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    Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled
    81.
    发明授权
    Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled 失效
    冷却装置和方法采用设置在模块外壳和要冷却的电子部件之间的分立冷板

    公开(公告)号：US07385817B2

    公开(公告)日：2008-06-10

    申请号：US11871334

    申请日：2007-10-12

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： H05K7/20 ,  F28F7/00

    CPC分类号： H01L23/4338 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Cooling apparatuses and methods are provided for cooling an assembly including a substrate supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, a coolant outlet and at least one coolant chamber disposed therebetween; and multiple coolant-carrying tubes, each tube extending from a respective cold plate and being in fluid communication with the coolant inlet or outlet of the cold plate. An enclosure is provided having a perimeter region which engages the substrate to form a cavity with the electronics components and cold plates being disposed within the cavity. The enclosure is configured with multiple bores, each bore being sized and located to receive a respective coolant-carrying tube of the tubes extending from the cold plates. Further, the enclosure is configured with a manifold in fluid communication with the tubes for distributing coolant in parallel to the cold plates.

    摘要翻译： 提供冷却装置和方法用于冷却包括支撑多个电子部件的基板的组件。 冷却装置包括：多个分立的冷板，每个分别具有冷却剂入口，冷却剂出口和设置在其间的至少一个冷却剂室; 和多个冷却剂输送管，每个管从相应的冷板延伸并与冷板的冷却剂入口或出口流体连通。 提供了一个外壳，其周边区域与基板接合以形成空腔，电子部件和冷板设置在空腔内。 外壳被配置有多个孔，每个孔的尺寸和位置被定位成接收从冷板延伸的管的相应的冷却剂承载管。 此外，外壳配置有与管流体连通的歧管，用于与冷板平行地分配冷却剂。

    MULTI-FLUID COOLING SYSTEM AND METHOD WITH FREEZE PROTECTION FOR COOLING AN ELECTRONIC DEVICE
    83.
    发明申请
    MULTI-FLUID COOLING SYSTEM AND METHOD WITH FREEZE PROTECTION FOR COOLING AN ELECTRONIC DEVICE 失效
    用于冷却电子设备的多流体冷却系统和冷冻保护方法

    公开(公告)号：US20080060368A1

    公开(公告)日：2008-03-13

    申请号：US11530992

    申请日：2006-09-12

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： F25B45/00

    CPC分类号： F25B23/00 ,  F25B9/006 ,  H05K7/20281

    摘要： A multi-fluid cooling system and method for cooling an electronic device are provided which employ freeze protection when in a shipping state. The cooling system includes a coolant loop having an expansion tank containing first and second fluids, which are immiscible and of different densities, and the second fluid freezes at a lower temperature than the first. The coolant loop further includes a first valve for facilitating coupling of the first fluid into the coolant loop and a second valve for facilitating coupling of the second fluid into the coolant loop, the first and second valves being independently controllable. Control logic electronically controls actuation of the first and second valves to automatically pass the first fluid through the coolant loop when the system is in an operational state and to automatically maintain the second fluid in the coolant loop when the system is in a shipping state.

    摘要翻译： 提供一种用于冷却电子设备的多流体冷却系统和方法，其在运输状态下采用防冻保护。 冷却系统包括冷却剂回路，其具有包含第一和第二流体的膨胀罐，其不混溶并且具有不同的密度，并且第二流体在比第一流体低的温度下冻结。 冷却剂回路还包括用于促进第一流体耦合到冷却剂回路中的第一阀和用于促进第二流体耦合到冷却剂回路中的第二阀，第一和第二阀是可独立控制的。 当系统处于操作状态时，控制逻辑电子地控制第一和第二阀的致动，以自动地将第一流体通过冷却剂回路，并且当系统处于运输状态时，自动维持冷却剂回路中的第二流体。

    MULTI-FLUID COOLING SYSTEM, COOLED ELECTRONICS MODULE, AND METHODS OF FABRICATION THEREOF
    84.
    发明申请
    MULTI-FLUID COOLING SYSTEM, COOLED ELECTRONICS MODULE, AND METHODS OF FABRICATION THEREOF 失效
    多流体冷却系统，冷却电子模块及其制造方法

