公开(公告)号：US4010885A

公开(公告)日：1977-03-08

申请号：US510207

申请日：1974-09-30

申请人： Alan S. Keizer ,  Hugh R. Harris

发明人： Alan S. Keizer ,  Hugh R. Harris

IPC分类号： H01L21/68 ,  G05G23/00 ,  H01L21/00 ,  H01L21/60

CPC分类号： H01L24/86 ,  H01L21/67138 ,  H01L21/67144 ,  H01L24/79 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14

摘要： Apparatus for accurately bonding leads to a semi-conductor die or the like includes a hitch feed and guide assembly for sequentially positioning each set of leads on a film carrier format over the die to be bonded to the leads. A micromanipulator adjusts the leads relative to the die prior to bonding. Displacement means provide unambiguous rectilinear separate movement of the bonding tool laterally into alignment with the lead and semi-conductor and then into contact with the leads to apply bonding heat and pressure.

公开(公告)号：US4300715A

公开(公告)日：1981-11-17

申请号：US113421

申请日：1980-01-18

申请人： Alan S. Keizer ,  Donald B. Brown

发明人： Alan S. Keizer ,  Donald B. Brown

IPC分类号： H01L21/00 ,  H01L21/60 ,  H01L21/603 ,  H05K13/04 ,  B23K1/12

CPC分类号： H01L24/81 ,  H01L21/67138 ,  H01L24/75 ,  H05K13/0408 ,  H05K13/0465 ,  H01L2224/75 ,  H01L2224/7565 ,  H01L2224/79 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/14

摘要： An assembly system for assembling microcomponents of semi-conductor or other electronic devices includes on a unitary machine frame the tooling for precision excising tape mounted microcomponents, precision forming their electrical leads, placement of the components in correct registration with conductors on a pre-positioned substrate, and bonding the formed leads to the conductors. Bonding is conducted by clamping the leads to the conductors at the bond site, moving a heated anvil into contact with a heat conductive path to the bond site and withdrawing the heated anvil while maintaining the clamping.

摘要翻译： 用于组装半导体或其他电子设备的微型组件的组装系统在整体机架上包括用于精密切割带安装的微型部件的工具，精确地形成其电引线，将组件与预定位衬底上的导体正确对准放置 并且将形成的引线接合到导体。 通过将引线夹在接合位置处的导体来进行接合，使加热的砧座与导热路径接触到接合位置，并在保持夹紧的同时取出加热的砧座。

公开(公告)号：US4025750A

公开(公告)日：1977-05-24

申请号：US644409

申请日：1975-12-29

申请人： Alan S. Keizer ,  Hans Strube ,  Harold Stewart

发明人： Alan S. Keizer ,  Hans Strube ,  Harold Stewart

IPC分类号： B23K20/02 ,  B23K35/02 ,  H01L21/60 ,  H01L21/603

CPC分类号： H01L24/80 ,  B23K20/025 ,  B23K35/0205 ,  H01L24/26 ,  H01L24/83 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19041

摘要： An electrode assembly for simultaneously welding all the leads of a semiconductor chip to an outer lead frame is disclosed. The electrode assembly includes a gross electrode opposed to a plurality of spot electrodes, and a plurality of parallelogram support members for the spot electrodes, and a housing. Each of the plurality of parallelogram support members includes a first leg fixedly attached to the housing and a second leg supporting one of the spot electrodes. Each of the second legs is resiliently deformable into a stressed position when the electrode supported thereby is biased against the work piece whereby each spot electrode is independently responsive to structural changes in the work piece and contact is maintained between the work piece and the spot electrodes during the entire welding operation.

摘要翻译： 公开了一种用于将半导体芯片的所有引线同时焊接到外部引线框架的电极组件。 电极组件包括与多个点电极相对的总电极和用于点电极的多个平行四边形支撑构件和壳体。 多个平行四边形支撑构件中的每一个包括固定地附接到壳体的第一腿部和支撑点电极之一的第二腿部。 当所支撑的电极被偏置在工件上时，每个第二腿可以弹性变形成应力位置，由此每个点电极独立地响应于工件中的结构变化，并且在工件和点电极之间保持接触 整个焊接操作。

公开(公告)号：US4593452A

公开(公告)日：1986-06-10

申请号：US705596

申请日：1985-02-26

申请人： Sammie G. Keahey ,  Alan S. Keizer ,  Thomas T. Lobb

发明人： Sammie G. Keahey ,  Alan S. Keizer ,  Thomas T. Lobb

IPC分类号： H01B13/012 ,  H01R43/00 ,  B21F27/00

CPC分类号： H01R43/00 ,  H01B13/012 ,  Y10T24/44034 ,  Y10T29/49174 ,  Y10T29/5142 ,  Y10T29/5145 ,  Y10T29/53243

摘要： Apparatus for manufacturing wiring harnesses employs a robot mounted above a harness board with storage areas for jigs, connectors, wire dispensers, and insertion tooling about the periphery thereof for easy pickup by robotic gripper, which positions jigs and connectors and laces wire from a wire dispensing assembly through the jigs before terminating and severing wire. Dispensing assembly comprises a dispenser which gripper picks up from a bracket in a holder to draw wire from endless source to lace the harness. The holder has wire feed wheels and a severing mechanism therein which may be used with a choice of dispensers in order to use different color or size wire. After termination and severing, pivoted platforms on wire jigs eject wire scraps from around lacing posts fixed on the jigs.

