changeable to another one in correspondence to a photographing mode, and both still image photographing and moving image photographing for example which are largely different from each other in dosage of exposure to radiation and which are also different from each other in required sensitivity are carried out so as to meet that request. A source or drain electrode of a TFT 21 is connected to a signal output circuit 3 through a signal line 14a and an IC 5. A source/drain of a TFT 23 is connected to the signal output circuit 3 through a signal line 14b and the IC 5. Thus, in each pixel 6, any one of the signal lines 14a and 14b is freely selectable when a signal is read out.
摘要:
A solid-state image pickup device according to the present invention has a plurality of photoelectric conversion elements and a plurality of switching elements. The photoelectric conversion element is formed above at least one switching element, and a shielding electrode layer is disposed between the switching elements and the photoelectric conversion elements. Further, a radiation image pickup device according to the present invention has a radiation conversion layer for directly converting radiation into electric charges, and a plurality of switching elements, and has the radiation conversion layer formed above one or more switching elements, and a shielding electrode layer disposed between the switching elements and the radiation conversion layer.
摘要:
This invention is to provide a radiation image sensing apparatus capable of automatically adjusting an incident radiation dose without requiring high-speed driving while suppressing any attenuation of the radiation before detection, and a method of manufacturing the same. To accomplish this, a read TFT (1) is formed on an insulating substrate (11). The semiconductor layer (19) and n+-semiconductor layer (20) of an MIS photoelectric conversion element (2) are formed on a second insulating layer (18) that covers the read TFT (1) to be aligned with source and drain electrodes (16) functioning as lower electrodes. The semiconductor layer (21) of a TFT sensor (3) is formed to be aligned with a gate electrode (17) when viewed from the upper side. The semiconductor layers (19, 21) are formed from the same layer. The upper electrode (22) of the MIS photoelectric conversion element (2) is formed on the n+-semiconductor layer (20). Two ohmic contact layers (23) are formed on the semiconductor layer (21). Source and drain electrodes (24) are formed on the two ohmic contact layers (23), respectively.
摘要:
A semiconductor integrated circuit is fabricated in a substrate having a semiconductor layer and an underlying insulator layer. The fabrication process includes a step of locally oxidizing the semiconductor layer to form a field oxide, during which step the semiconductor layer is protected by a nitride film. The nitride film has both openings to permit local oxidization in the integrated circuit area, and an opening defining an alignment mark adjacent to the circuit area. The alignment mark may be formed either in the semiconductor and insulator layers, or in a part of the nitride film left after the nitride film is removed from the circuit area. In either case, the edge height of the alignment mark is not limited by the thickness of the semiconductor layer. Using the nitride layer to define both the alignment mark and the field oxide reduces the necessary number of fabrication steps.