Coupling structures for electronic device housings

    公开(公告)号:US11223105B2

    公开(公告)日:2022-01-11

    申请号:US16740753

    申请日:2020-01-13

    Applicant: Apple Inc.

    Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.

    Electronic Devices with Dielectric Resonator Antennas

    公开(公告)号:US20210119338A1

    公开(公告)日:2021-04-22

    申请号:US17111131

    申请日:2020-12-03

    Applicant: Apple Inc.

    Abstract: An electronic device may be provided with a phased antenna array and a display cover layer. The phased antenna array may include a dielectric resonator antenna. The dielectric resonator antenna may include a dielectric resonating element embedded in a lower permittivity dielectric substrate. The substrate and the resonating element may be mounted to a flexible printed circuit. A slot may be formed in ground traces on the flexible printed circuit and aligned with the resonating element. The slot may excite resonant modes of the resonating element. The resonating element may convey corresponding radio-frequency signals through the cover layer. A dielectric matching layer may be interposed between the resonating element and the cover layer. If desired, the slot may radiate additional radio-frequency signals and the matching layer may have a tapered shape. Dielectric resonator antennas for covering different polarizations and frequencies may be interleaved across the array.

    COUPLING STRUCTURES FOR ELECTRONIC DEVICE HOUSINGS

    公开(公告)号:US20200153088A1

    公开(公告)日:2020-05-14

    申请号:US16740753

    申请日:2020-01-13

    Applicant: Apple Inc.

    Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.

    Capacitive Sensor Packaging
    88.
    发明申请

    公开(公告)号:US20200110920A1

    公开(公告)日:2020-04-09

    申请号:US16575180

    申请日:2019-09-18

    Applicant: Apple Inc.

    Abstract: An apparatus comprises a fingerprint sensor having a set of capacitive elements configured for capacitively coupling to a user fingerprint. The fingerprint sensor may be disposed under a control button or display element of an electronic device, for example one or more of a control button and a display component. A responsive element is responsive to proximity of the user fingerprint, for example one or both of a first circuit responsive to motion of the control button, and a second circuit responsive to a coupling between the fingerprint and a surface of the display element. The fingerprint sensor is disposed closer to the fingerprint than the responsive element. The control button or display component may include an anisotropic dielectric material, for example sapphire.

    Capacitive sensor packaging
    89.
    发明授权

    公开(公告)号:US10423815B2

    公开(公告)日:2019-09-24

    申请号:US15985562

    申请日:2018-05-21

    Applicant: Apple Inc.

    Abstract: An apparatus comprises a fingerprint sensor having a set of capacitive elements configured for capacitively coupling to a user fingerprint. The fingerprint sensor may be disposed under a control button or display element of an electronic device, for example one or more of a control button and a display component. A responsive element is responsive to proximity of the user fingerprint, for example one or both of a first circuit responsive to motion of the control button, and a second circuit responsive to a coupling between the fingerprint and a surface of the display element. The fingerprint sensor is disposed closer to the fingerprint than the responsive element. The control button or display component may include an anisotropic dielectric material, for example sapphire.

    HOUSING FEATURES OF AN ELECTRONIC DEVICE
    90.
    发明申请

    公开(公告)号:US20190141171A1

    公开(公告)日:2019-05-09

    申请号:US16241914

    申请日:2019-01-07

    Applicant: Apple Inc.

    Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.

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