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1.发明公开公开(公告)号：US20240266300A1
公开(公告)日：2024-08-08
申请号：US18107257
申请日：2023-02-08
Applicant: Infineon Technologies AG
Inventor： Marco Bäßler , Michael Niendorf
IPC: H01L23/00 , H01L23/495 , H01L23/498 , H05K1/18
CPC classification number: H01L23/562 , H01L23/4952 , H01L23/49575 , H01L23/49861 , H05K1/18 , H01L23/3121 , H01L23/4006 , H01L2023/4087 , H01L24/48 , H01L25/0655 , H01L25/072 , H01L2224/48137 , H01L2224/48175 , H05K2201/09063 , H05K2201/09409 , H05K2201/1059
Abstract: A power semiconductor module includes: an electrically insulative enclosure; a plurality of power semiconductor dies attached to a substrate inside the electrically insulative enclosure; a lead frame or clip frame disposed above the power semiconductor dies inside the electrically insulative enclosure and electrically connected to the power semiconductor dies; a plurality of contact pins attached to the lead frame or clip frame and protruding through a first side of the electrically insulative enclosure to form an electrical connection interface outside the electrically insulative enclosure; and a plurality of vibration dampeners attached to the lead frame or clip frame. The vibration dampeners protrude through the first side of the electrically insulative enclosure and are separate from the electrical connection interface. The vibration dampeners are configured to dampen vibrations at a circuit board designed to be mounted to the module and do not affect electrical operation of the power semiconductor module.
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公开(公告)号：US20240264686A1
公开(公告)日：2024-08-08
申请号：US18041076
申请日：2022-05-20
Inventor： Danyang Bi , Xiaoxia Liu , Hongjin Hu , Wei Chen , Xiaoliang Fu , Xiaodong Hao , Xiangdong Wei
CPC classification number: G06F3/0412 , H05K1/118 , H05K2201/094 , H05K2201/09409 , H05K2201/09709
Abstract: A display apparatus is provided. The display apparatus includes a display panel; a main printed circuit configured to be electrically connected to an array of subpixels in the display panel; a touch control structure on the display panel; and a touch printed circuit configured to be electrically connected to touch electrodes in the touch control structure. The display apparatus includes a slot defining a cavity configured to receive at least a first portion of the touch printed circuit. A thickness of the touch printed circuit is less than or equal to a depth of the slot.
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公开(公告)号：US20240251503A1
公开(公告)日：2024-07-25
申请号：US18561288
申请日：2022-05-20
Applicant: Shenzhen Jufei Optoelectronics Co., Ltd.
Inventor： Mingquan Li , Wenqin Xu , Pingru Sun
IPC: H05K1/02 , H01L25/075 , H01L33/62 , H05K1/11 , H05K1/18
CPC classification number: H05K1/0296 , H01L25/0753 , H01L33/62 , H05K1/111 , H05K1/114 , H05K1/181 , H05K2201/09409 , H05K2201/10106
Abstract: The present application relates to a circuit board and an electronic device. The first slit is used to divide the metal layer on the substrate into at least two first regions and second regions that are alternately distributed and mutually insulated in a row direction and a column direction; the second slit in each row direction of the first regions is interrupted by the first extension portion of at least a portion of the metal sheets within the first regions along the column direction; the second slit in each column direction of the second regions is interrupted by the second extension portion of at least a portion of the metal sheets within the second regions along the row direction.
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公开(公告)号：US20240243496A1
公开(公告)日：2024-07-18
申请号：US18154658
申请日：2023-01-13
Applicant: CIENA CORPORATION
Inventor： Russell Mays
CPC classification number: H01R12/57 , H01R25/006 , H01R43/0256 , H05K1/0228 , H05K1/113 , H05K1/181 , H05K2201/09227 , H05K2201/09409 , H05K2201/09481 , H05K2201/09609 , H05K2201/10189 , H05K2201/10545
Abstract: Aspects of the subject disclosure may include, for example, a device including a connector having a connector body and one or more rows of pins, where the connector facilitates a pluggable connection to an electrical cable or pluggable transceiver, where at least one of the one or more rows of pins includes a first group of the pins extending in a first direction and a second group of the pins extending in a second, different direction. The device includes a host board having vias, where at least a portion of the first and second groups of pins are connected with a portion of the vias by way of solder joints. Other embodiments are disclosed.
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5.发明公开公开(公告)号：US20240171839A1
公开(公告)日：2024-05-23
申请号：US18428017
申请日：2024-01-31
Applicant: LG INNOTEK CO., LTD.
Inventor： Hae Sik KIM , So Hee CHOI , Jee Heum PAIK , Na Kyung KWON
CPC classification number: H04N23/54 , H04N23/57 , H05K1/181 , H05K1/185 , H05K2201/0338 , H05K2201/09409 , H05K2201/10121 , H05K2201/10151 , H05K2201/10969
Abstract: A circuit board includes an insulating portion and a pattern portion on the insulating portion. The insulating portion includes a first insulating region and a second insulating region outside the first insulating region and spaced apart from the first insulating region with a separation region therebetween. The pattern portion includes a first pattern portion for signal transmission and a second pattern portion including a dummy pattern separated from the first pattern portion. The first pattern portion includes a first terminal portion on the first insulating region, a second terminal portion on the second insulating region, and a connection portion on the separation region and connecting between the first terminal portion and the second terminal portion. The second pattern portion includes a second-first pattern portion on the first insulating region and a second-second pattern portion on the second insulating region and separated from the second-first pattern portion.
