公开(公告)号：US20090314467A1

公开(公告)日：2009-12-24

申请号：US12141290

申请日：2008-06-18

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： F28F7/00

CPC分类号： H01L23/4735 ,  F28F3/022 ,  F28F13/02 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: bonding a plurality of thermally conductive pin fins to a surface to be cooled, each pin fin including a stem with a bulb structure on its distal end; depositing material onto the plurality of thermally conductive pin fins to integrally form a jet impingement structure with the pin fins, wherein the distal ends of the plurality of thermally conductive pin fins form part of the jet impingement structure; and controlling the depositing of material onto the distal ends of the pin fins to form a plurality of jet orifices in the jet impingement structure, with the depositing resulting in the plurality of jet orifices automatically self-aligning between the plurality of thermally conductive pin fins.

摘要翻译： 提供冷却装置和制造方法以便于从发热电子装置中除去热量。 制造方法包括：将多个导热针翅片接合到待冷却的表面，每个销翅片包括在其远端具有灯泡结构的杆; 将材料沉积到所述多个导热销翅片上以一体地形成具有所述销翅片的喷射冲击结构，其中所述多个导热销翅片的远端形成所述喷射冲击结构的一部分; 以及控制材料沉积到销散热片的远端上以在喷射冲击结构中形成多个喷射孔，沉积导致多个喷射孔在多个导热销翅片之间自动自对准。

公开(公告)号：US20090205416A1

公开(公告)日：2009-08-20

申请号：US12031976

申请日：2008-02-15

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： G01F1/68

CPC分类号： G01F1/68 ,  G01F1/34 ,  G01F25/0007 ,  H05K7/20836

摘要： Monitoring method and system are provided for dynamically determining rack airflow rate and rack power consumption employing a heat exchanger disposed at an air outlet side of the electronics rack. The method includes: sensing air temperature at the air outlet side of the electronics rack, sensing coolant temperature at a coolant inlet and coolant temperature at a coolant outlet of the heat exchanger, and determining airflow rate through the electronics rack; and outputting the determined airflow rate through the electronics rack. The determining employs the sensed air temperature at the air outlet side of the rack and the sensed coolant temperatures at the coolant inlet and outlet of the heat exchanger. In one embodiment, the heat exchanger is an air-to-air heat exchanger, and in another embodiment, the heat exchanger is an air-to-liquid heat exchanger.

摘要翻译： 提供监测方法和系统，用于使用布置在电子机架的空气出口侧的热交换器动态地确定机架气流速率和机架功率消耗。 该方法包括：感测电子机架的空气出口侧的空气温度，感测冷却剂入口处的冷却剂温度和在热交换器的冷却剂出口处的冷却剂温度，以及确定通过电子机架的气流速率; 并且通过电子机架输出确定的气流速率。 该确定采用在机架的空气出口侧处的感测到的空气温度和在热交换器的冷却剂入口和出口处感测到的冷却剂温度。 在一个实施例中，热交换器是空气 - 空气热交换器，在另一个实施例中，热交换器是空气 - 液体热交换器。

公开(公告)号：US20080174961A1

公开(公告)日：2008-07-24

申请号：US12055455

申请日：2008-03-26

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/20736 ,  F28F1/20 ,  F28F1/22 ,  H05K7/20009 ,  H05K7/20554 ,  H05K7/20772

摘要： A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least one primary and at least one secondary heat generating component to be cooled; and a liquid-based cooling subsystem including at least one cold plate, physically coupled to the at least one primary heat generating component, and a thermally conductive coolant-carrying tube in fluid communication with the at least one cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and includes a plurality of thermally conductive fins extending from a surface thereof. The plurality of thermally conductive fins are disposed at least partially over the at least one secondary heat generating component to be cooled, and provide supplemental cooling of at least a portion of the air flow established across the multiple components of the electronics system.

