公开(公告)号：US12049582B2

公开(公告)日：2024-07-30

申请号：US16847782

申请日：2020-04-14

申请人： Shoei Chemical Inc.

发明人： Yeewah Annie Chow ,  Jason Hartlove ,  Charles Hotz ,  Chunming Wang ,  Wenzhou Guo ,  Ilan Jen-La Plante ,  Jason Travis Tillman ,  John J. Curley ,  Christian Ippen ,  Alexander Tu ,  Ke Gong ,  Minghu Tu

IPC分类号： H10K50/115 ,  C09K11/02 ,  C09K11/08 ,  C09K11/88 ,  G02F1/13357 ,  B82Y20/00 ,  B82Y40/00 ,  F21V8/00 ,  G02F1/1335

CPC分类号： C09K11/883 ,  C09K11/02 ,  C09K11/0883 ,  G02F1/1336 ,  H10K50/115 ,  B82Y20/00 ,  B82Y40/00 ,  G02B6/005 ,  G02F1/133614 ,  G02F2202/36

摘要： This disclosure pertains to the field of nanotechnology. The disclosure provides methods of preparing nanostructures using in situ prepared zinc dioleate and/or a metal halide. The nanostructures have high quantum yield, narrow emission peak width, tunable emission wavelength, and colloidal stability. Also provided are nanostructures prepared using the methods. And, nanostructure films and molded articles comprising the nanostructures are also provided.

公开(公告)号：US20240246144A1

公开(公告)日：2024-07-25

申请号：US18563792

申请日：2022-05-20

申请人： SHOEI CHEMICAL INC.

发明人： Masashi UMEDA ,  Naoki ARIMITSU ,  Michiko USUI ,  Yuji SATO ,  Hayato TATENO

IPC分类号： B22F1/16 ,  B22F1/05 ,  H01F1/20

CPC分类号： B22F1/16 ,  B22F1/05 ,  H01F1/20 ,  B22F2301/35 ,  B22F2302/25 ,  B22F2302/256 ,  B22F2302/45 ,  B22F2304/058 ,  B22F2304/10

摘要： An insulated covered soft magnetic powder in accordance with embodiments of the present invention comprises a soft magnetic powder having an iron content of 99.0 wt. % or more wherein at least part of the surface of the soft magnetic powder is covered with an insulating covering oxide. The insulated covered soft magnetic powder has a 50% volume cumulative particle diameter (D50) by laser diffraction/scattering particle size distribution measurement of 0.01 μm to 2.0 μm, an oxygen content of 0.1 wt. % to 2.0 wt. %, a carbon content and a nitrogen content of the entire insulated covered soft magnetic powder of 0 wt. % to 0.2 wt. %, and 0 wt. % to 0.2 wt. %, respectively. The total content of oxygen, carbon and nitrogen of the insulated covered soft magnetic powder is 0.1 wt. % to 2.0 wt. % of the entire insulated covered soft magnetic powder.

公开(公告)号：US11824146B2

公开(公告)日：2023-11-21

申请号：US17081667

申请日：2020-10-27

申请人： Shoei Chemical Inc.

发明人： Shihai Kan ,  Jay Yamanaga ,  Charles Hotz ,  Jason Hartlove ,  Veeral Hardev ,  Jian Chen ,  Christian Ippen ,  Wenzhou Guo ,  Robert Wilson

IPC分类号： H01L33/56 ,  H01L33/50 ,  C09K11/70 ,  C09K11/88 ,  C09K11/02 ,  B82Y40/00 ,  C09K11/56 ,  H10K50/84 ,  B82Y20/00 ,  B82Y30/00

CPC分类号： H01L33/56 ,  B82Y40/00 ,  C09K11/025 ,  C09K11/565 ,  C09K11/70 ,  C09K11/703 ,  C09K11/883 ,  H01L33/502 ,  H10K50/84 ,  B82Y20/00 ,  B82Y30/00 ,  Y10S977/774 ,  Y10S977/892 ,  Y10S977/95

摘要： Quantum dots and methods of making quantum dots are described. A method begins with forming quantum dots having a core-shell structure with a plurality of ligands on the shell structure. The method includes exchanging the plurality of ligands with a plurality of second ligands. The plurality of second ligands have a weaker binding affinity to the shell structure than the plurality of first ligands. The plurality of second ligands are then exchanged with hydrolyzed alkoxysilane to form a monolayer of hydrolyzed alkoxysilane on a surface of the shell structure. The method includes forming a barrier layer around the shell structure by using the hydrolyzed alkoxysilane as a nucleation center.

