Method and apparatus for monitoring, dosing and distribution of chemical solutions
    3.
    发明申请
    Method and apparatus for monitoring, dosing and distribution of chemical solutions 审中-公开
    用于监测,配量和分配化学溶液的方法和设备

    公开(公告)号:US20050051433A1

    公开(公告)日:2005-03-10

    申请号:US10827596

    申请日:2004-04-19

    摘要: It is an object of the present invention to provide a system and method for monitoring, dosing and distribution of a chemical composition in a material treatment process, the chemical composition containing at least one additive for maintaining quality of the chemical treatment process. The system and method include: at least one chemical containing unit configured to contain the chemical composition for the chemical treatment process; a dosing unit fluidly communicating with the at least one chemical containing unit configured to receive the chemical composition therefrom and to add a selected dose of the at least one additive to the chemical composition therein; an online monitor configured to monitor a property of the chemical composition at the dosing unit and to transmit a signal corresponding to the monitored property; and a controller programmed and configured to receive the signal from the online monitor and send a signal to the dosing system to add the selected dose to the chemical composition therein in response to the monitored property.

    摘要翻译: 本发明的目的是提供一种用于在材料处理过程中监测,计量和分配化学组合物的系统和方法,所述化学组合物含有至少一种用于维持化学处理过程质量的添加剂。 该系统和方法包括:至少一种含化学物质的单元,其构造成含有用于化学处理过程的化学组成; 与所述至少一个化学容纳单元流体连通的配量单元,其被配置为从其接收化学组合物,并向其中的化学组合物中加入选定剂量的至少一种添加剂; 在线监视器,其被配置为监视在所述计量单元处的化学成分的属性并传送对应于所监视的属性的信号; 以及控制器,其被编程和配置成从在线监视器接收信号,并且向所述计量系统发送信号,以响应所监视的属性将所选择的剂量添加到其中的化学成分。

    Method and apparatus for retrofitting existing real time control systems for monitoring, controlling, and distributing chemicals during electroplating
    4.
    发明申请
    Method and apparatus for retrofitting existing real time control systems for monitoring, controlling, and distributing chemicals during electroplating 审中-公开
    用于改造现有实时控制系统的方法和装置,用于在电镀期间监测,控制和分配化学品

    公开(公告)号:US20060172427A1

    公开(公告)日:2006-08-03

    申请号:US11296067

    申请日:2005-12-07

    IPC分类号: G01N33/00

    摘要: Chemical treatment process control, including a virtual sensor based upon artificial intelligence that automatically computes and predicts additive concentrations in chemical baths used in manufacturing to compensate for the lag time in obtaining data from real-time analyzers (RTA). Once actual measurement data is obtained, bath concentrations can be further adjusted if necessary. Also disclosed is the retrofitting of a RTA with a controller where the data signal from the RTA has a proprietary communication protocol that is converted by hardware and/or software into a signal having an open communication protocol for transmission to the controller for controlling electrochemical bath concentration. Further disclosed is a method of controlling chemical concentration of electrochemical baths by predicting the depletion of chemicals during manufacture and causing dosing and/or draining of a portion of the bath during the time delay between RTA analyses. An algorithm written into program language and compiled into an executable format can be used in the controllers.

    摘要翻译: 化学处理过程控制,包括基于人工智能的虚拟传感器,其自动计算和预测制造中使用的化学浴液中的添加剂浓度,以补偿从实时分析仪(RTA)获得数据的滞后时间。 一旦得到实际的测量数据,如有必要,可以进一步调整浴浓度。 还公开了一种具有控制器的RTA的改进,其中来自RTA的数据信号具有由硬件和/或软件转换成具有开放通信协议的信号的专有通信协议,用于传输到控制器以控制电化学浴浓度 。 进一步公开的是通过预测制造期间化学品的耗尽并且在RTA分析之间的时间延迟期间引起部分浴的计量和/或排水来控制电化学浴的化学浓度的方法。 编写程序语言并编译成可执行格式的算法可以在控制器中使用。