-
公开(公告)号：US20170279072A1
公开(公告)日：2017-09-28
申请号：US15618476
申请日：2017-06-09
Applicant: Semiconductor Energy Laboratory Co., LTd.
Inventor： Akihiro Chida
CPC classification number: H01L51/5237 , H01L51/003 , H01L51/5246
Abstract: A novel functional panel is provided. The functional panel includes a first substrate, a second substrate, a first layer, a second layer, a sealing portion, and a first adhesive layer. The sealing portion is between the first layer and the second layer. The first adhesive layer is between the first layer and the first substrate. The second substrate is in contact with the second layer. When a surface of the first layer which faces the first substrate is referred to as a first surface and a surface of the second layer which is in contact with the second substrate is referred to as a second surface, the functional panel has a plurality of regions having different distances between the first surface and the second surface.
-
公开(公告)号：US09685627B2
公开(公告)日：2017-06-20
申请号：US14980266
申请日：2015-12-28
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Akihiro Chida
CPC classification number: H01L51/5237 , H01L51/003 , H01L51/5246
Abstract: A novel functional panel is provided. The functional panel includes a first substrate, a second substrate, a first layer, a second layer, a sealing portion, and a first adhesive layer. The sealing portion is between the first layer and the second layer. The first adhesive layer is between the first layer and the first substrate. The second substrate is in contact with the second layer. When a surface of the first layer which faces the first substrate is referred to as a first surface and a surface of the second layer which is in contact with the second substrate is referred to as a second surface, the functional panel has a plurality of regions having different distances between the first surface and the second surface.
-
73.发明授权公开(公告)号：US09577219B2
公开(公告)日：2017-02-21
申请号：US14456174
申请日：2014-08-11
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Shunpei Yamazaki , Kaoru Hatano , Satoshi Seo , Akihiro Chida
CPC classification number: H01L51/5259 , H01L2251/5369
Abstract: A highly reliable light-emitting module including an organic EL element or a light-emitting device using a highly reliable light-emitting module including an organic EL element is provided. Alternatively, a method of manufacturing a highly reliable light-emitting module including an organic EL element, or a method of manufacturing a light-emitting device using a highly reliable light-emitting module including an organic EL element is provided. The light-emitting module has a structure in which a light-emitting element formed over a first substrate and a viscous material layer are sealed in a space between the first substrate and a second substrate which face each other, with a sealing material surrounding the light-emitting element. The viscous material layer is provided between the light-emitting element and the second substrate and includes a non-solid material and a drying agent which reacts with or adsorbs an impurity.
Abstract translation: 提供了一种包括有机EL元件或使用包括有机EL元件的高可靠性发光模块的发光装置的高度可靠的发光模块。 或者，提供一种制造包括有机EL元件的高可靠性发光模块的方法，或者使用包括有机EL元件的高可靠性发光模块的发光装置的制造方法。 发光模块具有这样的结构，其中形成在第一基板和粘性材料层上的发光元件被密封在第一基板和彼此面对的第二基板之间的空间中，围绕光的密封材料 -emitting元素。 粘性材料层设置在发光元件和第二基板之间，并且包括非固体材料和与杂质反应或吸附杂质的干燥剂。
-
74.发明授权Method for manufacturing display device and method for manufacturing electronic device 有权显示装置的制造方法及电子装置的制造方法公开(公告)号：US09515264B2
公开(公告)日：2016-12-06
申请号：US14644749
申请日：2015-03-11
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Tatsuya Sakuishi , Daiki Nakamura , Akihiro Chida , Tomoya Aoyama
CPC classification number: H01L51/0097 , H01L27/3244 , H01L27/3276 , H01L51/003 , H01L51/5012 , H01L51/5203 , H01L2227/326 , Y02E10/549 , Y02P70/521
Abstract: A method for manufacturing a display device is provided. The method includes: forming, between a first substrate and a second substrate, a light-emitting element including an electroluminescence layer and a wiring over which a peeling layer formed by using the material of the electroluminescence layer is provided; and peeling whole of the second substrate from the first substrate so that the peeling layer over the wiring is simultaneously exposed.
