公开(公告)号：US11189770B2

公开(公告)日：2021-11-30

申请号：US16374372

申请日：2019-04-03

申请人： Andrey Zykin ,  Alcinda Miller ,  Stephen Miller

发明人： Andrey Zykin ,  Alcinda Miller ,  Stephen Miller

IPC分类号： H01L33/64 ,  H01L33/54 ,  H01L33/48 ,  H01L23/00

摘要： A new method, system and apparatus for mounting mechanically, thermally and electrically light emitting diode (LED), crystals, arrays or packages. The above provides an LED assembly having reduced number of components and costs, superior heat dissipation, mechanical properties and a compact structure. The use of a grid or mesh allows for more efficient and inexpensive removal of heat from one or more LEDs within an LED fixture.

公开(公告)号：US10128426B1

公开(公告)日：2018-11-13

申请号：US14989184

申请日：2016-01-06

申请人： Andrey Zykin ,  Alcinda Miller

发明人： Andrey Zykin ,  Alcinda Miller

IPC分类号： H01L33/62 ,  H01L33/64 ,  H01L25/075

摘要： The present invention relates to a new method, system and apparatus for light emitting diode (LED) packages. An object of the present invention is to provide an LED package having reduced components, a superior heat dissipation property and a compact structure that is easy to assemble, does not largely restrict use of conventional equipment for its manufacture, and is compatible with implementation within present illumination devices packaging.

公开(公告)号：US20140131741A1

公开(公告)日：2014-05-15

申请号：US14076682

申请日：2013-11-11

申请人： Andrey Zykin ,  Alcinda Miller

发明人： Andrey Zykin ,  Alcinda Miller

IPC分类号： H01L33/50 ,  H01L33/52

CPC分类号： H01L33/647 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014

摘要： The present invention relates to a new method, system and apparatus for light emitting diode (LED) packages. An object of the present invention is to provide an LED package having reduced components, a superior heat dissipation property and a compact structure, does not largely restrict use of conventional equipment for its manufacture, and is compatible with implementation within present illumination devices packaging.

摘要翻译： 本发明涉及一种用于发光二极管（LED）封装的新方法，系统和装置。 本发明的目的是提供一种具有减少的部件，优异的散热性能和紧凑结构的LED封装不会大大限制其用于制造的常规设备的使用，并且与本发明的照明装置封装内的实施兼容。

公开(公告)号：US20200321500A1

公开(公告)日：2020-10-08

申请号：US16374372

申请日：2019-04-03

申请人： Andrey Zykin ,  Alcinda Miller ,  Stephen Miller

发明人： Andrey Zykin ,  Alcinda Miller ,  Stephen Miller

IPC分类号： H01L33/64 ,  H01L33/54 ,  H01L33/48 ,  H01L23/00

摘要： A new method, system and apparatus for mounting mechanically, thermally and electrically light emitting diode (LED), crystals, arrays or packages. The above provides an LED assembly having reduced number of components and costs, superior heat dissipation, mechanical properties and a compact structure. The use of a grid or mesh allows for more efficient and inexpensive removal of heat from one or more LEDs within an LED fixture.

公开(公告)号：US10043783B1

公开(公告)日：2018-08-07

申请号：US14997606

申请日：2016-01-18

申请人： Andrey Zykin ,  Alcinda Miller

发明人： Andrey Zykin ,  Alcinda Miller

IPC分类号： H01L25/075 ,  H01L33/52 ,  H01L33/62 ,  H01L33/50 ,  H01L33/64 ,  F21K99/00 ,  H01L33/58 ,  F21Y101/02

摘要： The present invention relates to a new method, system and apparatus for light emitting diode (LED) packages. An object of the present invention is to provide an LED package having reduced components, a superior heat dissipation property and a compact structure, does not largely restrict use of conventional equipment for its manufacture, and is compatible with implementation within present illumination devices packaging.

公开(公告)号：US20140131742A1

公开(公告)日：2014-05-15

申请号：US14076711

申请日：2013-11-11

申请人： Andrey Zykin ,  Alcinda Miller

发明人： Andrey Zykin ,  Alcinda Miller

IPC分类号： H01L33/64

CPC分类号： H01L33/647 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014

摘要： The present invention relates to a new method, system and apparatus for light emitting diode (LED) packages. An object of the present invention is to provide an LED package having reduced components, a superior heat dissipation property and a compact structure, does not largely restrict use of conventional equipment for its manufacture, and is compatible with implementation within present illumination devices packaging.

摘要翻译： 本发明涉及一种用于发光二极管（LED）封装的新方法，系统和装置。 本发明的目的是提供一种具有减少的部件，优异的散热性能和紧凑结构的LED封装不会大大限制其用于制造的常规设备的使用，并且与本发明的照明装置封装内的实施兼容。

公开(公告)号：US10256389B1

公开(公告)日：2019-04-09

申请号：US15790094

申请日：2017-10-23

申请人： Andrey Zykin ,  Alcinda Miller ,  Stephen Miller

发明人： Andrey Zykin ,  Alcinda Miller ,  Stephen Miller

IPC分类号： F21V23/06 ,  H01L33/64 ,  F21K9/272 ,  F21K9/90 ,  F21V23/00 ,  H01L25/075 ,  H01L33/62 ,  F21Y115/10 ,  F21Y103/10

摘要： A new method, system and apparatus for mounting mechanically, thermally and electrically light emitting diode (LED), crystals, arrays or packages. The above provides an LED assembly having reduced number of components and costs, superior heat dissipation, mechanical properties and a compact structure. The use of a grid or mesh allows for more efficient and inexpensive removal of heat from one or more LEDs within an LED fixture.

公开(公告)号：US09240538B2

公开(公告)日：2016-01-19

申请号：US14076682

申请日：2013-11-11

申请人： Andrey Zykin ,  Alcinda Miller

发明人： Andrey Zykin ,  Alcinda Miller

IPC分类号： H01L33/64 ,  H01L25/075 ,  H01L33/62

CPC分类号： H01L33/647 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014

摘要： The present invention relates to a new method, system and apparatus for light emitting diode (LED) packages. An object of the present invention is to provide an LED package having reduced components, a superior heat dissipation property and a compact structure, does not largely restrict use of conventional equipment for its manufacture, and is compatible with implementation within present illumination devices packaging.

摘要翻译： 本发明涉及一种用于发光二极管（LED）封装的新方法，系统和装置。 本发明的目的是提供一种具有减少的部件，优异的散热性能和紧凑结构的LED封装不会大大限制其用于制造的常规设备的使用，并且与本发明的照明装置封装内的实施兼容。