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公开(公告)号：US06943454B1
公开(公告)日：2005-09-13
申请号：US10445283
申请日：2003-05-23
IPC分类号： G11C5/00 , H01L23/48 , H01L25/065
CPC分类号： G11C5/02 , G11C5/04 , H01L25/0652 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2924/30107 , H01L2924/00014 , H01L2924/00
摘要： A memory module for an electronic system, such as a personal computer or server, includes a double-sided, 184-pin, dual in-line memory module printed circuit board. A plurality of individual electronic components are mounted on both sides of the printed circuit board. Each electronic component includes an electronic component printed circuit board, a first pair of stacked memory dies electrically connected to the electronic component printed circuit board, a second pair of stacked memory dies electrically connected to the electronic component printed circuit board, and a thin small outline ball grid array package at least partially encapsulating the first and second pairs of stacked memory dies. Preferably, an insulator is disposed between each pair of stacked memory dies.
摘要翻译： 用于诸如个人计算机或服务器的电子系统的存储器模块包括双面184针双列直插存储器模块印刷电路板。 多个单独的电子部件安装在印刷电路板的两侧。 每个电子部件包括电子部件印刷电路板，电连接到电子部件印刷电路板的第一对堆叠式存储器模块，与电子部件印刷电路板电连接的第二对堆叠式存储器模块，以及薄的小外形 球栅阵列封装，至少部分地封装第一和第二对堆叠的存储器管芯。 优选地，绝缘体设置在每对堆叠的存储器管芯之间。
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公开(公告)号：US20080002447A1
公开(公告)日：2008-01-03
申请号：US11478971
申请日：2006-06-29
IPC分类号： G11C5/02
CPC分类号： G11C5/04 , H05K1/181 , H05K2201/09409 , H05K2203/1572 , Y02P70/611
摘要： A memory supermodule containing two or more memory modules disposed on a common circuit board. Also, a memory supermodule comprising two or more memory modules, each module comprising a circuit board, the circuit boards connected by a flexible circuit. All modules in a supermodule share a single set of contact pads for establishing signal connection with a system in which the supermodule is used.
摘要翻译： 一个包含两个或多个存储器模块的存储器超模，该存储器模块设置在公共电路板上。 而且，包括两个或多个存储器模块的存储器超模块，每个模块包括电路板，电路板由柔性电路连接。 超模中的所有模块共享一组接触垫，用于与使用超模的系统建立信号连接。
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