公开(公告)号：US20230343481A1

公开(公告)日：2023-10-26

申请号：US18346538

申请日：2023-07-03

申请人： SHOEI CHEMICAL INC.

发明人： Soichiro ESAKI

IPC分类号： H01B1/04 ,  H01G9/042 ,  H01G9/048

CPC分类号： H01B1/04 ,  H01G9/042 ,  H01G9/048

摘要： A method for manufacturing an electronic component includes: a preparation step of preparing an electrode-forming body for electronic components; and an electrode forming step of forming an electrode on an outer surface of the electrode-forming body for electronic components, wherein in the electrode forming step, a conductive resin layer is formed on the electrode-forming body for electronic components by using a conductive resin composition containing a metal powder, a resin binder, and an organic solvent, wherein 20.0% by mass or more of the metal powder is a flaky metal powder, and 70.0% by mass or more of the resin binder is a silicone resin. According to the present invention, it is possible to provide a method for manufacturing an electronic component having reduced restrictions on design and manufacturing and high manufacturing efficiency, in addition to high moisture resistance.

公开(公告)号：US11702368B2

公开(公告)日：2023-07-18

申请号：US17046691

申请日：2019-03-15

申请人： SHOEI CHEMICAL INC.

发明人： Takeshi Nomura ,  Yukari Sasaki

IPC分类号： C04B35/495 ,  H01G4/008 ,  H01G4/12 ,  H01G4/30

CPC分类号： C04B35/495 ,  H01G4/008 ,  H01G4/1254 ,  H01G4/30 ,  C04B2235/3232 ,  C04B2235/3236 ,  C04B2235/3239 ,  C04B2235/3244 ,  C04B2235/3251 ,  C04B2235/3284 ,  C04B2235/442

摘要： A dielectric ceramic composition including a first component and a second component. The first component comprises an oxide of Ca of 0.00 mol % to 35.85 mol % an oxide of Sr of 0.00 mol % to 47.12 mol %, an oxide of Ba of 0.00 mol % to 51.22 mol %, an oxide of Ti of 0.00 mol % to 17.36 mol %, an oxide of Zr of 0.00 mol % to 17.36 mol %, an oxide of Sn of 0.00 mol % to 2.60 mol %, an oxide of Nb of 0.00 mol % to 35.32 mol %, an oxide of Ta of 0.00 mol % to 35.32 mol %, and an oxide of V of 0.00 mol % to 2.65 mol %. The second component includes (by mass) at least (a) an oxide of Mn of 0.005% to 3.500% and (b) one or both of an oxide of Cu of 0.080% to 20.000% and an oxide of Ru of 0.300% to 45.000%.

公开(公告)号：US20230170155A1

公开(公告)日：2023-06-01

申请号：US17922577

申请日：2021-04-23

申请人： SHOEI CHEMICAL INC.

发明人： Soichiro ESAKI

IPC分类号： H01G9/15 ,  H01G9/012 ,  H01G9/042

CPC分类号： H01G9/15 ,  H01G9/012 ,  H01G9/0425

摘要： A method for manufacturing an electronic component includes: a preparation step of preparing an electrode-forming body for electronic components; and an electrode forming step of forming an electrode on an outer surface of the electrode-forming body for electronic components, wherein in the electrode forming step, a conductive resin layer is formed on the electrode-forming body for electronic components by using a conductive resin composition containing a silicone resin. According to the present invention, it is possible to provide a method for manufacturing an electronic component having high moisture resistance. Alternatively, it is possible to provide a method for manufacturing an electronic component having reduced restrictions on design and manufacturing and high manufacturing efficiency, in addition to high moisture resistance.

公开(公告)号：US11505742B2

公开(公告)日：2022-11-22

申请号：US16562296

申请日：2019-09-05

申请人： SHOEI CHEMICAL INC.

