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公开(公告)号：US09781325B1
公开(公告)日：2017-10-03
申请号：US15473573
申请日：2017-03-29
发明人： Mingzhu Wang , Bojie Zhao , Takehiko Tanaka , Nan Guo , Zhenyu Chen , Heng Jiang , Zhongyu Luan , Fengsheng Xi , Feifan Chen , Liang Ding
CPC分类号： H04N5/2257 , G02B3/0075 , G02B5/201 , G02B7/006 , G02B7/021 , H01L27/14625 , H04M1/0264 , H04N5/2252 , H04N5/2253 , H04N5/2254 , H04N5/2258 , H05K1/0203 , H05K1/0274 , H05K1/183 , H05K1/185 , H05K1/189 , H05K2201/0141 , H05K2201/0158 , H05K2201/0175 , H05K2201/09036 , H05K2201/10121
摘要： An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
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公开(公告)号：US09781324B2
公开(公告)日：2017-10-03
申请号：US15460216
申请日：2017-03-15
发明人： Mingzhu Wang , Bojie Zhao , Zhenyu Chen , Takehiko Tanaka , Nan Guo , Zhen Huang , Duanliang Cheng , Liang Ding , Feifan Chen , Heng Jiang
CPC分类号： H04N5/2257 , G02B7/021 , H04N5/2253 , H04N5/2254 , H04N5/2258 , H05K1/0274 , H05K2201/10121
摘要： An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.
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公开(公告)号：US12132849B2
公开(公告)日：2024-10-29
申请号：US17599411
申请日：2020-03-12
发明人： Liao Jing , Xudong Wu , Siyuan Liu , Zhenyu Chen
IPC分类号： H04M1/02 , G09G3/3233
CPC分类号： H04M1/0264 , G09G3/3233 , H04M1/0266 , G09G2300/0426 , G09G2354/00
摘要： The present invention provides a terminal device, and a display screen thereof and an application thereof. The terminal device includes a terminal device body, a display screen, and a camera module. The display screen is provided with a light through hole. The camera module is located below the display screen, and has a front end. The front end of the camera module is fixedly attached to the display screen and the camera module is aligned with the light through hole of the display screen, so that light outside the display screen is received by the camera module via the light through hole.
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84.发明授权公开(公告)号：US12119361B2
公开(公告)日：2024-10-15
申请号：US18207357
申请日：2023-06-08
发明人： Mingzhu Wang , Nan Guo , Zhenyu Chen , Takehiko Tanaka , Jingfei He , Zhen Huang , Zhongyu Luan , Feifan Chen
CPC分类号： H01L27/14618 , H01L27/14627 , H01L27/14683 , H04M1/0264 , H04N23/51 , H04N23/54 , H04N23/57 , H05K1/181 , H05K2201/10121
摘要： A camera module is provided, including a circuit board, a photosensitive element, an optical lens, and a filter element. The circuit board includes a substrate having a substrate front surface, a substrate back surface, and a substrate channel. The substrate front surface and the substrate back surface correspond to each other, and the substrate channel extends from the substrate front surface to the substrate back surface. The photosensitive element has a photosensitive area and a non-photosensitive area surrounding the photosensitive area. A first part of the non-photosensitive area is mounted on the back surface substrate. The photosensitive element and the substrate are conductively connected. The photosensitive area and a second part of the non-photosensitive area correspond to the substrate channel. The optical lens is held in a photosensitive path of the photosensitive element. The filter element is directly mounted on the substrate front surface of the substrate.
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85.发明授权公开(公告)号：US12035028B2
公开(公告)日：2024-07-09
申请号：US17607958
申请日：2020-02-28
发明人： Mingzhu Wang , Takehiko Tanaka , Zhen Huang , Zhenyu Chen
摘要： Disclosed are a camera module and a photosensitive assembly thereof, an electronic device, and a manufacturing method. The photosensitive assembly includes a photosensitive chip, at least one resistance-capacitance device, an extended wiring layer, a filter element assembly, and a molded base. The filter element assembly includes a filter element and a bonding layer bonded around the filter element. The filter element assembly is attached to a top surface of the extended wiring layer, and the filter element of the filter element assembly corresponds to a light transmission hole of the extended wiring layer, so that external light is filtered by the filter element before reaching a photosensitive area of the photosensitive chip through the light transmission hole.
