Packetized interface for coupling agents
    83.
    发明授权
    Packetized interface for coupling agents 有权
    分组接口用于耦合剂

    公开(公告)号:US08811430B2

    公开(公告)日:2014-08-19

    申请号:US13428068

    申请日:2012-03-23

    IPC分类号: H04J3/00 G06F13/38

    摘要: In one embodiment, the present invention includes a fabric on a first semiconductor die to communicate with at least one agent on the die according to an on-chip protocol and a packetization layer coupled to the fabric to receive command and data information from the fabric on multiple links and to packetize the information into a packet for transmission from the die to another die via an in-package packetized link. Other embodiments are described and claimed.

    摘要翻译: 在一个实施例中,本发明包括在第一半导体管芯上的结构,以根据片上协议与管芯上的至少一个代理进行通信,以及耦合到该结构的分组层,以从该结构接收命令和数据信息 多个链路并且将信息分组成分组,以经由内部分组化链路从芯片传输到另一个管芯。 描述和要求保护其他实施例。

    Packetized Interface For Coupling Agents
    90.
    发明申请
    Packetized Interface For Coupling Agents 有权
    耦合代理的分组接口

    公开(公告)号:US20120176909A1

    公开(公告)日:2012-07-12

    申请号:US13428068

    申请日:2012-03-23

    IPC分类号: H04L12/50 H04L12/26

    摘要: In one embodiment, the present invention includes a fabric on a first semiconductor die to communicate with at least one agent on the die according to an on-chip protocol and a packetization layer coupled to the fabric to receive command and data information from the fabric on multiple links and to packetize the information into a packet for transmission from the die to another die via an in-package packetized link. Other embodiments are described and claimed.

    摘要翻译: 在一个实施例中,本发明包括在第一半导体管芯上的结构,以根据片上协议与管芯上的至少一个代理进行通信,以及耦合到该结构的分组层,以从该结构接收命令和数据信息 多个链路并且将信息分组成分组,以经由内部分组化链路从芯片传输到另一个管芯。 描述和要求保护其他实施例。