摘要:
An enhanced method of writing and reading a memory device, such as an SRAM using negative differential resistance (NDR) elements), is disclosed. This is done through selective control of biasing of the active elements in a memory cell. For example in a write operation, a memory cell is placed in an intermediate state to increase write speed. In an NDR based embodiments, this is done by reducing a bias voltage to NDR FETs so as to weaken the NDR element (and thus disable an NDR effect) during the write operation. Conversely, during a read operation, the bias voltages are increased to enhance peak current (as well as an NDR effect), and thus provide additional current drive to a BIT line. Embodiments using such procedures achieve superior peak to valley current ratios (PVR), read/write speed, etc.
摘要:
A two terminal, silicon based negative differential resistance (NDR) element is disclosed, to effectuate a type of NDR diode for selected applications. The two terminal device is based on a three terminal NDR-capable FET which has a modified channel doping profile, and in which the gate is tied to the drain. This device can be integrated through conventional CMOS processing with other NDR and non-NDR elements, including NDR capable FETs. A memory cell using such NDR two terminal element and an NDR three terminal is also disclosed.
摘要:
A semiconductor device including integrated insulated-gate field-effect transistor (IGFET) elements and one or more negative differential resistance (NDR) field-effect transistor elements, combined and formed on a common substrate. Thus, a variety of circuits, including logic and memory are implemented with a combination of conventional and NDR capable FETs. Because both types of elements share a number of common features, they can be fabricated with common processing operations to achieve better integration in a manufacturing facility.
摘要:
A memory cell using both negative differential resistance (NDR) and conventional FETs is disclosed. A pair of NDR FETs are coupled in a latch configuration so that a data value passed by a transfer FET can be stored at a storage node. By exploiting an NDR characteristic, the memory cell can be implemented with fewer active devices. Moreover, an NDR FET can be manufactured using conventional MOS processing steps so that process integration issues are minimized as compared to conventional NDR techniques.
摘要:
A process for forming/configuring a device to include a negative differential resistance (NDR) characteristic is disclosed. In a FET embodiment, an NDR characteristic is implemented by incorporating a dynamic threshold voltage in such device. An onset point for the NDR characteristic is also adjustable during a manufacturing process to enhance the performance of an NDR device.
摘要:
A process for forming a dual mode FET and a logic circuit to include a negative differential resistance (NDR) characteristic is disclosed. In a FET embodiment, an NDR characteristic is selectively enabled/disabled by forming a body contact bias, thus permitting a dual behavior of the device. Larger collections of such FETs can be synthesized to form dual mode logic circuits as well, so that a single circuit can perform more than one logic operation depending on whether an NDR mode is enabled or not.
摘要:
A semiconductor manufacturing process is disclosed that is suitable for making both negative differential resistance (NDR) and non-NDR devices at the same time. An NDR process is thus integrated within a conventional CMOS process so that compatibility with existing fabrication procedures is maintained. In addition, many of the NDR process steps and non-NDR process steps are shared in common to form features of such devices at the same time.
摘要:
An active negative differential resistance element (an NDR FET) and a memory device (such as an SRAM) using such elements is disclosed. Soft error rate (SER) performance for NDR FETs and such memory devices are enhanced by adjusting a location of charge traps in a charge trapping layer that is responsible for effectuating an NDR behavior. Both an SER and a switching speed performance characteristic can be tailored by suitable placement of the charge traps.
摘要:
In the channel layer of a thin film transistor (TFT), a channel and its drain meet at a transition within a transition region. The channel extends in a first, or horizontal, dimension away from the drain and extends in a second, or vertical, dimension from a side away from the gate to a side toward the gate. The charge carrier densities in the transition region vary in the second dimension in a way that reduces leakage current, because the position of the maximum electric field is moved away from the gate and its magnitude is reduced. Variation of densities in the second dimension can be produced by high angle implantation of a dopant and a counterdopant, providing a transition region between the drain and the channel underneath the gate. Variation of densities in the second dimension can also be produced with non-angled implantation by a process in which a sidewall spacer offsets the drain, providing a transition region that is between the drain and the channel and that can be doped independently of the drain. In a symmetric TFT in which either channel lead can function as a drain, charge carrier densities can vary in the second dimension at the transitions between each channel lead and the channel.