Adaptive emission clocking control for display devices

    公开(公告)号:US10923015B2

    公开(公告)日:2021-02-16

    申请号:US16335148

    申请日:2017-09-20

    Applicant: Apple Inc.

    Abstract: A display device may include a plurality of pixels that may display image data on a display. The display device may also include a circuit that may receive pixel data including a gray level for at least one pixel of the plurality of pixels. The circuit may then receive an emission clock signal using a clock circuit based on the pixel data, such that the emission clock signal may cause the at least one pixel to receive a current for an amount of time based on the gray level. The circuit may then gate off the clock circuit after the amount of time.

    Electronic Device Display With Array of Discrete Light-Emitting Diodes

    公开(公告)号:US20200348789A1

    公开(公告)日:2020-11-05

    申请号:US16936245

    申请日:2020-07-22

    Applicant: Apple Inc.

    Abstract: An electronic device may include a display. The display may be formed by an array of light-emitting diodes mounted to the surface of a substrate. The substrate may be a silicon substrate. Circuitry may be located in spaces between the light-emitting diodes. Circuitry may also be located on the rear surface of the silicon substrate and may be coupled to the array of light-emitting diodes using through-silicon vias. The circuitry may include integrated circuits and other components that are attached to the substrate and may include transistors and other circuitry formed within the silicon substrate. Touch sensor electrodes, light sensors, and other components may be located in the spaces between the light-emitting diodes. The substrate may be formed from a transparent material that allows image light to reach a lens and image sensor mounted below the substrate.

    Method for measuring display bond resistances

    公开(公告)号:US09952265B2

    公开(公告)日:2018-04-24

    申请号:US14993711

    申请日:2016-01-12

    Applicant: Apple Inc.

    Abstract: A display may have a substrate layer to which a display driver integrated circuit and flexible printed circuit are bonded. The display driver integrated circuit may be provided with switches and control circuitry for controlling the operation of the switches during bond resistance measurements. Test equipment may apply currents to pads in the display driver integrated circuit through contacts in the flexible printed circuit while controlling the switching circuitry. Based on these measurements and the measurement of trace resistances in a dummy flexible printed circuit, the test equipment may determine bond resistances for bonds between the display driver integrated circuit and the display substrate and between the flexible printed circuit and the display substrate. Displays may have master and slave display driver integrated circuits that share coarse reference voltages produced by the master from raw power supply voltages.

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