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公开(公告)号：US20190204132A1
公开(公告)日：2019-07-04
申请号：US16142143
申请日：2018-09-26
发明人： Wonjoon CHOI , Byungseok SEO
CPC分类号： G01F1/6888 , G01F15/022 , H01L35/10 , H01L35/18 , H01L35/32
摘要： The present description includes a flexible sensor including a flexible substrate, a thermoelectric substrate formed on the flexible substrate, a first metal electrode that is formed on the flexible substrate and is connected to one end of the thermoelectric body, and a second metal electrode that is formed on the flexible substrate and is connected to another end of the thermoelectric body but spaced apart from the first metal electrode. The flexible sensor simply measures the temperature and the flow velocity with high accuracy. The change in temperature and flow velocity may be measured in real time. In addition, the flexible sensor may measure the temperature and the flow velocity of a fluid even when attached to a curved surface, and self-development is possible by the measurement.
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公开(公告)号：US20190198741A1
公开(公告)日：2019-06-27
申请号：US16329687
申请日：2017-08-28
申请人： LG INNOTEK CO., LTD.
发明人： YOUNG SAM YOO , WOO CHUL KIM , HYUNG EUI LEE , JONG HYUN KIM , HWAN JOO PARK , YOO MIN EOM , JUN PHIL HWANG
摘要： A thermoelectric device is disclosed. The thermoelectric device comprises: a body part comprising a hollow in which a semiconductor device is disposed; a plurality of connecting parts protruding on the lateral sides of the body part and comprising connecting holes; and a plurality of electrode parts connected to the semiconductor device and extending to the connecting holes of the connecting parts.
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公开(公告)号：US20190198740A1
公开(公告)日：2019-06-27
申请号：US16306551
申请日：2017-03-29
摘要： A thermoelectric module may include a plurality of thermoelectric elements electrically connected via a plurality of conductor bridges. A respective conductor bridge, on at least one of a hot side and a cold side of the thermoelectric module, may contact a duct body through which a fluid is flowable. The duct body may have a plurality of recesses in which, respectively, one of the plurality of conductor bridges is arranged. The plurality of thermoelectric elements may be arranged in a joint thermally insulating filling body. The plurality of conductor bridges may be arranged flush with the filling body. The duct body may have a duct base body and a duct cover closing the duct base body and defining a fluid-tight duct therewith. The duct base body may include a plurality of heat transfer elements protruding into the duct body around which the fluid is flowable.
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公开(公告)号：US20190044042A1
公开(公告)日：2019-02-07
申请号：US15759658
申请日：2016-09-26
摘要： A thermoelectric conversion module in which a plurality of P-type thermoelectric conversion elements and N-type thermoelectric conversion elements, which are combined in pairs, are connected in series between a pair of opposing wiring substrates via the wiring substrates: electrode parts to which the thermoelectric conversion elements are connected, are formed on surfaces of ceramic substrates of the wiring substrates: among the thermoelectric conversion elements, the thermoelectric conversion element having a larger thermal expansion coefficient has the length, in a direction in which the wiring substrates face each other, that is smaller than the length, in a direction in which the wiring substrates face each other, of the thermoelectric conversion element having a smaller thermal expansion coefficient: an electrically conductive spacer is interposed between at least one of the two ends of the thermoelectric conversion element having a larger thermal expansion coefficient and the ceramic substrate of the wiring substrate.
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公开(公告)号：US20180212130A1
公开(公告)日：2018-07-26
申请号：US15933900
申请日：2018-03-23
发明人： Seongjun PARK , Hyeonjin Shin , Sungwng Kim , Eunsung Kim , Jaeyeol Hwang Hwang
CPC分类号： H01L35/16 , H01L21/02488 , H01L21/02502 , H01L35/10 , H01L35/18 , H01L35/34
摘要： A thermoelectric structure that may be included in a thermoelectric device may include a thin-film structure that may include a plurality of thin-film layers. The thin-film structure may include Tellurium. The thin-film structure may be on a substrate. The substrate may include an oxide, and a buffer layer may be between the substrate and the thin-film structure. The thermoelectric structure may be manufactured via depositing material ablated from a target onto the substrate. Some material may react with the substrate to form the buffer layer, and thin film layers may be formed on the buffer layer. The thin film layers may be removed from the substrate and provided on a separate substrate. Removing the thin-film layers from the substrate may include removing the thin-film layers from the buffer layer.