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Patent Agency Ranking
公开(公告)号：US20240128665A1
公开(公告)日：2024-04-18
申请号：US17966073
申请日：2022-10-14
Applicant: Min Di Consultants Ltd.
Inventor： Chi-Di LEE
CPC classification number: H01R12/613 , H01R12/65 , H01R12/7082 , H01R12/72 , H01R31/06 , H05K1/189 , H05K2201/09236 , H05K2201/094 , H05K2201/09409 , H05K2201/09609 , H05K2201/10189 , H05K2201/10234
Abstract: A flexible connecting structure comprises a first circuit board and a second circuit board. The second circuit board is configured on a bottom of the first circuit hoard. A plurality of first signal traces configured longitudinally on the first circuit board. A plurality of second signal traces configured longitudinally on the second circuit board. A first end of the first circuit board and a first end of the second circuit board is fixed with each other through a plurality of metal balls, and a second end of the second circuit board floats, deflectable up and down.
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公开(公告)号：US11955740B2
公开(公告)日：2024-04-09
申请号：US17835530
申请日：2022-06-08
Applicant: Hitachi Metals, Ltd.
Inventor： Ryuta Takahashi
CPC classification number: H01R12/53 , A61M39/10 , H01R43/0263 , H05K1/11 , H05K1/18 , A61M2039/1022 , H01R4/023 , H01R4/04 , H05K2201/094 , H05K2201/09409 , H05K2201/09445 , H05K2201/10287 , H05K2201/10356
Abstract: An electric wire connection structure is composed of insulated electric wires each including a core and an insulation coating covering the core. The cores of the insulated electric wires are connected to pads provided on a substrate. The insulated electric wires are arranged along a predetermined alignment direction and arranged parallel to each other. The insulation coating is removed at a part in a longitudinal direction of each of the insulated electric wires to expose the core. Exposed portions of the cores are connected to the pads, respectively. Some of the insulated electric wires are configured in such a manner that the core is exposed in an area where the insulation coatings of adjacent ones of the other insulated electric wires in the alignment direction are not removed.
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公开(公告)号：US20240032192A1
公开(公告)日：2024-01-25
申请号：US18343772
申请日：2023-06-29
Applicant: Innolux Corporation
Inventor： Zhi-Fu Huang
CPC classification number: H05K1/111 , H05K3/32 , H05K2201/0317 , H05K2201/09409 , H05K2201/07
Abstract: An electronic device, including multiple electronic elements, a first substrate, a second substrate, and a third substrate, is provided. The first substrate includes a first device element and a first connection pad. The second substrate includes a second device element and a second connection pad. The third substrate includes a first connection line, wherein the first connection pad and the second connection pad are coupled to the first connection line, and the first substrate, the second substrate, and the electronic elements are disposed on the third substrate.
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公开(公告)号：US11723147B2
公开(公告)日：2023-08-08
申请号：US17667486
申请日：2022-02-08
Applicant: KINGPAK TECHNOLOGY INC.
Inventor： Chia-Shuai Chang , Chien-Chen Lee , Jui-Hung Hsu
CPC classification number: H05K1/111 , G02B7/006 , G02B7/02 , H05K1/0274 , H05K2201/09409 , H05K2201/09445 , H05K2201/10121 , H05K2201/10151
Abstract: A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an electronic chip assembled to the circuit board, a sensor chip, a die attach film (DAF) pre-bonded onto the sensor chip, a plurality of wires electrically coupling the electronic chip and the sensor chip to the circuit board, a supporting adhesive layer, a light-permeable sheet, and an optical module that is fixed to the circuit board for surrounding the above components. The sensor chip is adhered to the electronic chip through the DAF such that a sensing region of the sensor chip is perpendicular to a central axis of the optical module. The supporting adhesive layer is in a ringed shape and is disposed on a top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip.
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公开(公告)号：US20230156916A1
公开(公告)日：2023-05-18
申请号：US17938403
申请日：2022-10-06
Applicant: InnoLux Corporation
Inventor： Shang-Ru WU , Hua-Pin CHEN , Shuai WANG , Chien-Hao KUO
CPC classification number: H05K1/111 , H05K1/117 , H05K1/181 , H05K2201/10128 , H05K2201/094 , H05K2201/09409 , H05K2201/09418 , H05K2201/09427 , H05K2201/10287
Abstract: An electronic device is provided, including a working area and a peripheral area. The peripheral area is adjacent to the working area. The peripheral area includes a bonding area. The bonding area includes a first bonding pad area. The first bonding pad area includes a plurality of first bonding pads. A part of the first bonding pads are arranged along a first direction, and another part of the first bonding pads are arranged along a second direction. There is an included angle between the first direction and the second direction, and the included angle is greater than 0 degrees and less than 90 degrees.
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