Abstract translation: 提供一种制造显示装置的方法。 该方法包括：在第一基板和第二基板之间形成包括电致发光层的发光元件和通过使用电致发光层的材料形成的剥离层的布线; 并且将第二基板的整体从第一基板剥离，使得布线上的剥离层同时暴露。
-
公开(公告)号：US09196813B2
公开(公告)日：2015-11-24
申请号：US14620425
申请日：2015-02-12
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Akihiro Chida
IPC: H01L21/00 , H01L33/62 , H01L51/00 , H01L51/52 , H01L51/56 , H01L27/12 , H01L27/32 , H01L33/20 , H01L33/48
CPC classification number: H01L51/5203 , H01L27/1214 , H01L27/1266 , H01L27/3276 , H01L33/005 , H01L33/20 , H01L33/483 , H01L33/62 , H01L51/0024 , H01L51/003 , H01L51/0097 , H01L51/56 , H01L2224/4847 , H01L2227/323 , H01L2227/326 , H01L2251/5338 , H01L2924/0002 , H01L2924/12044 , H01L2933/0033 , H01L2933/0066 , H01L2924/00
Abstract: A highly reliable light-emitting device and a manufacturing method thereof are provided. A light-emitting element and a terminal electrode are formed over an element formation substrate; a first substrate having an opening is formed over the light-emitting element and the terminal electrode with a bonding layer provided therebetween; an embedded layer is formed in the opening; a transfer substrate is formed over the first substrate and the embedded layer; the element formation substrate is separated; a second substrate is formed under the light-emitting element and the terminal electrode; and the transfer substrate and the embedded layer are removed. In addition, an anisotropic conductive connection layer is formed in the opening, and an electrode is formed over the anisotropic conductive connection layer. The terminal electrode and the electrode are electrically connected to each other through the anisotropic conductive connection layer.
Abstract translation: 提供了一种高可靠性的发光装置及其制造方法。 在元件形成基板上形成发光元件和端子电极; 在发光元件和端子电极之间形成具有开口的第一基板，其间设置有接合层; 在开口中形成嵌入层; 在第一基板和嵌入层上形成转印基板; 元件形成基板被分离; 第二基板形成在发光元件和端子电极下方; 并且移除转印衬底和嵌入层。 此外，在开口中形成各向异性导电连接层，并且在各向异性导电连接层上形成电极。 端子电极和电极通过各向异性导电连接层彼此电连接。
-
Patent Agency Ranking
公开(公告)号：US09065034B2
公开(公告)日：2015-06-23
申请号：US14202828
申请日：2014-03-10
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Akihiro Chida
IPC: H01L33/00 , H01L33/62 , H01L51/52 , H01L27/12 , H01L27/32 , H01L33/20 , H01L33/48 , H01L51/00 , H01L51/56
CPC classification number: H01L51/5203 , H01L27/1214 , H01L27/1266 , H01L27/3276 , H01L33/005 , H01L33/20 , H01L33/483 , H01L33/62 , H01L51/0024 , H01L51/003 , H01L51/0097 , H01L51/56 , H01L2224/4847 , H01L2227/323 , H01L2227/326 , H01L2251/5338 , H01L2924/0002 , H01L2924/12044 , H01L2933/0033 , H01L2933/0066 , H01L2924/00
Abstract: A highly reliable light-emitting device and a manufacturing method thereof are provided. A light-emitting element and a terminal electrode are formed over an element formation substrate; a first substrate having an opening is formed over the light-emitting element and the terminal electrode with a bonding layer provided therebetween; an embedded layer is formed in the opening; a transfer substrate is formed over the first substrate and the embedded layer; the element formation substrate is separated; a second substrate is formed under the light-emitting element and the terminal electrode; and the transfer substrate and the embedded layer are removed. In addition, an anisotropic conductive connection layer is formed in the opening, and an electrode is formed over the anisotropic conductive connection layer. The terminal electrode and the electrode are electrically connected to each other through the anisotropic conductive connection layer.
-
公开(公告)号：US20140273317A1
公开(公告)日：2014-09-18
申请号：US14202810
申请日：2014-03-10
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Akihiro Chida
IPC: H01L33/48
CPC classification number: H01L51/5203 , H01L27/1214 , H01L27/1266 , H01L27/3276 , H01L33/005 , H01L33/20 , H01L33/483 , H01L33/62 , H01L51/0024 , H01L51/003 , H01L51/0097 , H01L51/56 , H01L2224/4847 , H01L2227/323 , H01L2227/326 , H01L2251/5338 , H01L2924/0002 , H01L2924/12044 , H01L2933/0033 , H01L2933/0066 , H01L2924/00
Abstract: A highly reliable light-emitting device and a manufacturing method thereof are provided. A light-emitting element and a terminal electrode are formed over an element formation substrate; a first substrate having an opening is formed over the light-emitting element and the terminal electrode with a bonding layer provided therebetween; an embedded layer is formed in the opening; a transfer substrate is formed over the first substrate and the embedded layer; the element formation substrate is separated; a second substrate is formed under the light-emitting element and the terminal electrode; and the transfer substrate and the embedded layer are removed. In addition, an anisotropic conductive connection layer is formed in the opening, and an electrode is formed over the anisotropic conductive connection layer. The terminal electrode and the electrode are electrically connected to each other through the anisotropic conductive connection layer.