摘要翻译： 用于制造线束的装置使用安装在线束板上方的机器人，其具有用于夹具，连接器，配线器的存储区域以及围绕其周边的插入工具，以便通过机器人夹具容易地拾取，所述机器人夹具将夹具和连接器和线从线分配 在终止和切断电线之前通过夹具组装。 分配组件包括分配器，其夹持器从保持器中的支架拾取，以从无尽的源拉出线以使线束花掉。 保持器具有送丝轮和其中的切断机构，其可以与选择的分配器一起使用，以便使用不同的颜色或尺寸的线。 终止和切断后，电线夹具上的枢轴平台将钢丝屑从固定在夹具上的鞋带柱上排出。

公开(公告)号：US3949925A

公开(公告)日：1976-04-13

申请号：US511835

申请日：1974-10-03

申请人： Alan S. Keizer ,  Hugh R. Harris

发明人： Alan S. Keizer ,  Hugh R. Harris

IPC分类号： H01L21/00 ,  H01L21/60 ,  H05K3/32

CPC分类号： H01L24/86 ,  H01L21/67144 ,  H01L24/79 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49121

摘要： Bonding apparatus bonds inner leads on a film carrier to outer leads. Outer lead frame stock and the film carrier bearing the inner leads and dies are fed to the bonding site. A set of inner leads and the die thereto bonded is punched from the film carrier and moved to the bonding position in a manner such that the inner leads are aligned with the outer leads. A bonding tool effects the bond. Thereafter, the next set of outer leads and inner leads and die are advanced to the bonding site.

公开(公告)号：US4166562A

公开(公告)日：1979-09-04

申请号：US829837

申请日：1977-09-01

申请人： Alan S. Keizer ,  Donald B. Brown

发明人： Alan S. Keizer ,  Donald B. Brown

IPC分类号： H01L21/00 ,  H01L21/60 ,  H01L21/603 ,  H05K13/04 ,  H01L21/98

CPC分类号： H01L24/81 ,  H01L21/67138 ,  H01L24/75 ,  H05K13/0408 ,  H05K13/0465 ,  H01L2224/75 ,  H01L2224/79 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/14 ,  Y10T29/53183

摘要： An assembly system for assembling microcomponents of semi-conductor or other electronic devices includes on a unitary machine frame the tooling for precision excising tape mounted microcomponents, precision forming their electrical leads, placement of the components in correct registration with conductors on a pre-positioned substrate, and bonding the formed leads to the conductors.

摘要翻译： 用于组装半导体或其他电子设备的微型组件的组装系统在整体机架上包括用于精密切割带安装的微型部件的工具，精确地形成其电引线，将组件与预定位衬底上的导体正确对准放置 并且将形成的引线接合到导体。

公开(公告)号：US4015763A

公开(公告)日：1977-04-05

申请号：US637921

申请日：1975-12-05

申请人： Alan S. Keizer

发明人： Alan S. Keizer

IPC分类号： H01L21/00 ,  H01L21/60 ,  B65H17/40

CPC分类号： H01L24/86 ,  H01L21/67138 ,  H01L21/67144 ,  H01L24/79 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082

摘要： A hitch feed assembly for automatically aligning individual lead frames at a bonding site in both the longitudinal and lateral directions is disclosed. The alignment is attained as a result of the cooperation between a plurality of chamfered pawls and the sprocket holes in the film-carrier. The pawls are chamfered along three sides in order to attain alignment in both the longitudinal and lateral directions. Significantly, the pawls come into operational contact with the sprocket holes while the lead frame film-carrier is under minimal tension so that the pressure exerted on the edges of the sprocket holes by the pawls will be minimal, thereby avoiding any deformation in the shape of the sprocket holes.

摘要翻译： 公开了一种用于在纵向和横向上的粘结部位处自动对准单个引线框架的连接进给组件。 由于多个倒角棘爪与胶片载体中的链轮孔之间的配合，所以对准是可以实现的。 棘爪沿着三个侧面被倒角，以便在纵向和横向方向上获得对准。 显着地，当引线框架薄膜载体处于最小的张力下时，棘爪与链轮孔进行操作接触，使得由棘爪施加在链轮孔的边缘上的压力将是最小的，从而避免任何形状变形 链轮孔。