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81.发明申请公开(公告)号：US20050048688A1
公开(公告)日：2005-03-03
申请号：US10930450
申请日：2004-08-30
Applicant: Satyadev Patel , Andrew Huibers , Steve Chiang
Inventor： Satyadev Patel , Andrew Huibers , Steve Chiang
CPC classification number: B81C1/00333 , B81B2201/042 , B81C2203/0118 , B82Y30/00 , H01L24/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01049 , H01L2924/01054 , H01L2924/01072 , H01L2924/01074 , H01L2924/01079 , H01L2924/01322 , H01L2924/10329 , H01L2924/12036 , H01L2924/12044 , H01L2924/19041 , H01L2924/19042 , H01L2924/3025 , H01L2924/00
Abstract: A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.
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82.发明申请公开(公告)号：US20050042792A1
公开(公告)日：2005-02-24
申请号：US10930342
申请日：2004-08-30
Applicant: Satyadev Patel , Andrew Huibers , Steve Chiang
Inventor： Satyadev Patel , Andrew Huibers , Steve Chiang
CPC classification number: B81C1/00333 , B81B2201/042 , B81C2203/0118 , B82Y30/00 , H01L24/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01049 , H01L2924/01054 , H01L2924/01072 , H01L2924/01074 , H01L2924/01079 , H01L2924/01322 , H01L2924/10329 , H01L2924/12036 , H01L2924/12044 , H01L2924/19041 , H01L2924/19042 , H01L2924/3025 , H01L2924/00
Abstract: A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.
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公开(公告)号：US08693082B2
公开(公告)日：2014-04-08
申请号：US12853411
申请日：2010-08-10
Applicant: Satyadev Patel , Andrew G. Huibers , Peter Richards , Terry Tarn , Dietrich Dehlinger
Inventor： Satyadev Patel , Andrew G. Huibers , Peter Richards , Terry Tarn , Dietrich Dehlinger
CPC classification number: G02B26/0841 , B81C3/001 , Y10S359/90 , Y10T156/10
Abstract: The present invention provides a microstructure device comprising multiple substrates with the components of the device formed on the substrates. In order to maintain uniformity of the gap between the substrates, a plurality of pillars is provided and distributed in the gap so as to prevent decrease of the gap size. The increase of the gap size can be prevented by bonding the pillars to the components of the microstructure. Alternatively, the increase of the gap size can be prevented by maintaining the pressure inside the gap below the pressure under which the microstructure will be in operation. Electrical contact of the substrates on which the micromirrors and electrodes are formed can be made through many ways, such as electrical contact areas, electrical contact pads and electrical contact springs.
Abstract translation: 本发明提供了一种微结构器件，其包括多个衬底，其中器件的部件形成在衬底上。 为了保持基板之间的间隙的均匀性，提供并分布在间隙中的多个支柱以防止间隙尺寸的减小。 可以通过将支柱结合到微结构的部件来防止间隙尺寸的增加。 或者，可以通过将间隙内的压力维持在微结构将在其中操作的压力以下来防止间隙尺寸的增加。 形成微反射镜和电极的基板的电接触可以通过许多方式制成，例如电接触区域，电接触焊盘和电接触弹簧。
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公开(公告)号：US07295363B2
公开(公告)日：2007-11-13
申请号：US11102531
申请日：2005-04-08
Applicant: Satyadev Patel , Peter Heureux , Jonathan Doan , Regis Grasser
Inventor： Satyadev Patel , Peter Heureux , Jonathan Doan , Regis Grasser
IPC: G02B26/00
CPC classification number: G02B26/0841
Abstract: Disclosed herein is method of operating a device that comprises an array of micromirrors. The method comprises a process usable for repairing stuck micromirrors of the micromirror array during the operation. The reparation process applies, at the ON state, two consecutive refresh voltages to the mirror plates of the micromirrors in the array with the pulses being separated in time longer than the characteristic oscillation time of the micromirrors. The reparation process can be applied independently to the micromirrors. Alternatively, the reparation process can be incorporated with a bias inversion process.
Abstract translation: 这里公开的是操作包括微镜阵列的装置的方法。 该方法包括可用于在操作期间修复微镜阵列的粘性微镜的过程。 修复过程在ON状态下，对阵列中的微镜的镜板施加两个连续的刷新电压，其中脉冲在时间上比微镜的特征振荡时间长。 修复过程可独立应用于微镜。 或者，修复过程可以结合偏置反转过程。
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公开(公告)号：US20060266730A1
公开(公告)日：2006-11-30
申请号：US10805610
申请日：2004-03-18
Applicant: Jonathan Doan , Satyadev Patel
Inventor： Jonathan Doan , Satyadev Patel
CPC classification number: B81C1/00793 , B81B2201/042 , B81C2201/053
Abstract: A microstructure and the method for making the same are disclosed herein. The microstructure has structural members, at least one of which comprises an intermetallic compound. In making such a microstructure, a sacrificial material is employed. After completion of forming the structural layers, the sacrificial material is removed by a spontaneous vapor phase chemical etchant.
