SEMICONDUCTOR PACKAGE ENABLING REDUCTION IN SEMICONDUCTOR PACKAGE SIZE

    公开(公告)号:US20240186266A1

    公开(公告)日:2024-06-06

    申请号:US18165787

    申请日:2023-02-07

    CPC classification number: H01L23/562 H01L23/49816

    Abstract: A semiconductor package includes a substrate, a semiconductor device, and a stiffener. The substrate has a top surface and a bottom surface. The semiconductor device is disposed on the top surface of the substrate. The stiffener is disposed on the bottom surface of the substrate. The stiffener may be disposed on a perimeter portion of the bottom surface of the substrate, and may not be disposed on a central portion of the bottom surface of the substrate. One or more connection components may disposed on the central portion of the bottom surface of the substrate, and a thickness of the stiffener may be greater than or equal to a thickness of the one or more connection components.

    Automatically troubleshooting and remediating network issues via connected neighbors

    公开(公告)号:US12003363B2

    公开(公告)日:2024-06-04

    申请号:US17653608

    申请日:2022-03-04

    CPC classification number: H04L41/0627 H04L41/0631 H04L41/0654 H04L41/12

    Abstract: An example system includes network devices at a site; and a network management system (NMS) that is configured to: identify a first network device of the plurality of network devices with which a network connection has been lost; identify, based on a network topology graph generated from the network data, one or more neighbor network devices of the plurality of network devices that are connected to the first network device; perform root cause analysis of the lost connection with the first network device based on the network data to identify a root cause of the lost connection; and send, to a neighbor network device selected from the one or more neighbor network devices and based on the identified root cause, instructions for the first network device to perform an action to remediate the lost connection, wherein the neighbor network device communicates the instructions to the first network device.

    EFFICIENT UPDATING OF DEVICE-LEVEL SECURITY CONFIGURATION BASED ON CHANGES TO SECURITY INTENT POLICY MODEL

    公开(公告)号:US20240179183A1

    公开(公告)日:2024-05-30

    申请号:US18070948

    申请日:2022-11-29

    CPC classification number: H04L63/20

    Abstract: A system may identify a security intent policy model associated with an initial time. The system may generate one or more delta snapshots that respectively indicate one or more incremental changes to the security intent policy model at times subsequent to the initial time. The system may determine that the system is to deploy an updated version of the security intent policy model to a device and may thereby determine a previous deployment time at which the system deployed a previous version of the security intent policy model to the device. The system may generate, based on the one or more delta snapshots and the previous deployment time, a cumulative delta snapshot, and may thereby update a low-level security intent policy model associated with the device. The system may generate, based on the low-level security intent policy model, device-level security configuration information for the device.

    Self-Correcting Service Level Agreement Enforcer

    公开(公告)号:US20240179076A1

    公开(公告)日:2024-05-30

    申请号:US18472111

    申请日:2023-09-21

    CPC classification number: H04L41/5009 H04L43/0811 H04L43/0888

    Abstract: Example systems, methods, and storage media are described. An example network system includes processing circuitry and one or more memories coupled to the processing circuitry. The one or more memories are configured to store instructions which, when executed by the processing circuitry, cause the network system to obtain telemetry data. The instructions cause the network system to determine, based on the telemetry data, that an application running on server processing circuitry does not meet at least one service level agreement (SLA) requirement, the server processing circuitry not including processing circuitry resident on a network interface card (NIC). The instructions cause the network system to, based on the application not meeting the at least one SLA requirement, determine to offload at least one component of the application from the server processing circuitry to the processing circuitry resident on the NIC.

    USER INTERFACE-BASED DATA CENTER FABRIC DESIGN

    公开(公告)号:US20240175170A1

    公开(公告)日:2024-05-30

    申请号:US18478521

    申请日:2023-09-29

    CPC classification number: D03C19/005

    Abstract: Techniques are described by which a fabric designer system provides a user interface (UI) to enable a user to design a data center fabric. For example, a fabric designer system comprises processor(s) and a memory comprising instructions that when executed by the processor(s) cause the one or more processors to: generate data representative of a user interface (UI) for display on a display device, the data representative of the UI comprising UI elements representing one or more fabric design requirements receive, via the UI on the display device, an indication of a user input selecting one or more of the UI elements representing the one or more fabric design requirements; generate a model for a data center fabric based on the one or more fabric design requirements and a catalog of network devices; and generate UI elements representing fabric design specifications of the model for the data center fabric.

    Power supply assembly with input module and power supply unit

    公开(公告)号:US11994924B2

    公开(公告)日:2024-05-28

    申请号:US17651688

    申请日:2022-02-18

    CPC classification number: G06F1/28

    Abstract: A power supply assembly includes an input module that includes one or more captive screws, one or more first power supply connection components, and one or more first input feed connection components; and a power supply unit that includes one or more captive screw connection switches, one or more second power supply connection components, and one or more second input feed connection components. The input module is to physically and electrically connect to the power supply unit; the one or more captive screws are to physically engage, respectively, the one or more captive screw connection switches; the one or more first power supply connection components are to physically and electrically connect to, respectively, the one or more second power supply connection components; and the one or more first input feed connection components are to physically and electrically connect to, respectively, the one or more second input feed connection components.

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