    公开(公告)号：US20070295480A1

    公开(公告)日：2007-12-27

    申请号：US11426423

    申请日：2006-06-26

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4735 ,  H01L23/427 ,  H01L2924/0002 ,  Y10S165/908 ,  Y10T29/49002 ,  H01L2924/00

    摘要： A multi-fluid cooling system and methods of fabrication thereof are provided for removing heat from one or more electronic devices. The cooling system includes a multi-fluid manifold structure with at least one first fluid inlet orifice and at least one second fluid inlet orifice for concurrently, separately injecting a first fluid and a second fluid onto a surface to be cooled when the cooling system is employed to cool one or more electronic devices, wherein the first fluid and the second fluid are immiscible, and the first fluid has a lower boiling point temperature than the second fluid. When the cooling system is employed to cool the one or more electronic devices and the first fluid boils, evolving first fluid vapor condenses in situ by direct contact with the second fluid of higher boiling point temperature.

    摘要翻译： 提供多流体冷却系统及其制造方法，用于从一个或多个电子设备去除热量。 冷却系统包括具有至少一个第一流体入口孔口和至少一个第二流体入口孔口的多流体歧管结构，用于在采用冷却系统时同时单独地将第一流体和第二流体注入待冷却的表面上 以冷却一个或多个电子设备，其中所述第一流体和所述第二流体是不混溶的，并且所述第一流体具有比所述第二流体低的沸点温度。 当冷却系统用于冷却一个或多个电子装置和第一流体沸腾时，放出的第一流体蒸汽通过与较高沸点温度的第二流体直接接触而原位冷凝。

    Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins
    86.
    发明授权
    Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins 有权
    冷却装置，冷却电子模块及其采用集成歧管和多个导热翅片的制造方法

    公开(公告)号：US07233494B2

    公开(公告)日：2007-06-19

    申请号：US11124064

    申请日：2005-05-06

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes a plurality of thermally conductive fins coupled to and projecting away from a surface to be cooled. The fins facilitate transfer of heat from the surface to be cooled. The apparatus further includes an integrated manifold having a plurality of inlet orifices for injecting coolant onto the surface to be cooled, and a plurality of outlet openings for exhausting coolant after impinging on the surface to be cooled. The inlet orifices and the outlet openings are interspersed in a common surface of the integrated manifold. Further, the integrated manifold and the surface to be cooled are disposed with the common surface of the manifold and the surface to be cooled in spaced, opposing relation, and with the plurality of thermally conductive fins disposed therebetween.

    摘要翻译： 提供冷却装置和制造方法以便于从发热电子装置中除去热量。 冷却装置包括耦合到待冷却表面并远离待冷却表面的多个导热翅片。 散热片有助于从要冷却的表面传递热量。 该装置还包括具有多个用于将冷却剂喷射到待冷却表面上的入口孔的集成歧管，以及用于在撞击待冷却表面之后排出冷却剂的多个出口开口。 入口孔和出口开口散布在集成歧管的共同表面中。 此外，集成歧管和要冷却的表面与歧管的共同表面和待冷却的表面以间隔相对的关系设置，并且多个导热翅片设置在它们之间。

    Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins
    87.
    发明授权
    Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins 失效
    电子设备冷却组件和使用保持多个导热销的弹性支撑材料的方法

    公开(公告)号：US07206203B2

    公开(公告)日：2007-04-17

    申请号：US10873432

    申请日：2004-06-22

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons ,  Roger R. Schmidt

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons ,  Roger R. Schmidt

    IPC分类号： H05K7/20 ,  H01L23/34 ,  H02G3/03 ,  F28F7/00

    CPC分类号： H01L23/4336 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

    摘要： An electronic device cooling assembly and fabrication method are provided which include a manifold with an orifice for injecting a cooling liquid onto a surface to be cooled, and an elastic pin support material with an opening aligned to the orifice of the manifold. Multiple thermally conductive pins are mounted within the support material, extending therefrom, and are sized to physically contact the surface to be cooled. The support material has a thickness and compliance which facilitates thermal interfacing of the pins to the surface by allowing second ends thereof to move vertically and tilt. The second end of each pin has a planar surface which is normal to an axis of the pin, and the support material facilitates the planar surfaces of the second pin ends establishing planar contact with the surface to be cooled, notwithstanding that the surface may be other than planar.

