摘要:
A method for preventing charging damage during manufacturing of an integrated circuit design, having silicon over insulator (SOI) transistors. The method prevents damage from charging during processing to the gate of IC devices by assigning regions to the IC design such that the devices located within the regions have electrically independent nets, identifying devices that may have a voltage differential between the source or drain, and gate as susceptible devices within a given region, and connecting a element across the respective source or drain, and the gate of each of the susceptible devices such that the element is positioned within the region. The method includes connecting compensating conductors to an element to eliminate potential charging damage.
摘要:
A circuit having a precision passive circuit element, such as a resistor or a capacitor, with a target value of an electrical parameter is fabricated on a substrate with a plurality of independent parallel-connected passive circuit elements. The plurality of passive circuit elements are designed to have a plurality of values of the electrical parameter which are spaced or offset at or around the target value of the electrical parameter, such as three circuit elements with one having a value at the target value, one having a value above the target value, and one having a value below the target value. Each passive circuit element also has a fuse in series therewith. A reference calibration structure is also fabricated, which can be a passive circuit element having the target value of the electrical parameter, in a reference area of the substrate under the same conditions and at the same time as fabrication of the plurality of passive circuit elements. The actual component value of the reference calibration structure is then measured, and based upon the measurement a single precision passive element of the plurality of parallel passive circuit elements is selected by blowing the fuses of, and thus deselecting, the other independent parallel connected passive circuit elements.
摘要:
A semiconductor device and a method of fabricating the semiconductor device, the semiconductor device including: one or more FETs of a first polarity and one or more FETs of a second and opposite polarity, at least one of the one or more FETs of the first polarity having a gate dielectric having a thickness different from a thickness of a gate dielectric of at least one of the one or more FETs of the second polarity.
摘要:
A selectively silicided semiconductor structure and a method for fabricating same is disclosed herein. The semiconductor structure has suicide present on the polysilicon line between the N+ diffusion or N+ active area and the P+ diffusion or active area at the N+/P+ junction of the polysilicon line, and silicide is not present on the N+ active area and the P+ active area. The presence of this selective silicidation creates a beneficial low-resistance connection between the N+ region of the polysilicon line and the P+ region of the polysilicon line. The absence of silicidation on the N+ and P+ active areas, specifically on the PFET and NFET structures, prevents current leakage associated with the silicidation of devices.
摘要:
A method and structure for preventing device leakage. The method and structure includes forming a blocking layer of preferably nitride over a junction between a source/drain region and a shallow trench isolation. A silicide is then formed over a landed area of the source/drain region but is blocked by the blocking layer from forming over the junction between the source/drain region and the shallow trench isolation. This prevents device leakage at this location.
摘要:
The present invention is a complementary active pixel sensor cell and method of making and using the same. The complementary active pixel sensor cell approximately doubles the available signal for a given quanta of light. The device of the present invention utilizes the holes produced by impinging photons in a complementary active pixel sensor cell circuit. Two active pixel sensor cell circuits, an NFET circuit and complementary PFET circuit are created for use with a photodiode. The NFET circuit captures electron current. The PFET circuit captures hole current. The sum of the currents is approximately double that of conventional active pixel sensor circuits using similarly sized photodiode regions.