APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR CARRYING SUBSTRATE
    81.
    发明申请
    APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR CARRYING SUBSTRATE 审中-公开
    用于处理基板的装置和承载基板的方法

    公开(公告)号:US20150101754A1

    公开(公告)日:2015-04-16

    申请号:US14504988

    申请日:2014-10-02

    Applicant: PSK INC.

    Inventor: Seung Kook YANG

    Abstract: Provided is an apparatus for treating a substrate. The apparatus for treating the substrate includes a carrying unit between a second chamber and a loadlock chamber. The carrying unit includes an arm, a blade for supporting the substrate, and a rotation driver for rotating the arm. The carrying unit disposed between the second chamber and the loadlock chamber receives the substrate transferred in the loadlock chamber to transfer the substrate onto a substrate supporter in the second chamber.

    Abstract translation: 提供了一种处理基板的装置。 用于处理基板的装置包括在第二室和装载室之间的承载单元。 承载单元包括臂,支撑基板的叶片和用于旋转臂的旋转驱动器。 设置在第二室和负载锁定室之间的承载单元容纳转移到负载锁定室中的衬底,以将衬底转移到第二室中的衬底支撑件上。

    BAFFLE AND APPARATUS FOR TREATING SURFACE OF BAFFLE, AND SUBSTRATE TREATING APPARATUS
    82.
    发明申请
    BAFFLE AND APPARATUS FOR TREATING SURFACE OF BAFFLE, AND SUBSTRATE TREATING APPARATUS 审中-公开
    用于处理砂浆表面的处理装置和底材处理装置

    公开(公告)号:US20150020974A1

    公开(公告)日:2015-01-22

    申请号:US13946162

    申请日:2013-07-19

    Applicant: PSK INC.

    Inventor: YoungYeon JI

    Abstract: The present invention relates to a substrate treating apparatus, and more particularly, to an apparatus treating a substrate using plasma. In an embodiment, a baffle is formed with holes distributing a process gas excited to a plasma state, and has a surface which is treated with a surface treating material comprising a silicon compound.

    Abstract translation: 本发明涉及一种基板处理装置,更具体地,涉及使用等离子体处理基板的装置。 在一个实施例中,挡板形成有分配被激发到等离子体状态的处理气体的孔,并且具有用包含硅化合物的表面处理材料处理的表面。

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