摘要翻译： 为多组件电子系统提供混合冷却系统和制造方法。 该冷却系统包括用于建立穿过要被冷却的至少一个主要和至少一个次要发热部件的空气流的空气移动装置; 以及液体冷却子系统，其包括物理耦合到所述至少一个主发热部件的至少一个冷板和与所述至少一个冷板流体连通的导热冷却剂供给管。 导热辅助结构联接到冷却剂承载管并且包括从其表面延伸的多个导热翅片。 多个导热翅片至少部分地设置在待冷却的至少一个二次发热组件上，并且为跨越电子系统的多个部件建立的空气流的至少一部分提供补充冷却。

公开(公告)号：US20080165499A1

公开(公告)日：2008-07-10

申请号：US12053863

申请日：2008-03-24

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/2079

摘要： A coolant control unit for a liquid cooled electronics system is provided, which includes an external coolant inlet and outlet for receiving and returning external coolant; an internal coolant loop for circulating coolant to the electronics system; a first and second control valve coupling the external coolant inlet and outlet to the internal coolant loop; a heat exchanger connected between the first and second control valves; and control logic for controlling operation of the coolant control unit in one of an external coolant mode and an internal coolant mode. In the external coolant mode, the first and second control valves allow passage of external coolant through the internal coolant loop to the electronics system, and in the internal coolant mode, the first and second control valves isolate coolant within the internal coolant loop from the external coolant inlet and outlet, and pass the coolant therein through the heat exchanger.

摘要翻译： 提供了一种用于液冷电子系统的冷却剂控制单元，其包括用于接收和返回外部冷却剂的外部冷却剂入口和出口; 用于将冷却剂循环到电子系统的内部冷却剂回路; 将外部冷却剂入口和出口连接到内部冷却剂回路的第一和第二控制阀; 连接在第一和第二控制阀之间的热交换器; 以及用于控制冷却剂控制单元在外部冷却剂模式和内部冷却剂模式之一中的操作的控制逻辑。 在外部冷却剂模式中，第一和第二控制阀允许外部冷却剂通过内部冷却剂回路到电子系统，并且在内部冷却剂模式中，第一和第二控制阀将内部冷却剂回路内的冷却剂与外部 冷却剂入口和出口，并使冷却剂通过热交换器。

公开(公告)号：US20080264604A1

公开(公告)日：2008-10-30

申请号：US11739160

申请日：2007-04-24

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： F28F7/00 ,  H05K7/20

CPC分类号： F28F3/12 ,  F28F3/02 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from an electronic device. The cooling apparatus includes a manifold structure having a plurality of inlet and outlet passageways for injecting coolant onto, and exhausting coolant after impinging on, a surface to be cooled. The coolant inlet and outlet passageways are interleaved in the manifold structure, and coolant is injected and exhausted through a common edge of the manifold. The manifold structure further includes coolant inlet and outlet plenums, with coolant passing through the inlet passageways from the inlet plenum in a first direction and coolant passing through the outlet passageways to the outlet plenum in a second direction, the first and second directions being perpendicular to the surface to be cooled and being opposite directions, and wherein the manifold structure is contained within a rectangular volume defined by a projection of the common edge.

摘要翻译： 提供冷却装置和制造方法以便于从电子设备移除热量。 冷却装置包括具有多个入口和出口通道的歧管结构，该入口和出口通道用于将冷却剂喷射到待冷却的表面上并且在撞击待冷却表面之后排出冷却剂。 冷却剂入口和出口通道在歧管结构中交错，并且冷却剂通过歧管的公共边缘被注入和排出。 歧管结构还包括冷却剂入口和出口增压室，其中冷却剂沿着第一方向从入口通风室通过入口通道，并且冷却剂在第二方向上通过出口通道到出口增压室，第一和第二方向垂直于 待冷却的表面并且是相反的方向，并且其中歧管结构包含在由公共边缘的突出部限定的矩形体积内。

公开(公告)号：US20080170366A1

公开(公告)日：2008-07-17

申请号：US12054944

申请日：2008-03-25

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H01L23/4338 ,  H01L2924/0002 ,  H01L2924/00

摘要： Cooling apparatuses and methods are provided for cooling an assembly including a substrate supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, a coolant outlet and at least one coolant chamber disposed therebetween; and multiple coolant-carrying tubes, each tube extending from a respective cold plate and being in fluid communication with the coolant inlet or outlet of the cold plate. An enclosure is provided having a perimeter region which engages the substrate to form a cavity with the electronics components and cold plates being disposed within the cavity. The enclosure is configured with multiple bores, each bore being sized and located to receive a respective coolant-carrying tube of the tubes extending from the cold plates. Further, the enclosure is configured with a manifold in fluid communication with the tubes for distributing coolant in parallel to the cold plates.

