Detecting and classifying surface defects with multiple radiation collectors
    1.
    发明授权
    Detecting and classifying surface defects with multiple radiation collectors 有权
    用多个辐射收集器检测和分类表面缺陷

    公开(公告)号:US08823935B1

    公开(公告)日:2014-09-02

    申请号:US12556596

    申请日:2009-09-10

    IPC分类号: G01N21/00

    摘要: A system to detect and classify defects on a surface of a substrate. A first targeting assembly directs radiation in a first beam onto the substrate. A first collecting assembly collects first radiation specularly reflected from the substrate and produces first signals, a second collecting assembly collects first radiation scattered from the surface of the substrate by defects and not micro-roughness and produces second signals, and a third collecting assembly collects first radiation scattered from the surface of the substrate by defects and micro-roughness and produces third signals. A second targeting assembly directs radiation in a second beam onto the substrate. A fourth collecting assembly collects second radiation scattered from the substrate and produces fourth signals. A processor receives the first, second, third, and fourth signals. A module coupled to the processor has logic instructions stored in a computer-readable medium, which configure the processor to analyze the signals to detect and classify the defects on the substrate.

    摘要翻译: 用于检测和分类衬底表面上的缺陷的系统。 第一瞄准组件将第一光束中的辐射引导到衬底上。 第一收集组件收集从衬底反射的第一辐射并产生第一信号,第二收集组件通过缺陷而不是微粗糙度收集从衬底的表面散射的第一辐射,并产生第二信号,并且第三收集组件首先收集 通过缺陷和微粗糙度从基板的表面散射的辐射产生第三信号。 第二瞄准组件将第二射束中的辐射引导到衬底上。 第四收集组件收集从衬底散射的第二辐射并产生第四信号。 处理器接收第一,第二,第三和第四信号。 耦合到处理器的模块具有存储在计算机可读介质中的逻辑指令,其配置处理器来分析信号以检测和分类衬底上的缺陷。