Abstract translation: 提供了一种高可靠性的发光装置及其制造方法。 在元件形成基板上形成发光元件和端子电极; 在发光元件和端子电极之间形成具有开口的第一基板，其间设置有接合层; 在开口中形成嵌入层; 在第一基板和嵌入层上形成转印基板; 元件形成基板被分离; 第二基板形成在发光元件和端子电极下方; 并且移除转印衬底和嵌入层。 此外，在开口中形成各向异性导电连接层，并且在各向异性导电连接层上形成电极。 端子电极和电极通过各向异性导电连接层彼此电连接。
-
公开(公告)号：US20130240855A1
公开(公告)日：2013-09-19
申请号：US13871248
申请日：2013-04-26
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor： Akihiro Chida , Kaoru HANATO , Tomoya AOYAMA , Ryu KOMATSU , Masatoshi KATANIWA
CPC classification number: H01L51/56 , H01L27/1225 , H01L27/3246 , H01L27/3276 , H01L51/5203 , H01L51/5237 , H01L51/5246 , H01L51/5253 , H01L2227/323 , H01L2227/326 , H01L2251/5338 , H01L2251/5361
Abstract: A method for exposing an electrode terminal covered with an organic film in a light-emitting device without damaging the electrode terminal is provided. In a region of the electrode terminal to which electric power from an external power supply or an external signal is input, an island-shaped organic compound-containing layer is formed and the organic film is formed thereover. The organic film is removed by utilizing low adhesion of an interface between the organic compound-containing layer and the electrode terminal, whereby the electrode terminal can be exposed without damage to the electrode terminal.
Abstract translation: 提供了一种用于在发光器件中暴露覆盖有机膜的电极端子而不损坏电极端子的方法。 在来自外部电源或外部信号的电力的电极端子的区域中，形成有岛状有机化合物的层，并且在其上形成有机膜。 通过利用有机化合物层和电极端子之间的界面的低粘附性去除有机膜，由此电极端子可以暴露而不损坏电极端子。
-
79.发明授权公开(公告)号：US11778850B2
公开(公告)日：2023-10-03
申请号：US17530914
申请日：2021-11-19
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Akihiro Chida
IPC: H10K50/842 , H10K59/38 , H10K59/131 , H10K59/121 , H10K71/00 , H10K77/10 , H10K59/12 , H10K102/00
CPC classification number: H10K50/8426 , H10K59/1213 , H10K59/131 , H10K59/38 , H10K71/00 , H10K77/111 , H10K59/1201 , H10K2102/311 , H10K2102/351 , Y02E10/549 , Y02P70/50
Abstract: A light-emitting element, a bonding layer, and a frame-like partition are formed over a substrate. The partition is provided to surround the bonding layer and the light-emitting element, with a gap left between the partition and the bonding layer. A pair of substrates overlap with each other under a reduced-pressure atmosphere and then exposed to an air atmosphere or a pressurized atmosphere, whereby the reduced-pressure state of a space surrounded by the pair of substrates and the partition is maintained and atmospheric pressure is applied to the pair of substrates. Alternatively, a light-emitting element and a bonding layer are formed over a substrate. A pair of substrates overlap with each other, and then, pressure is applied to the bonding layer with the use of a member having a projection before or at the same time as curing of the bonding layer.
-
公开(公告)号：US11723253B2
公开(公告)日：2023-08-08
申请号：US17225227
申请日：2021-04-08
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Shunpei Yamazaki , Yoshiharu Hirakata , Tomoya Aoyama , Akihiro Chida
IPC: H01L27/12 , H01L27/15 , H01L27/14 , H01L51/00 , H01L51/50 , H01L51/52 , H10K59/40 , H10K50/11 , H10K50/84 , H10K50/844 , H10K59/131 , H10K71/80 , H10K77/10 , G06F3/041 , H04B1/3888 , H04M1/02 , H01L27/146 , H10K59/60 , H10K59/126 , H10K59/12 , H10K102/00
CPC classification number: H10K59/40 , G06F3/0412 , H04B1/3888 , H04M1/0266 , H10K50/11 , H10K50/84 , H10K50/841 , H10K50/844 , H10K59/131 , H10K71/80 , H10K77/111 , G06F2203/04103 , G09G2380/02 , H01L27/14678 , H10K59/1201 , H10K59/126 , H10K59/60 , H10K2102/311 , Y02E10/549
Abstract: A light-emitting device or a display device that is less likely to be broken is provided. Provided is a light-emitting device including an element layer and a substrate over the element layer. At least a part of the substrate is bent to the element layer side. The substrate has a light-transmitting property and a refractive index that is higher than that of the air. The element layer includes a light-emitting element that emits light toward the substrate side. Alternatively, provided is a light-emitting device including an element layer and a substrate covering a top surface and at least one side surface of the element layer. The substrate has a light-transmitting property and a refractive index that is higher than that of the air. The element layer includes a light-emitting element that emits light toward the substrate side.
-
-
-
-
-
-
-
-
-
Search Results
102
records
(took 0.036 seconds)
