-
1.发明授权公开(公告)号：US07396022B1
公开(公告)日：2008-07-08
申请号：US10952590
申请日：2004-09-28
IPC分类号： B23B31/30
CPC分类号： B23B31/307 , H01L21/6838 , Y10T279/11
摘要： The present invention is a chuck having a vacuum groove that is capable of holding a wafer as the chuck rotates on a spindle. As the chuck rotates the air pressure above the center of the wafer is reduced. In order to reduce the bowing of the wafer that can result from this low pressure area above the wafer, the present invention introduces venturi holes in the chuck which reduces the air pressure in the area below the wafer. In order to prevent the air pressure in the area below the wafer from decreasing too far, the present invention uses air inlet holes to balance the affect of the venturi holes in order to substantially balance the air pressure above and below the wafer which results in significantly less bowing of the wafer when compared to conventional systems. The present invention accomplishes this without requiring sensors or other active measuring devices to help reduce the bowing of the wafer.
摘要翻译： 本发明是一种卡盘，其具有当卡盘在主轴上旋转时能够保持晶片的真空槽。 随着卡盘旋转，晶片中心之上的空气压力降低。 为了减少由晶片上方的该低压区域引起的晶片的弯曲，本发明在卡盘中引入文丘里孔，这降低了晶片下面区域的空气压力。 为了防止晶片下面的区域中的空气压力减小太过分，本发明使用空气入口孔来平衡文丘里孔的影响，以便基本平衡晶片上方和下方的空气压力，这导致显着的 与常规系统相比，晶圆的弯曲较少。 本发明实现这一点，而不需要传感器或其他有源测量装置来帮助减少晶片的弯曲。
-
2.发明授权公开(公告)号：US08823935B1
公开(公告)日：2014-09-02
申请号：US12556596
申请日：2009-09-10
申请人： Steven W. Meeks , Xiaoqian Xu , Hung P. Nguyen , Alireza Shahdoost Moghadam , Mahendra Prabhu Ramachandran
发明人： Steven W. Meeks , Xiaoqian Xu , Hung P. Nguyen , Alireza Shahdoost Moghadam , Mahendra Prabhu Ramachandran
IPC分类号： G01N21/00
CPC分类号： G01N21/8806 , G01N2021/8845 , G01N2021/8848 , G01N2021/8854
摘要： A system to detect and classify defects on a surface of a substrate. A first targeting assembly directs radiation in a first beam onto the substrate. A first collecting assembly collects first radiation specularly reflected from the substrate and produces first signals, a second collecting assembly collects first radiation scattered from the surface of the substrate by defects and not micro-roughness and produces second signals, and a third collecting assembly collects first radiation scattered from the surface of the substrate by defects and micro-roughness and produces third signals. A second targeting assembly directs radiation in a second beam onto the substrate. A fourth collecting assembly collects second radiation scattered from the substrate and produces fourth signals. A processor receives the first, second, third, and fourth signals. A module coupled to the processor has logic instructions stored in a computer-readable medium, which configure the processor to analyze the signals to detect and classify the defects on the substrate.
摘要翻译： 用于检测和分类衬底表面上的缺陷的系统。 第一瞄准组件将第一光束中的辐射引导到衬底上。 第一收集组件收集从衬底反射的第一辐射并产生第一信号，第二收集组件通过缺陷而不是微粗糙度收集从衬底的表面散射的第一辐射，并产生第二信号，并且第三收集组件首先收集 通过缺陷和微粗糙度从基板的表面散射的辐射产生第三信号。 第二瞄准组件将第二射束中的辐射引导到衬底上。 第四收集组件收集从衬底散射的第二辐射并产生第四信号。 处理器接收第一，第二，第三和第四信号。 耦合到处理器的模块具有存储在计算机可读介质中的逻辑指令，其配置处理器来分析信号以检测和分类衬底上的缺陷。
-
公开(公告)号：US07362425B2
公开(公告)日：2008-04-22
申请号：US11387952
申请日：2006-03-23
IPC分类号： G01N21/00
CPC分类号： G01B11/303 , G01N21/9501
摘要： In one embodiment, a system to inspect a surface comprises an assembly to direct a first radiation beam onto a surface in a first plane of incidence, a first detector to generate a first signal from a portion of the radiation reflected from the first radiation beam, a first spatial filter interposed between the surface and the first detector, a first ellipsoidal mirror to collect scattered light, a second detector to generate a second signal from the scattered portion of the beam, and a processor to generate, from the first and second signals, a data set representing one or more characteristics of the surface using the first and second signals.
摘要翻译： 在一个实施例中，用于检查表面的系统包括将第一辐射束引导到第一入射入射面中的表面的组件，第一检测器，用于从第一辐射束反射的辐射的一部分产生第一信号， 介于所述表面和所述第一检测器之间的第一空间滤光器，用于收集散射光的第一椭圆面镜，从所述光束的散射部分产生第二信号的第二检测器，以及处理器，用于从所述第一和第二信号 使用第一和第二信号表示表面的一个或多个特征的数据集。
-
-
搜索结果
3 条记录 (耗时 0.011 秒)
