End effector for nano manufacturing
    84.
    发明授权
    End effector for nano manufacturing 有权
    用于纳米制造的末端执行器

    公开(公告)号:US08079278B2

    公开(公告)日:2011-12-20

    申请号:US11989036

    申请日:2006-07-21

    IPC分类号: B01L3/02 G01N1/02 G01L23/10

    摘要: An end-effector is provided for use on a micro/nano manipulation device. The end-effector is comprised of: a micropump fluidly coupled to a microtube; a piezoelectric sensing structure disposed in the microtube; and a processing circuit electrically coupled to the sensing structure for determining the force of the fluid flowing through the microtube. The end-effector is a closed loop control-enabled micro/nano manipulation system.

    摘要翻译: 提供用于微/纳米操纵装置的末端执行器。 末端执行器包括:流体耦合到微管的微型泵; 设置在微管中的压电感测结构; 以及电耦合到感测结构以用于确定流过微管的流体的力的处理电路。 末端执行器是一个闭环控制的微/纳米操纵系统。

    Automated nanoassembly
    89.
    发明授权

    公开(公告)号:US07297946B2

    公开(公告)日:2007-11-20

    申请号:US11205201

    申请日:2005-08-16

    IPC分类号: G01N13/16 G01B5/88 G01B7/34

    CPC分类号: B82B3/00 G01Q30/04 G01Q80/00

    摘要: An automated nanomanipulation system is provided for manufacturing a nanoscale structure. The system includes: a design model for the nanoscale structure; image data of a sample surface upon which the nanoscale structure is to be manufactured; a movable member configured to perform a nanomanipulation operation on the sample surface; and a path planning subsystem adapted to receive the design model and the image data. The path planning subsystem generates path data indicative of a path for traversing the movable member along the sample surface such that the movable member manipulates one or more randomly distributed nanoobjects in accordance with the design model.

    Process and apparatus for modifying a surface in a work region
    90.
    发明申请
    Process and apparatus for modifying a surface in a work region 有权
    用于修改工作区域中的表面的工艺和设备

    公开(公告)号:US20060284118A1

    公开(公告)日:2006-12-21

    申请号:US11452891

    申请日:2006-06-14

    IPC分类号: H01J37/08

    CPC分类号: H01J37/32366 H01J37/32357

    摘要: An apparatus and process for manufacturing changes of a substrate in a work region which is 100×100×100 microns or smaller is described. The apparatus uses a plasma source adjacent to the work region to produce radiation or matter which changes the surface. An atomic force microscope or laser can be used in addition. The process and apparatus can be used to produce MEMS devices on a substrate for use in a wide variety of applications.

    摘要翻译: 描述了用于制造100×100×100微米或更小的工作区域中的衬底的变化的装置和工艺。 该设备使用与工作区域相邻的等离子体源产生改变表面的辐射或物质。 另外还可以使用原子力显微镜或激光。 该方法和装置可用于在基板上制造用于各种应用的MEMS器件。