摘要翻译： 提供冷却装置和方法用于冷却包括支撑多个电子部件的基板的组件。 冷却装置包括：多个分立的冷板，每个分别具有冷却剂入口，冷却剂出口和设置在其间的至少一个冷却剂室; 和多个冷却剂输送管，每个管从相应的冷板延伸并与冷板的冷却剂入口或出口流体连通。 提供了一个外壳，其周边区域与基板接合以形成空腔，电子部件和冷板设置在空腔内。 外壳被配置有多个孔，每个孔的尺寸和位置被定位成接收从冷板延伸的管的相应的冷却剂承载管。 此外，外壳配置有与管流体连通的歧管，用于与冷板平行地分配冷却剂。

公开(公告)号：US20080158815A1

公开(公告)日：2008-07-03

申请号：US12049632

申请日：2008-03-17

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/20754

摘要： Augmenting air cooling of electronics system using a cooling fluid to cool air entering the system, and to remove the heat dissipated by the electronics. A cooled electronics system includes a frame with drawers containing electronics components to be cooled. The frame includes a front with an air inlet and a back with an air outlet. A cabinet encases the frame, and includes a front cover positioned over the air inlet, a back cover positioned over the air outlet, and first and second side air returns at opposite sides of the frame. At least one air moving device establishes air flow across the electronics drawers. The air flow bifurcates at the back cover and returns to the air inlet via the first and second side air returns and the front cover. An air-to-liquid heat exchanger cools the air flowing across the electronics drawers.

摘要翻译： 使用冷却液增强电子系统的空气冷却，以冷却进入系统的空气，并消除由电子设备消散的热量。 冷却的电子系统包括具有抽屉的框架，其中包含要冷却的电子元件。 框架包括一个带空气入口的前部和一个带有空气出口的后部。 框架包围框架，并且包括位于空气入口上方的前盖，位于空气出口上方的后盖，并且第一和第二侧空气在框架的相对侧返回。 至少一个空气移动装置在电子抽屉之间建立空气流。 空气流在后盖处分叉并经由第一和第二侧面空气返回和前盖返回到进气口。 空气对液体的热交换器冷却流过电子抽屉的空气。

公开(公告)号：US20080273306A1

公开(公告)日：2008-11-06

申请号：US11744269

申请日：2007-05-04

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/20745

摘要： A cooling system and method are provided for cooling air exiting one or more electronics racks of a data center. The cooling system includes at least one cooling station separate and freestanding from at least one respective electronics rack of the data center, and configured for disposition of an air outlet side of electronics rack adjacent thereto for cooling egressing air from the electronics rack. The cooling station includes a frame structure separate and freestanding from the respective electronics rack, and an air-to-liquid heat exchange assembly supported by the frame structure. The heat exchange assembly includes an inlet and an outlet configured to respectively couple to coolant supply and coolant return lines for facilitating passage of coolant therethrough. The air-to-liquid heat exchange assembly is sized to cool egressing air from the air outlet side of the respective electronics rack before being expelled into the data center.

摘要翻译： 提供冷却系统和方法来冷却离开数据中心的一个或多个电子机架的空气。 冷却系统包括与数据中心的至少一个相应的电子机架分离和独立的至少一个冷却站，并且被配置为用于设置与其相邻的电子机柜的空气出口侧，用于冷却从电子机架排出空气。 冷却站包括从相应的电子机架分离和独立的框架结构，以及由框架结构支撑的空气对液体热交换组件。 热交换组件包括入口和出口，其构造成分别耦合到冷却剂供应源和冷却剂返回管线，以便于冷却剂通过其中。 空气 - 液体热交换组件的尺寸设定为在排出到数据中心之前冷却从相应的电子机架的空气出口侧排出的空气。

