Method for manufacturing highly-crystallized oxide powder
    71.
    发明授权
    Method for manufacturing highly-crystallized oxide powder 有权
    高结晶度氧化物粉末的制造方法

    公开(公告)号:US07094289B2

    公开(公告)日:2006-08-22

    申请号:US10630394

    申请日:2003-07-30

    IPC分类号: C30B25/06

    摘要: A method for manufacturing a highly-crystallized oxide powder, wherein an oxide powder is produced by ejecting a starting material powder containing at least one metal element and/or semimetal element, which will become a constituent component of the oxide, into a reaction vessel together with a carrier gas through a nozzle; and heating the starting material powder at a temperature higher than the decomposition temperature or reaction temperature thereof and not lower than (Tm/2)° C., where Tm° C. stands for a melting point of the oxide, in a state in which the starting material powder is dispersed in a gas phase at a concentration of not higher than 10 g/L. In the above method, the starting material powder may be mixed and dispersed in the carrier gas by using a dispersing machine prior to being ejected into the reaction vessel through a nozzle. The resultant oxide powder has a high crystallinity, a high dispersibility, and a uniform particle size, without introducing impurities thereinto, by a low-cost and simple production equipment.

    摘要翻译: 一种制造高结晶度氧化物粉末的方法,其中氧化物粉末通过将含有至少一种将成为氧化物的构成成分的金属元素和/或半金属元素的原料粉末喷射到反应容器中而制备 载气通过喷嘴; 在高于分解温度或其反应温度的温度下加热原料粉末,并且不低于(Tm / 2)℃,其中Tm℃代表氧化物的熔点,其中, 原料粉末以不高于10g / L的浓度分散在气相中。 在上述方法中,原料粉末可以在通过喷嘴喷射到反应容器中之前通过使用分散机混合并分散在载气中。 通过低成本且简单的生产设备,所得到的氧化物粉末具有高结晶度,高分散性和均匀的粒度,而不引入杂质。

    Process for preparing metal powder
    72.
    发明授权
    Process for preparing metal powder 失效
    制备金属粉末的方法

    公开(公告)号:US5964918A

    公开(公告)日:1999-10-12

    申请号:US933908

    申请日:1997-09-23

    摘要: A process for preparing a metal powder, comprising the steps of: bringing a solution comprising at least one metal salt to fine droplets; and heating the droplets to a temperature above the decomposition temperature of the metal salt, wherein at least one compound which is heat-decomposable to produce a metal, a semimetal or an oxide of the metal or semimetal capable of remaining unmelted upon heating at the heat temperature is added to the solution and at least one selected from the group consisting of the metal, semimetal and oxide is heat-segregated in the vicinity of the surface of the metal powder. The resultant metal powder has a uniform particle size and good dispersibility without fusing or aggregation and is useful for the preparation of thick film pastes used in electronic circuits or components.

    摘要翻译: 一种制备金属粉末的方法,包括以下步骤:将包含至少一种金属盐的溶液制成细小液滴; 并将液滴加热到高于金属盐的分解温度的温度,其中至少一种可热分解的化合物,以产生金属,半金属或金属或半金属的氧化物,其能够在加热时保持未熔化 将温度加入到溶液中,并且从金属,半金属和氧化物组成的组中选择的至少一种在金属粉末的表面附近被热分离。 所得的金属粉末具有均匀的粒径和良好的分散性,不会熔化或聚集,并且可用于制备用于电子电路或组件的厚膜浆料。

    Nanostructure based display devices

    公开(公告)号:US11886073B2

    公开(公告)日:2024-01-30

    申请号:US17991404

    申请日:2022-11-21

    IPC分类号: G02F1/13357 G02F1/1335

    摘要: Embodiments of a display device are described. A display device includes a backlight unit having a light source and a liquid crystal display (LCD) module. The light source is configured to emit a primary light having a first peak wavelength. The LCD module includes a first sub-pixel having a phosphor film and a second sub-pixel having a non-phosphor film. The phosphor film is configured to receive a first portion of the primary light and to convert the first portion of the primary light to emit a secondary light having a second peak wavelength that is different from the first peak wavelength. The non-phosphor film is configured to receive a second portion of the primary light and to optically modify the second portion of the primary light to emit an optically modified primary light having a third peak wavelength that is different from the first and second peak wavelengths.

    METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

    公开(公告)号:US20230352249A1

    公开(公告)日:2023-11-02

    申请号:US18346515

    申请日:2023-07-03

    发明人: Soichiro ESAKI

    IPC分类号: H01G9/15 H01G9/012 H01G9/042

    CPC分类号: H01G9/15 H01G9/012 H01G9/0425

    摘要: A method for manufacturing an electronic component includes: a preparation step of preparing an electrode-forming body for electronic components; and an electrode forming step of forming an electrode on an outer surface of the electrode-forming body for electronic components, wherein in the electrode forming step, a conductive resin layer is formed on the electrode-forming body for electronic components by using a conductive resin composition containing a silicone resin. According to the present invention, it is possible to provide a method for manufacturing an electronic component having high moisture resistance. Alternatively, it is possible to provide a method for manufacturing an electronic component having reduced restrictions on design and manufacturing and high manufacturing efficiency, in addition to high moisture resistance.

    QUANTUM DOT MATERIAL AND METHOD FOR PRODUCING QUANTUM DOT MATERIAL

    公开(公告)号:US20230265342A1

    公开(公告)日:2023-08-24

    申请号:US18304919

    申请日:2023-04-21

    IPC分类号: C09K11/88 C09K11/02

    摘要: An object of the present invention is to provide a core/shell type quantum dot material capable of increasing the photoluminescence quantum yield and a method of manufacturing the same. The quantum dot material according to one embodiment of the present invention is a quantum dot material comprising a plurality of nanoscopic core-shell structures, each nanoscopic core-shell structure including a nanocrystalline core including phosphorus and indium, a shell disposed on the nanocrystalline core, and a modifier comprising at least one of chlorine and bromine, wherein the content of chlorine and/or bromine is within a range of 2 to 15 mass % of the quantum dot material.

    CONDUCTIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

    公开(公告)号:US20230170105A1

    公开(公告)日:2023-06-01

    申请号:US17922585

    申请日:2021-04-23

    发明人: Soichiro ESAKI

    IPC分类号: H01B1/04 H01G9/048 H01G9/042

    CPC分类号: H01B1/04 H01G9/042 H01G9/048

    摘要: A method for manufacturing an electronic component includes: a preparation step of preparing an electrode-forming body for electronic components; and an electrode forming step of forming an electrode on an outer surface of the electrode-forming body for electronic components, wherein in the electrode forming step, a conductive resin layer is formed on the electrode-forming body for electronic components by using a conductive resin composition containing a metal powder, a resin binder, and an organic solvent, wherein 20.0% by mass or more of the metal powder is a flaky metal powder, and 70.0% by mass or more of the resin binder is a silicone resin. According to the present invention, it is possible to provide a method for manufacturing an electronic component having reduced restrictions on design and manufacturing and high manufacturing efficiency, in addition to high moisture resistance.