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公开(公告)号：US12021097B2
公开(公告)日：2024-06-25
申请号：US17847569
申请日：2022-06-23
发明人： Mingzhu Wang , Bojie Zhao , Takehiko Tanaka , Zhongyu Luan , Zhenyu Chen , Zhen Huang
IPC分类号： H01L23/10 , H01L27/146 , H04N23/55 , H05K1/02 , H05K1/11
CPC分类号： H01L27/14618 , H01L23/10 , H01L27/14621 , H01L27/14698 , H04N23/55 , H05K1/0274 , H05K1/118 , H01L2224/83101 , H01L2224/83192 , H01L2224/92247 , H01L2924/16195
摘要： A camera module and photosensitive component or unit thereof and manufacturing method therefor are provided. The photosensitive unit includes an encapsulation portion and a photosensitive portion that includes a main circuit board and a photosensitive sensor, wherein the encapsulation portion is integrally encapsulated to form on the main circuit board and the photosensitive sensor.
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87.发明授权公开(公告)号：US12010412B2
公开(公告)日：2024-06-11
申请号：US17607947
申请日：2020-02-28
发明人： Mingzhu Wang , Takehiko Tanaka , Xiaodi Liu , Zhen Huang , Zhenyu Chen
摘要： A camera module and a photosensitive assembly thereof, an electronic device, and a manufacturing method are provided. The photosensitive assembly includes a photosensitive chip having a photosensitive area and an electric connection area located around the photosensitive area, at least one resistance-capacitance device, a conducting element, an expanded wiring layer, and a molded base. The expanded wiring layer has a top surface and a bottom surface. The at least one resistance-capacitance device is electrically connected to the bottom surface of the expanded wiring layer. The conducting element extends between the bottom surface of the expanded wiring layer and the electric connection area of the photosensitive chip, so as to electrically connect the photosensitive chip to the expanded wiring layer by means of the conducting element. A light hole is formed in the expanded wiring layer, and the light hole corresponds to at least the photosensitive area of the photosensitive chip. The molded base is integrally combined with the photosensitive chip, the at least one resistance-capacitance device, and the expanded wiring layer.
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88.发明授权公开(公告)号：US11721709B2
公开(公告)日：2023-08-08
申请号：US17550733
申请日：2021-12-14
发明人： Mingzhu Wang , Nan Guo , Zhenyu Chen , Takehiko Tanaka , Jingfei He , Zhen Huang , Zhongyu Luan , Feifan Chen
CPC分类号： H01L27/14618 , H01L27/14627 , H01L27/14683 , H04M1/0264 , H04N23/51 , H04N23/54 , H04N23/57 , H05K1/181 , H05K2201/10121
摘要： A camera module and a molded circuit board assembly thereof, a semi-finished product of the molded circuit board assembly, and an array camera module and a molded circuit board assembly thereof, as well as a manufacturing method and an electronic device, wherein the camera module comprises at least one optical lens, at least one back surface molded portion, at least one photosensitive element and a circuit board. The circuit board comprises at least one substrate and at least one electronic component that is conductively connected to the substrate; a part of the non-photosensitive area of the photosensitive element is attached to the substrate back surface of the substrate, and the photosensitive area and another part of the non-photosensitive area of the photosensitive element correspond to a substrate channel of the substrate; the back surface molded portion is integrally bonded to at least one part of the area of the substrate back surface of the substrate; and the optical lens is held in the photosensitive path of the photosensitive element.
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公开(公告)号：US11579341B2
公开(公告)日：2023-02-14
申请号：US16479403
申请日：2018-01-26
发明人： Mingzhu Wang , Bojie Zhao , Chunmei Liu , Feifan Chen , Zhenyu Chen
摘要： A lens (10) and a camera module (100) and a manufacturing method thereof, wherein the lens (10) comprises an edge-cut lens sheet (114), wherein the edge-cut lens sheet (14) includes at least one chord edge (1141) and at least one circular edge (1142), wherein the chord edge (1141) and the circular edge (1142) are adjacently connected to each other, and wherein the chord edge (1141) and the circular edge (1142) have different curvatures, so that the lens sheet (114) becomes narrow and the width of the lens (10) become narrow, to form an ultra-narrow camera module (100).
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公开(公告)号：US11533416B2
公开(公告)日：2022-12-20
申请号：US16575357
申请日：2019-09-18
发明人： Mingzhu Wang , Bojie Zhao , Zhenyu Chen , Nan Guo , Takehiko Tanaka
IPC分类号： H04N5/225 , H01L27/146 , H04N5/247 , G02B7/00 , G02B7/02 , H05K1/18 , G03B13/36 , G02B7/08 , H05K3/28 , G02B5/20 , G02B7/09 , H02K41/035 , H02N2/02 , H05K1/02
摘要： A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.
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