Abstract:
A night vision system, a microchannel plate (MCP), and a planetary deposition system and methodology are provided for selectively depositing an electrode contact metal on one side of MCP channel openings. MCPs can be secured to a face of a platter that rotates about its central platter axis. The rotating platter can be tilted on a fixture surrounding an evaporative source of contact metal. A mask with a variable size mask opening is arranged between the rotating platter and the evaporative source. While the mask orbits around the evaporative source with the rotating platter, the mask does not rotate along its own axis as does the rotating platter. Depending on the opening of the non-rotating mask, and the tilt angle of the rotating platter, the respective circumferential distance around and the depth into the shaded first side of the channel opening is controlled.
Abstract:
Infrared vision systems, headpieces, and methods include an eyepiece and a body module. The eyepiece is configured to be worn over a user's eyes. The eyepiece includes an infrared sensor, configured to detect external infrared information. For example, the infrared sensor may include a plurality of short-wave infrared (SWIR) sensors. The eyepiece includes a display, configured to visually provide external infrared information to the user. For example, the display may include a see-through color display. The body module is in wired or wireless communication with the eyepiece. The eyepiece may include an adjustable strap, coupled to the eyepiece. The adjustable strap is configured to wrap around the user's head.
Abstract:
A method of processing a double sided wafer of a microelectromechanical device includes spinning a resist onto a first side of a first wafer. The method further includes forming pathways within the resist to expose portions of the first side of the first wafer. The method also includes etching one or more depressions in the first side of the first wafer through the pathways, where each of the depressions have a planar surface and edges. Furthermore, the method includes depositing one or more adhesion metals over the resist such that the one or more adhesion metals are deposited within the depressions, and then removing the resist from the first wafer. The method finally includes depositing indium onto the adhesion metals deposited within the depressions and bonding a second wafer to the first wafer by compressing the indium between the second wafer and the first wafer.
Abstract:
A method of calculating a climb-dive marker (CDM) that is visibly present on a display even as the aircraft approaches a roll angle of +/−90° is provided. An exemplary CDM method comprises obtaining, an X-axis velocity, a Y-axis velocity, and a Z-axis velocity in aircraft body coordinates of an aircraft; calculating a CDM elevation; and displaying, by the controller, the calculated CDM elevation. The method can further comprise obtaining an angle of attack (AoA) of the aircraft and a roll angle of the aircraft, wherein the AoA is set as the value of the CDM elevation when the roll angle is within a preset range. The CDM elevation may also be calculated using a combination of the AOA and the CDM formula when roll angle is within a second preset range.
Abstract:
At least some embodiments are a method including connecting a mobile computer system to a vehicle computer system, wherein the vehicle computer system does not include a display device. Mission control data is received from the vehicle computer system, the mission control data generated by one or more vehicle I/O sensors coupled to the vehicle computer system. The mission control data is displayed on a display device of the mobile computer system.
Abstract:
A method of processing a double sided wafer of a microelectromechanical device includes spinning a resist onto a first side of a first wafer. The method further includes forming pathways within the resist to expose portions of the first side of the first wafer. The method also includes etching one or more depressions in the first side of the first wafer through the pathways, where each of the depressions have a planar surface and edges. Furthermore, the method includes depositing one or more adhesion metals over the resist such that the one or more adhesion metals are deposited within the depressions, and then removing the resist from the first wafer. The method finally includes depositing indium onto the adhesion metals deposited within the depressions and bonding a second wafer to the first wafer by compressing the indium between the second wafer and the first wafer.
Abstract:
There is provided in a first form, an apparatus. The apparatus includes a detector array having a plurality of elements, the detector array comprising a photosensitive material and a photosensitive region disposed about and distinct from the plurality of elements. Electrical circuitry is coupled to each of the elements of the detector array. The electrical circuitry is configured to generate a set of first signals, each first signal of the set of first signals is based on optical energy impinging on a respective one of the plurality of elements of the detector array. The photosensitive region is coupled to the electrical circuitry and the electrical circuitry is configured to generate a second signal having a first value if no portion of optical energy impinging on the plurality of elements of the detector array impinges on the region disposed about the plurality of elements of the detector array. The second signal has a second value, distinct from the first value, if a portion of an optical energy impinging on the plurality of elements of the detector array impinges on the photosensitive region disposed about the plurality of elements of the detector array, the portion of the optical energy impinging on the photosensitive region disposed about the plurality of elements exceeds a threshold energy.
Abstract:
A method for detecting light sources. The method includes capturing an image including a sub-infrared light emitter, applying a filter to a pixel of the captured image to isolate a signal strength of a range of frequencies, and comparing the signal strength of the filtered pixel to an expected signal strength of a background spectra for the range of frequencies. As a result of a difference between the signal strength of the filtered pixel and the expected signal strength exceeding a predetermined threshold, the method includes identifying the pixel as corresponding to a light emitter. As a result of the difference between the signal strength of the filtered pixel and the expected signal strength not a predetermined threshold, the method includes identifying the pixel as not corresponding to a light emitter.
Abstract:
A method including receiving at a synchronizing node a first reference frame from a first reference node at a first time and storing a first time value representing the first time, and calculating a timing estimator by subtracting a minimum time value, representing the distance from the synchronizing node to the first reference node, from the first time value. The method includes receiving at the synchronizing node a second reference frame at a second time and transmitting from the synchronizing node to the first reference node a short timing contention time frame. The method includes receiving at the synchronizing node from the first reference node an arrival time value representing the time at which the first reference node received the short timing contention frame and calculating a time drift from the first arrival time value and the second time value and adjusting the timing estimator based on the time drift.
Abstract:
In accordance with one embodiment of the present disclosure, a system may include a polarizing beamsplitter for splitting one or more unpolarized rays received from an illumination source into a first polarized component and a second polarized component, the first polarized component and the second polarized component having orthogonal polarizations to each other. The system may also include a half-wave plate for rotating the second polarized component to the same polarization as the first polarized component. The system may further include a lens group for passing the first polarized component to a target plane as a first polarized ray, and further for separately passing the second polarized component to the target plane as a second polarized ray.