发明人： Takafumi Moriyama ,  Hirokazu Sasaki ,  Makoto Kido ,  Keisuke Matsuura ,  Yuko Mitsuka ,  Naoki Sakura

IPC分类号： B32B5/16 ,  C09K11/56 ,  C09K11/88 ,  C09K11/08 ,  B82Y40/00 ,  B82Y20/00

摘要： The purpose of the present invention to provide semiconductor nanoparticles substantially containing no Cd, and which have an increased absorption coefficient to blue light while maintaining high stability. Semiconductor nanoparticles having a core containing at least In and P, and a shell having one or more layers, wherein at least one layer of the shell is ZnSeTe (wherein Te/(Se+Te)=0.03 to 0.50); and the semiconductor nanoparticles cause, when the semiconductor nanoparticles are dispersed in a dispersion medium to yield a dispersion liquid with a concentration of 1 mg/mL in inorganic mass, the dispersion liquid to have an absorbance of 0.9 or higher with respect to light having a wavelength of 450 nm at an optical path length of 1 cm.

公开(公告)号：US11499096B2

公开(公告)日：2022-11-15

申请号：US16958294

申请日：2018-12-19

申请人： SHOEI CHEMICAL INC.

发明人： Takafumi Moriyama ,  Ryosuke Motoyoshi

IPC分类号： C09K11/88 ,  C01B19/00 ,  C09K11/08 ,  C09K11/70 ,  B82Y20/00 ,  B82Y40/00

摘要： An object of the present invention is to provide semiconductor nanoparticles having high quantum efficiency (QY) and a narrow full width at half maximum (FWHM). Semiconductor nanoparticles according to an embodiment of the present invention are semiconductor nanoparticles including at least, In, P, Zn and S, wherein the semiconductor nanoparticles include the components other than In in the following ranges: 0.50 to 0.95 for P, 0.30 to 1.00 for Zn, 0.10 to 0.50 for S, and 0 to 0.30 for halogen, in terms of molar ratio with respect to In.

公开(公告)号：US20220195298A1

公开(公告)日：2022-06-23

申请号：US17593439

申请日：2020-02-27

申请人： SHOEI CHEMICAL INC.

发明人： Takafumi MORIYAMA ,  Hirokazu SASAKI ,  Keisuke MATSUURA

IPC分类号： C09K11/88 ,  H01L51/50 ,  B82Y20/00 ,  G02B5/20 ,  C01B25/08

摘要： Provided are core/shell type semiconductor nanoparticles including: a core including In and P; and a shell having one or more layers. The semiconductor nanoparticles further include at least Zn, Se, and at least one halogen. In the semiconductor nanoparticles, molar ratios of P, Zn, Se, and halogen each relative to In in terms of atoms are P: 0.20˜0.95, Zn: 11.00˜50.00, Se: 7.00˜25.00, and halogen: 0.80˜15.00. According to the present invention, core/shell type semiconductor nanoparticles that include the core including In and P and the shell including Zn and Se as main components, and have high quantum yield, a small full width at half maximum, and small Stokes shift can be provided.

公开(公告)号：US20210155547A1

公开(公告)日：2021-05-27

申请号：US17046698

申请日：2019-03-15

申请人： SHOEI CHEMICAL INC.

发明人： Takeshi NOMURA ,  Yukari SASAKI

IPC分类号： C04B35/057 ,  H01G4/12 ,  H01G4/30

摘要： Provided is a dielectric ceramic composition including a first component and a second component, wherein the first component comprises an oxide of Ca of 0.00 mol % to 35.85 mol % an oxide of Sr of 0.00 mol % to 47.12 mol %, an oxide of Ba of 0.00 mol % to 51.22 mol %, an oxide of Ti of 0.00 mol % to 17.36 mol %, an oxide of Zr of 0.00 mol % to 17.36 mol %, an oxide of Sn of 0.00 mol % to 2.60 mol %, an oxide of Nb of 0.00 mol % to 35.32 mol %, an oxide of Ta of 0.00 mol % to 35.32 mol %, and an oxide of V of 0.00 mol % to 2.65 mol %, and the second component includes at least (a) an oxide of Mn of 0.005% by mass to 3.500% by mass and (b) an oxide of Cu and/or an oxide of Ru.