Abstract translation: 本文公开了微结构及其制造方法。 微结构具有结构构件，其中至少一个包括金属间化合物。 在制造这样的微结构时，采用牺牲材料。 在完成形成结构层之后，牺牲材料通过自发气相化学腐蚀剂除去。
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Patent Agency Ranking
公开(公告)号：US20060193028A1
公开(公告)日：2006-08-31
申请号：US11069317
申请日：2005-02-28
Applicant: Satyadev Patel , James Dunphy , Peter Richards , Michel Combes
Inventor： Satyadev Patel , James Dunphy , Peter Richards , Michel Combes
IPC: G02B26/00
CPC classification number: G02B26/0841
Abstract: Disclosed herein is method of operating a device that comprises an array of micromirrors. The method comprises a process usable for repairing stuck micromirrors of the micromirror array during the operation. The reparation process applies, at the ON state, two consecutive refresh voltages to the mirror plates of the micromirrors in the array with the pulses being separated in time longer than the characteristic oscillation time of the micromirrors. The reparation process can be applied independently to the micromirrors. Alternatively, the reparation process can be incorporated with a bias inversion process.
Abstract translation: 这里公开的是操作包括微镜阵列的装置的方法。 该方法包括可用于在操作期间修复微镜阵列的粘性微镜的过程。 修复过程在ON状态下，对阵列中的微镜的镜板施加两个连续的刷新电压，其中脉冲在时间上比微镜的特征振荡时间长。 修复过程可独立应用于微镜。 或者，修复过程可以结合偏置反转过程。
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87.发明申请公开(公告)号：US20050275931A1
公开(公告)日：2005-12-15
申请号：US11102082
申请日：2005-04-08
Applicant: Satyadev Patel , Peter Richards , Jonathan Doan , Terry Tarn
Inventor： Satyadev Patel , Peter Richards , Jonathan Doan , Terry Tarn
CPC classification number: G02B26/0841 , B81C3/001 , Y10S359/90 , Y10T156/10
Abstract: Disclosed herein a microelectromechanical device having first and second substrates that are bonded together with a gap formed therebetween. A plurality of functional members is disposed within the gap. The two substrates are bonded with a bonding agent that comprises an electrically conductive adhesive material.
Abstract translation: 本文公开了一种具有第一和第二基板的微机电装置，其间形成有间隙结合在一起。 多个功能构件设置在间隙内。 两个基板与包含导电粘合剂材料的粘结剂粘合。
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公开(公告)号：US07113322B2
公开(公告)日：2006-09-26
申请号：US10947005
申请日：2004-09-21
Applicant: Satyadev Patel
Inventor： Satyadev Patel
IPC: G02B26/00
CPC classification number: G02B26/0841
Abstract: The micromirror device of the present invention comprises a reflective deflectable mirror plate and an addressing electrode provided for deflecting the mirror plate, wherein the addressing electrode is displaced along a direction perpendicular to the length of the hinge such that a portion of the addressing electrode is extended beyond the mirror plate.
Abstract translation: 本发明的微反射镜装置包括反射偏转镜板和用于偏转镜板的寻址电极，其中寻址电极沿垂直于铰链长度的方向移位，使得寻址电极的一部分延伸 超越镜面板。
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公开(公告)号：US20050206993A1
公开(公告)日：2005-09-22
申请号：US11135699
申请日：2005-05-24
Applicant: Jonathan Doan , Satyadev Patel , Peter Heureux
Inventor： Jonathan Doan , Satyadev Patel , Peter Heureux
CPC classification number: G02B26/0841 , G02B26/0833
Abstract: To protect the structural layers from being eroded in the etching process, a protection layer is deposited on the exposed structural layers of the micromirror. The protection layer is deposited before etching and removed after etching.
Abstract translation: 为了保护结构层在蚀刻过程中不被腐蚀，保护层沉积在微镜的暴露的结构层上。 在蚀刻之前沉积保护层并在蚀刻后除去。
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公开(公告)号：US07459402B2
公开(公告)日：2008-12-02
申请号：US11135699
申请日：2005-05-24
Applicant: Jonathan Doan , Satyadev Patel , Peter Heureux
Inventor： Jonathan Doan , Satyadev Patel , Peter Heureux
IPC: H01L21/302
CPC classification number: G02B26/0841 , G02B26/0833
Abstract: To protect the structural layers from being eroded in the etching process, a protection layer is deposited on the exposed structural layers of the micromirror. The protection layer is deposited before etching and removed after etching.
Abstract translation: 为了保护结构层在蚀刻过程中不被腐蚀，保护层沉积在微镜的暴露的结构层上。 在蚀刻之前沉积保护层并在蚀刻后除去。
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