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81.
公开(公告)号:US20100077609A1
公开(公告)日:2010-04-01
申请号:US12240251
申请日:2008-09-29
申请人: Peter M. GULVIN , Peter J. Nystrom
发明人: Peter M. GULVIN , Peter J. Nystrom
IPC分类号: H05K3/10
CPC分类号: B41J2/14314 , B41J2/1621 , B41J2/1629 , B41J2/1639 , Y10T29/49155
摘要: In accordance with the invention, there are micro-electromechanical devices and methods of fabricating them. An exemplary micro-electromechanical device can include a first dielectric layer; a buried conductive trace disposed over the first dielectric layer, such that the buried conductor trace is electrically connected to an outside power source; a second dielectric layer disposed over the buried conductive trace; at least one conductive electrode disposed over the second dielectric layer and electrically connected to the buried conductive trace; and at least one conductive membrane including membrane anchors disposed over the second dielectric layer, such that the at least one conductive membrane is electrically isolated from the at least one conductive electrode and the buried conductor trace, wherein the at least one conductive electrode is electrically connected to the power source through the buried conductive trace.
摘要翻译: 根据本发明,存在微机电装置及其制造方法。 示例性的微机电装置可以包括第一电介质层; 设置在所述第一介电层上的掩埋导电迹线,使得所述掩埋导体迹线电连接到外部电源; 设置在所述掩埋导电迹线上的第二电介质层; 至少一个导电电极设置在所述第二电介质层上并电连接到所述掩埋的导电迹线; 以及至少一个导电膜,包括设置在所述第二介电层上的膜锚,使得所述至少一个导电膜与所述至少一个导电电极和所述掩埋导体迹线电隔离,其中所述至少一个导电电极电连接 通过埋地导电迹线到电源。
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公开(公告)号:US07585055B2
公开(公告)日:2009-09-08
申请号:US11239389
申请日:2005-09-30
申请人: Peter J. Nystrom , Peter M. Gulvin
发明人: Peter J. Nystrom , Peter M. Gulvin
CPC分类号: B41J2/14 , B41J2/16 , B41J2/1623 , B41J2/1628 , B41J2/1643 , B41J2002/14491 , B41J2202/18 , Y10T29/49401
摘要: A printhead manufacturing method includes providing a first wafer, forming a polymer layer over the first wafer, the polymer layer including at least one via, providing a metal layer over the at least one via, providing a solderable or plateable interface layer over the metal layer and the polymer layer, forming a fluid chamber in the polymer layer, providing a fluid nozzle in the first wafer, providing a second wafer, and joining the second wafer to the first layer to form the printhead. A printhead that includes a first wafer, a polymer layer over the first wafer, the polymer layer including at least one via, a metal layer over the at least one via, an interface layer over the metal layer and the polymer layer, a fluid chamber formed in the polymer layer, and a fluid chamber formed in the first wafer.
摘要翻译: 打印头制造方法包括提供第一晶片,在第一晶片上形成聚合物层,所述聚合物层包括至少一个通孔,在所述至少一个通孔上提供金属层,在所述金属层上提供可焊接或可平板化的界面层 聚合物层,在聚合物层中形成流体室,在第一晶片中提供流体喷嘴,提供第二晶片,并将第二晶片连接到第一层以形成打印头。 一种打印头,包括第一晶片,在第一晶片上的聚合物层,聚合物层包括至少一个通孔,在至少一个通孔上的金属层,金属层上的界面层和聚合物层,流体室 形成在聚合物层中,以及形成在第一晶片中的流体室。
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83.
公开(公告)号:US20090046125A1
公开(公告)日:2009-02-19
申请号:US11837728
申请日:2007-08-13
CPC分类号: B41J2/155 , B41J2202/19 , B41J2202/20 , Y10T29/49346 , Y10T29/49885 , Y10T156/1089
摘要: A full width array printhead is provided having a continuous maintainable printhead surface and method of forming the same. The printhead includes a substrate and an array of die modules mounted thereon with a front face of each die module exposed. A hardened fill material surrounds the array of die modules to define a continuous surface coplanar with the front face of the array of die modules.
摘要翻译: 提供了具有连续可维护的打印头表面的全宽度阵列打印头及其形成方法。 打印头包括基板和安装在其上的模具模块阵列,每个模块模块的正面暴露。 硬化的填充材料围绕模具模块阵列以限定与模具阵列阵列的前表面共面的连续表面。
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公开(公告)号:US5515089A
公开(公告)日:1996-05-07
申请号:US987914
申请日:1992-12-08
CPC分类号: B41J2/14024
摘要: The contiguous inlets of components of a thermal ink jet printhead are sealed by applying a sealant to provide a substantial but not complete seal around the edge of an inlet of the printhead die mounted on a heater plate to provide an edge free of sealant and by injecting a liquid encapsulant to seal the contiguous inlets of the die and a manifold at the edge free of sealant.
摘要翻译: 通过施加密封剂来密封热喷墨打印头的部件的连续入口,以在安装在加热器板上的打印头芯片的入口的边缘周围提供基本但不完整的密封,以提供没有密封剂的边缘,并通过注射 用于密封模具的相邻入口的液体密封剂和在边缘处没有密封剂的歧管。
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