    摘要翻译： 提供了一种电子设备冷却组件和制造方法，其包括具有用于将冷却液体喷射到待冷却表面上的孔口的歧管以及具有与歧管孔口对准的开口的弹性销支撑材料。 多个导热销安装在支撑材料内，从其延伸，并且其尺寸设计成物理接触要冷却的表面。 支撑材料具有厚度和顺从性，其通过允许其第二端垂直移动和倾斜来促进销与表面的热接合。 每个销的第二端具有垂直于销的轴线的平坦表面，并且支撑材料有助于第二销端的平面表面与待冷却的表面建立平面接触，尽管表面可以是其他 比平面。

    Controlled cooling of an electronic system for reduced energy consumption
    88.
    发明授权
    Controlled cooling of an electronic system for reduced energy consumption 有权

    公开(公告)号：US09879926B2

    公开(公告)日：2018-01-30

    申请号：US13527863

    申请日：2012-06-20

    申请人： Milnes P. David ,  Madhusudan K. Iyengar ,  Roger R. Schmidt

    发明人： Milnes P. David ,  Madhusudan K. Iyengar ,  Roger R. Schmidt

    IPC分类号： F28F27/00 ,  H05K7/20 ,  G05B15/02

    CPC分类号： F28F27/00 ,  G05B15/02 ,  G05B2219/2614 ,  H05K7/20836

    摘要： Energy efficient control of a cooling system cooling an electronic system is provided. The control includes automatically determining at least one adjusted control setting for at least one adjustable cooling component of a cooling system cooling the electronic system. The automatically determining is based, at least in part, on power being consumed by the cooling system and temperature of a heat sink to which heat extracted by the cooling system is rejected. The automatically determining operates to reduce power consumption of the cooling system and/or the electronic system while ensuring that at least one targeted temperature associated with the cooling system or the electronic system is within a desired range. The automatically determining may be based, at least in part, on one or more experimentally obtained models relating the targeted temperature and power consumption of the one or more adjustable cooling components of the cooling system.

    Vapor condenser with three-dimensional folded structure
    90.
    发明授权
    Vapor condenser with three-dimensional folded structure 有权
    蒸汽冷凝器具有三维折叠结构

    公开(公告)号：US08941994B2

    公开(公告)日：2015-01-27

    申请号：US13613753

    申请日：2012-09-13

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： H05K7/20 ,  F28F3/00

    CPC分类号： H05K7/20309 ,  B23P15/26 ,  F28D9/0025 ,  F28D15/02 ,  F28F3/046 ,  F28F3/12 ,  F28F9/02 ,  H05K7/203 ,  H05K7/20809 ,  Y10T29/4935 ,  Y10T29/49359 ,  Y10T29/49396

    摘要： A vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.

    摘要翻译： 提供了一种蒸汽冷凝器，其包括三维折叠结构，其至少部分地限定一组冷却剂传送通道和一组蒸气冷凝通道，其中冷却剂传送通道与 蒸汽冷凝通道。 折叠结构包括在片材中具有多个折叠的导热片。 片材的一侧是蒸汽冷凝表面，并且片材的相对侧是冷却剂冷却的表面，冷却剂冷却表面的至少一部分限定了冷却剂传送通道，并与冷却剂内部的冷却剂接触 冷却液承载通道。 蒸气冷凝器在一个实施例中还包括顶板，以及第一和第二端部歧管，其连接到折叠结构的相对端并与冷却剂承载通道流体连通以便于冷却剂流过冷却剂携带 频道