公开(公告)号：US20180249582A1

公开(公告)日：2018-08-30

申请号：US15966484

申请日：2018-04-30

Applicant: AbleGo Technology Co., Ltd.

Inventor： Shu-Hui Hung

IPC: H05K3/30

CPC classification number: H05K3/305 ,  H05K2201/10977 ,  H05K2203/0195 ,  Y02P70/613 ,  Y10T29/49155 ,  Y10T29/5193

Abstract: This invention provides a method and apparatus for manufacturing electronic devices. The method includes: providing a substrate having a first surface; providing an electronic device having bumps; mounting the bumps to the first surface to form an integrated unit; applying a capillary underfill to multiple sides of the electronic device, enabling the underfill to creep along and fill the gap between the electronic device and the substrate; placing the integrated unit into a processing chamber; raising the temperature in the chamber to a first predetermined temperature; reducing the pressure in the chamber to a first predetermined pressure of a vacuum pressure, and maintaining the vacuum pressure for a predetermined time period; raising the pressure in the chamber to a second predetermined pressure higher than 1 atm, and maintaining the second predetermined pressure for a predetermined time period; and adjusting the temperature in the chamber to a second predetermined temperature.

公开(公告)号：US10388613B2

公开(公告)日：2019-08-20

申请号：US15491971

申请日：2017-04-19

Applicant: ABLEGO TECHNOLOGY CO., LTD.

Inventor： Shu-Hui Hung

IPC: H05K3/00 ,  H01L23/00 ,  H01L21/48 ,  H01L21/67 ,  H01L21/673 ,  H01L21/56

Abstract: A method for suppressing material warpage by means of a pressure difference comprises the following steps: a. preparing a plurality of carrier boards; b. preparing a plurality of carrier board pressing devices having an upper surface and a lower surface on which at least one air bag is provided; c. adjusting the processing chamber to be a working temperature and a working pressure, so that the carrier boards and the carrier board pressing devices placed therein are surrounded by the working temperature and the working pressure; d. effectively suppressing warpage of the carrier board by using a pressure difference between a first predetermined pressure in the air bag and the working pressure of the processing chamber. Thereby, production quality of carrier board is significantly improved, as well as the cost for production of which is effectively reduced.

公开(公告)号：US10251281B2

公开(公告)日：2019-04-02

申请号：US15966484

申请日：2018-04-30

Applicant: AbleGo Technology Co., Ltd.

Inventor： Shu-Hui Hung

IPC: H05K3/30

Abstract: This invention provides a method and apparatus for manufacturing electronic devices. The method includes: providing a substrate having a first surface; providing an electronic device having bumps; mounting the bumps to the first surface to form an integrated unit; applying a capillary underfill to multiple sides of the electronic device, enabling the underfill to creep along and fill the gap between the electronic device and the substrate; placing the integrated unit into a processing chamber; raising the temperature in the chamber to a first predetermined temperature; reducing the pressure in the chamber to a first predetermined pressure of a vacuum pressure, and maintaining the vacuum pressure for a predetermined time period; raising the pressure in the chamber to a second predetermined pressure higher than 1 atm, and maintaining the second predetermined pressure for a predetermined time period; and adjusting the temperature in the chamber to a second predetermined temperature.

公开(公告)号：US09986647B2

公开(公告)日：2018-05-29

申请号：US14454165

申请日：2014-08-07

Applicant: AbleGo Technology Co., Ltd.

Inventor： Shu-Hui Hung

IPC: H05K3/30

CPC classification number: H05K3/305 ,  H05K2201/10977 ,  H05K2203/0195 ,  Y02P70/613 ,  Y10T29/49155 ,  Y10T29/5193

Abstract: This invention provides a method and apparatus for manufacturing electronic devices. The method includes: providing a substrate having a first surface; providing an electronic device having bumps; mounting the bumps to the first surface to form an integrated unit; applying a capillary underfill to multiple sides of the electronic device, enabling the underfill to creep along and fill the gap between the electronic device and the substrate; placing the integrated unit into a processing chamber; raising the temperature in the chamber to a first predetermined temperature; reducing the pressure in the chamber to a first predetermined pressure of a vacuum pressure, and maintaining the vacuum pressure for a predetermined time period; raising the pressure in the chamber to a second predetermined pressure higher than 1 atm, and maintaining the second predetermined pressure for a predetermined time period; and adjusting the temperature in the chamber to a second predetermined temperature.

公开(公告)号：US20170323856A1

公开(公告)日：2017-11-09

申请号：US15491971

申请日：2017-04-19

Applicant: ABLEGO TECHNOLOGY CO., LTD.

Inventor： Shu-Hui Hung

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/48 ,  H01L21/673

CPC classification number: H01L23/562 ,  H01L21/4842 ,  H01L21/4846 ,  H01L21/56 ,  H01L21/67017 ,  H01L21/67092 ,  H01L21/6732 ,  Y10T29/49124

Abstract: A method for suppressing material warpage by means of a pressure difference comprises the following steps: a. preparing a plurality of carrier boards; b. preparing a plurality of carrier board pressing devices having an upper surface and a lower surface on which at least one air bag is provided; c. adjusting the processing chamber to be a working temperature and a working pressure, so that the carrier boards and the carrier board pressing devices placed therein are surrounded by the working temperature and the working pressure; d. effectively suppressing warpage of the carrier board by using a pressure difference between a first predetermined pressure in the air bag and the working pressure of the processing chamber. Thereby, production quality of carrier board is significantly improved, as well as the cost for production of which is effectively reduced.

公开(公告)号：US20150047187A1

公开(公告)日：2015-02-19

申请号：US14454165

申请日：2014-08-07

Applicant: AbleGo Technology Co., Ltd.

Inventor： Shu-Hui Hung

IPC: H05K3/24

CPC classification number: H05K3/305 ,  H05K2201/10977 ,  H05K2203/0195 ,  Y02P70/613 ,  Y10T29/49155 ,  Y10T29/5193

Abstract: This invention provides a method and apparatus for manufacturing electronic devices. The method includes: providing a substrate having a first surface; providing an electronic device having bumps; mounting the bumps to the first surface to form an integrated unit; applying a capillary underfill to multiple sides of the electronic device, enabling the underfill to creep along and fill the gap between the electronic device and the substrate; placing the integrated unit into a processing chamber; raising the temperature in the chamber to a first predetermined temperature; reducing the pressure in the chamber to a first predetermined pressure of a vacuum pressure, and maintaining the vacuum pressure for a predetermined time period; raising the pressure in the chamber to a second predetermined pressure higher than 1 atm, and maintaining the second predetermined pressure for a predetermined time period; and adjusting the temperature in the chamber to a second predetermined temperature.

Abstract translation: 本发明提供一种用于制造电子设备的方法和装置。 该方法包括：提供具有第一表面的基底; 提供具有凸起的电子设备; 将所述凸起安装到所述第一表面以形成集成单元; 将毛细管底部填充物施加到电子装置的多个侧面，使得底部填充剂能够沿着电子装置和基板之间的间隙蠕变并填充; 将集成单元放置在处理室中; 将所述室中的温度提高到第一预定温度; 将室内的压力降低至真空压力的第一预定压力，并将真空压力保持预定时间段; 将所述室中的压力提高到高于1atm的第二预定压力，并将所述第二预定压力保持预定时间段; 以及将所述室中的温度调节到第二预定温度。