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公开(公告)号：US10003001B2
公开(公告)日：2018-06-19
申请号：US14939415
申请日：2015-11-12
发明人： Byung Wook Kim , Kyong Hwa Song , Jin Woo Kwak , Gyungbok Kim , In Woong Lyo , Han Saem Lee
摘要： A thermoelectric module mounted on a non-flat surface of a heating source component to reduce thermal resistance to enhance thermoelectric generation efficiency is provided. The thermoelectric module includes at least one electrode component having a first electrode plate and a second electrode plate connected to be pivoted with respect to each other. Additionally, least one semiconductor component includes a first semiconductor element electrically connected to the first electrode plate and a second semiconductor element electrically connected to the second electrode plate.
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公开(公告)号：US20180123014A1
公开(公告)日：2018-05-03
申请号：US15566784
申请日：2016-04-22
申请人： Robert Bosch GmbH
发明人： Tobias Zoller , Ricardo Ehrenpfordt , Holger Rank , Frederik Ante
CPC分类号： H01L35/32 , H01L35/06 , H01L35/10 , H01L35/34 , H01L2224/48091 , H05K1/0271 , H05K1/0277 , H05K2201/09063 , H05K2201/10219 , H05K2203/049 , H05K2203/308 , H01L2924/00014
摘要： A thermoelectric device includes a printed circuit board, a component which is arranged on the printed circuit board, a cover which covers the printed circuit board, a thermoelectric generator, and a spring unit. The thermoelectric generator is thermally connected to the printed circuit board or metal paths on the printed circuit board and to the cover in order to generate an electric supply voltage for the component from the temperature difference between the printed circuit board and the cover. The spring unit elastically holds the thermoelectric generator between the printed circuit board and the cover.
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公开(公告)号：US20180040796A1
公开(公告)日：2018-02-08
申请号：US15653672
申请日：2017-07-19
申请人： DENSO CORPORATION
发明人： Daichi MARUI , Masafumi UMENO
CPC分类号： H01L35/32 , H01L21/02576 , H01L21/02579 , H01L35/10 , H01L35/26 , H01L35/30
摘要： An electronic control device includes: a thermoelectric element module that has a plurality of thermoelectric element groups, which are connected in parallel; and a control circuit that supplies a driving power to the thermoelectric element module to perform an operation control of the thermoelectric element module. Additionally, the plurality of thermoelectric element groups respectively have a plurality of thermoelectric elements, which are connected in series. Moreover, each of the plurality of thermoelectric elements is provided with a pair of a p-type semiconductor and an n-type semiconductor. Furthermore, the plurality of thermoelectric element groups have different number of the thermoelectric elements.
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公开(公告)号：US09871179B2
公开(公告)日：2018-01-16
申请号：US14902867
申请日：2014-07-02
申请人： KELK LTD.
摘要： A thermoelectric power module comprising: a thermoelectric element employing a bismuth-tellurium (Bi—Te) based thermoelectric material; at least one barrier layer disposed on the thermoelectric element; an electrode; an electrode protection layer disposed at least on one principal surface of the electrode; a solder layer having a side surface formed with a recess, the solder layer joining a first region of the electrode protection layer to the at least one barrier layer; and a coating film disposed on a side surface of the thermoelectric element, a side surface of the at least one barrier layer, and the side surface of the solder layer, the coating film covering a second region adjacent to the first region of the electrode protection layer and being filled into the recess of the solder layer.
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公开(公告)号：US20170365767A1
公开(公告)日：2017-12-21
申请号：US15628218
申请日：2017-06-20
发明人： Jesse W. Edwards , Devon Newman , Arthur Prejs , Alex R. Guichard , Jason D. Reed , Kevin Shawne Schneider , Brian Williams , Robert J. Therrien
摘要： A thermoelectric device with multiple headers and a method of manufacturing such a device are provided herein. In some embodiments, a thermoelectric device includes multiple thermoelectric legs, a cold header thermally attached to the thermoelectric legs, and a hot header thermally attached to the thermoelectric legs opposite the cold header. At least one of the cold header and the hot header includes at least one score line. According to some embodiments disclosed herein, this the thermal stress on the thermoelectric device can be greatly reduced or relieved by splitting the header into multiple pieces or by scoring the header by a depth X. This enables the use of larger thermoelectric devices and/or thermoelectric devices with an increased lifespan.
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