摘要:
An electronic device may have electrical components such as sensors. A sensor may have sensor circuitry that gathers sensor data using a conductive structure. The sensor may be a touch sensor that uses the conductive structure to form a capacitive touch sensor electrode or may be a fingerprint sensor that uses the conductive structure with a fingerprint electrode array to handle fingerprint sensor signals. Near field communications circuitry may be included in an electronic device. When operated in a sensor mode, the sensor circuitry may use the conductive structure to gather a fingerprint or other sensor data. When operated in near field communications mode, the near field communications circuitry can use the conductive structure to transmit and receive capacitively coupled or inductively coupled near field communications signals. A fingerprint sensor may have optical structures that communicate with external equipment.
摘要:
Electronic devices may be provided that have antenna traces. The antenna traces may be configured to form an inductive loop that serves as a near field communications antenna. A layer of ferrite may be provided to reduce interference between the antenna and internal device components. The layer of ferrite and the antenna traces may be deposited on a common substrate such as a layer of polymer or a dielectric electronic device housing. A protective layer of polymer may be used to form a coating on the layer of ferrite. Ferrite may be formed on the same side of a substrate as the antenna traces or may be formed on an opposing side of the substrate.
摘要:
Methods and systems for processing touch inputs are disclosed. The invention in one respect includes reading data from a multi-touch sensing device such as a multi-touch touch screen where the data pertains to touch input with respect to the multi-touch sensing device, and identifying at least one multi-touch gesture based on the data from the multi-touch sensing device and providing an appropriate multi-haptic response.
摘要:
The described embodiment relates generally to the field of adhesives. More specifically the described embodiment allows a thin adhesive layer to have additional properties not otherwise available in a homogenous adhesive layer. By combining a variety of adhesive material types into a thin interlocked adhesive layer, properties such as multi-surface adhesion, electrical conductivity, and thermal conductivity can be achieved in a robust adhesive layer.
摘要:
An electronic device may have a housing. A camera window assembly may be mounted in a hole within the housing. The housing may be formed from a structure such as a planar glass member. The hole in which the camera window assembly is formed may be circular. A mating circular trim member in the camera window assembly may be mounted in the hole. A flange structure on the trim member may help retain the trim member within the housing. A shelf portion of the trim member may receive a ring of adhesive. The camera window assembly may have a clear disk-shaped lens with planar opposing front and rear surfaces that is mounted on the shelf portion using the adhesive. An elastomeric ring may be compressed between sidewall portions of the trim member and the lens to help retain the lens within the camera window assembly.
摘要:
An electronic device may have a housing. A camera window assembly may be mounted in a hole within the housing. The housing may be formed from a structure such as a planar glass member. The hole in which the camera window assembly is formed may be circular. A mating circular trim member in the camera window assembly may be mounted in the hole. A flange structure on the trim member may help retain the trim member within the housing. A shelf portion of the trim member may receive a ring of adhesive. The camera window assembly may have a clear disk-shaped lens with planar opposing front and rear surfaces that is mounted on the shelf portion using the adhesive. An elastomeric ring may be compressed between sidewall portions of the trim member and the lens to help retain the lens within the camera window assembly.
摘要:
The underside of an inactive portion of a display cover layer in an electronic device may be covered with an opaque masking material. Openings in the opaque masking material may be form ambient light sensor and proximity sensor windows. An ambient light sensor window may be filled with a material that transmits at least some visible light. A proximity sensor window may be filled with a material that transmits more infrared light relative to visible light than the material in the ambient light sensor window. The materials in the ambient light sensor window and proximity sensor window may include one or more layers of ink, patterns of holes, layers of material that are shared with the opaque masking layer, and materials that are black, white, or other colors. A light guide structure may be used to route light received from a sensor window to an associated sensor.
摘要:
The underside of an inactive portion of a display cover layer in an electronic device may be covered with an opaque masking material. Openings in the opaque masking material may be form ambient light sensor and proximity sensor windows. An ambient light sensor window may be filled with a material that transmits at least some visible light. A proximity sensor window may be filled with a material that transmits more infrared light relative to visible light than the material in the ambient light sensor window. The materials in the ambient light sensor window and proximity sensor window may include one or more layers of ink, patterns of holes, layers of material that are shared with the opaque masking layer, and materials that are black, white, or other colors. A light guide structure may be used to route light received from a sensor window to an associated sensor.
摘要:
Electronic devices may be provided that have antenna traces. The antenna traces may be configured to form an inductive loop that serves as a near field communications antenna. A layer of ferrite may be provided to reduce interference between the antenna and internal device components. The layer of ferrite and the antenna traces may be deposited on a common substrate such as a layer of polymer or a dielectric electronic device housing. A protective layer of polymer may be used to form a coating on the layer of ferrite. Ferrite may be formed on the same side of a substrate as the antenna traces or may be formed on an opposing side of the substrate.
摘要:
An electronic device may have electrical components such as sensors. A sensor may have sensor circuitry that gathers sensor data using a conductive structure. The sensor may be a touch sensor that uses the conductive structure to form a capacitive touch sensor electrode or may be a fingerprint sensor that uses the conductive structure with a fingerprint electrode array to handle fingerprint sensor signals. Near field communications circuitry may be included in an electronic device. When operated in a sensor mode, the sensor circuitry may use the conductive structure to gather a fingerprint or other sensor data. When operated in near field communications mode, the near field communications circuitry can use the conductive structure to transmit and receive capacitively coupled or inductively coupled near field communications signals. A fingerprint sensor may have optical structures that communicate with external equipment.