公开(公告)号：US20090238235A1

公开(公告)日：2009-09-24

申请号：US12053762

申请日：2008-03-24

申请人： Levi A. CAMPBELL ,  Michael J. DOMITROVITS ,  Michael J. ELLSWORTH, JR. ,  Prabjit SINGH

发明人： Levi A. CAMPBELL ,  Michael J. DOMITROVITS ,  Michael J. ELLSWORTH, JR. ,  Prabjit SINGH

IPC分类号： G01N25/72 ,  G01J5/00 ,  G01K17/08

CPC分类号： H05K7/20772 ,  G01N25/72 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20836

摘要： Method and apparatus are provided for detecting a defect in a cold plate, configured for cooling an electronics component. The method includes: establishing a first fluid flow through the cold plate, the first fluid flow being at a first temperature; impinging a second fluid flow onto the interface surface, the second fluid flow being at a second temperature, the first temperature and the second temperature being different temperatures; obtaining an isotherm mapping of the interface surface of the cold plate while the first fluid flow passes through the cold plate and the second fluid flow impinges onto the interface surface; and using the isotherm mapping to determine whether the cold plate has a defect. In one embodiment, an infrared-transparent manifold is employed in impinging the second fluid flow onto the interface surface, and the isotherm mapping of the interface surface is obtained through the infrared-transparent manifold.

摘要翻译： 提供了用于检测冷板中的缺陷的方法和装置，用于冷却电子部件。 该方法包括：建立通过冷板的第一流体流，第一流体流处于第一温度; 将第二流体流冲击到界面表面上，第二流体流处于第二温度，第一温度和第二温度是不同的温度; 当所述第一流体流过所述冷板并且所述第二流体流入所述界面时，获得所述冷板的界面的等温线映射; 并使用等温线映射来确定冷板是否有缺陷。 在一个实施例中，使用红外透明歧管将第二流体流注入界面表面，并且通过红外透明歧管获得界面表面的等温线映射。

公开(公告)号：US20100254758A1

公开(公告)日：2010-10-07

申请号：US12418950

申请日：2009-04-06

申请人： Levi A. CAMPBELL ,  Michael J. ELLSWORTH, JR. ,  Prabjit SINGH ,  Rebecca N. WAGNER

发明人： Levi A. CAMPBELL ,  Michael J. ELLSWORTH, JR. ,  Prabjit SINGH ,  Rebecca N. WAGNER

IPC分类号： F16L33/207 ,  H05K7/20

CPC分类号： G06F1/20 ,  F16L13/141 ,  F16L33/2071 ,  G06F2200/201 ,  H05K7/20772 ,  Y10T403/4958 ,  Y10T403/76

摘要： Apparatus and method are provided for forming a mechanical, fluid-tight connection. The apparatus includes a grooved fitting, which has an outer diameter sized to allow the fitting to reside within a tubing between which the fluid-tight connection is to be formed, and which includes a circumferential groove about an outer surface and one or more raised features within the circumferential groove. The apparatus also includes a ring formed of a shape memory alloy, which is transversely heat-shrinkable. The ring is sized to allow the ring to reside over the tubing. When the grooved fitting resides within the tubing and the ring is positioned over the tubing aligned over the circumferential groove in the grooved fitting, heat-shrinking of the ring results in deformation of the tubing into the circumferential groove and into contact with the raised feature(s) within the circumferential groove, thereby forming the mechanical, fluid-tight connection.

摘要翻译： 提供了用于形成机械，流体密封连接的装置和方法。 该装置包括一个带槽的配件，该外壳的外径尺寸设计成允许配件位于要形成流体密封连接的管道之间，并且包括围绕外表面的圆周槽和一个或多个凸起特征 在圆周槽内。 该装置还包括由横向热收缩的形状记忆合金形成的环。 该环的大小可以使环位于管道上。 当槽形配件位于管道内并且环位于在带槽配件的圆周槽上对齐的管上方时，环的热收缩导致管道变形成周向槽并与凸起特征接触（ s），从而形成机械的，流体密封的连接。