公开(公告)号：US06192709B1

公开(公告)日：2001-02-27

申请号：US09239189

申请日：1999-01-28

申请人： Steven K. Groothuis

发明人： Steven K. Groothuis

IPC分类号： C03C2702

CPC分类号： H01L23/49811 ,  H01L21/4853 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S65/11 ,  Y10S65/12 ,  H01L2924/00

摘要： A method of embedding a magnetically attractable member (25) in a ceramic material (1) and a system therefor wherein there are provided a magnetically attractable member and a ceramic member capable of being placed in a molten state. The magnetically attractable member is disposed over the ceramic member and the ceramic member is placed in a molten state. The magnetically attractable member is then disposed in the molten ceramic member by magnetic attraction and the molten ceramic member is then hardened around the magnetically attractable member. The magnetically attractable member is taken from the class consisting of Alloy 42 and Kovar. The ceramic member is preferably a glass. The ceramic member is preferably disposed on a semiconductor package and the magnetically attractable member is preferably at least a portion of a semiconductor lead frame.

摘要翻译： 一种将磁性吸引构件（25）嵌入陶瓷材料（1）的方法及其系统，其中设置有可磁化的构件和能够处于熔融状态的陶瓷构件。 磁性吸引构件设置在陶瓷构件上方，并且陶瓷构件被置于熔融状态。 然后通过磁吸引将磁性吸引构件设置在熔融陶瓷构件中，然后熔融的陶瓷构件在磁性吸引构件周围硬化。 磁性吸引部件取自由合金42和科瓦尔组成的一类。 陶瓷构件优选为玻璃。 陶瓷构件优选地设置在半导体封装上，并且磁性可吸引构件优选地是半导体引线框架的至少一部分。

公开(公告)号：US20130119528A1

公开(公告)日：2013-05-16

申请号：US13613540

申请日：2012-09-13

申请人： Steven K. Groothuis ,  Jian Li ,  Haojun Zhang ,  Paul A. Silvestri ,  Xiao Li ,  Shijian Luo ,  Luke G. England ,  Brent Keeth ,  Jaspreet Gandhi

发明人： Steven K. Groothuis ,  Jian Li ,  Haojun Zhang ,  Paul A. Silvestri ,  Xiao Li ,  Shijian Luo ,  Luke G. England ,  Brent Keeth ,  Jaspreet Gandhi

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L23/36 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/3736 ,  H01L23/42 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2225/06589 ,  H01L2924/15311

摘要： Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a plurality of first semiconductor dies arranged in a stack and a second semiconductor die carrying the first semiconductor dies. The second semiconductor die can include a peripheral portion that extends laterally outward beyond at least one side of the first semiconductor dies. The semiconductor die assembly can further include a thermal transfer feature at the peripheral portion of the second semiconductor die. The first semiconductor dies can define a first thermal path, and the thermal transfer feature can define a second thermal path separate from the first semiconductor dies.

公开(公告)号：US5581489A

公开(公告)日：1996-12-03

申请号：US176820

申请日：1994-01-05

申请人： Steven K. Groothuis ,  Ming J. Hwang ,  Paul S. Blanton

发明人： Steven K. Groothuis ,  Ming J. Hwang ,  Paul S. Blanton

IPC分类号： G06F17/50 ,  G06T17/20 ,  G06F3/00

CPC分类号： G06T17/20 ,  G06F17/5018 ,  G06F2217/80

摘要： A model generator and method of generating a model of an object for use in finite element analysis is provided. The model generator (24) includes an input data storage (12) with an output coupled to an input of a materials information generator (14) and an input of a mesh processor (16). The materials information generator (14) has an output coupled to a second input of the mesh processor (16). The mesh processor (16) has an output coupled to a thermal conditions processor (18) and a second output coupled to an output generator (20). The thermal conditions processor (18) has an output coupled to a third input of the mesh processor (16). The output generator (20) has an output coupled to an input of an output storage (22).

摘要翻译： 提供了一种用于生成用于有限元分析的对象模型的模型生成器和方法。 模型发生器（24）包括具有耦合到材料信息发生器（14）的输入和网格处理器（16）的输入的输出的输入数据存储器（12）。 材料信息发生器（14）具有耦合到网格处理器（16）的第二输入的输出。 网格处理器（16）具有耦合到热条件处理器（18）的输出和耦合到输出发生器（20）的第二输出。 热条件处理器（18）具有耦合到网格处理器（16）的第三输入端的输出。 输出发生器（20）具有耦合到输出存储器（22）的输入的输出。

公开(公告)号：US07601562B2

公开(公告)日：2009-10-13

申请号：US11672297

申请日：2007-02-07

申请人： Steven K. Groothuis ,  Steven R. Smith ,  Steve Baughman ,  Bernard Ball ,  T. Michael O'Connor

发明人： Steven K. Groothuis ,  Steven R. Smith ,  Steve Baughman ,  Bernard Ball ,  T. Michael O'Connor

IPC分类号： H05K5/06

CPC分类号： H01L23/4951 ,  H01L23/3107 ,  H01L23/49544 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, the invention provides a microelectronic component assembly that includes spaced-apart first and second lead frame members. A packaged element is disposed between the lead frame members and attached thereto only by a plurality of elongate, flexible links that permit the packaged element to accommodate thermally induced stresses by floating with respect to the first and second lead frame members.

摘要翻译： 本公开提出了用于制造微电子部件组件的各种微电子部件组件设计和方法。 在一个具体实施方式中，本发明提供一种微电子部件组件，其包括间隔开的第一和第二引线框架部件。 封装元件设置在引线框架构件之间并且仅通过多个细长的柔性连接件连接，其允许封装元件通过相对于第一引线框架构件和第二引线框架构件浮动来适应热引起的应力。

公开(公告)号：US09153520B2

公开(公告)日：2015-10-06

申请号：US13613540

申请日：2012-09-13

申请人： Steven K. Groothuis ,  Jian Li ,  Haojun Zhang ,  Paul A. Silvestri ,  Xiao Li ,  Shijian Luo ,  Luke G. England ,  Brent Keeth ,  Jaspreet Gandhi

发明人： Steven K. Groothuis ,  Jian Li ,  Haojun Zhang ,  Paul A. Silvestri ,  Xiao Li ,  Shijian Luo ,  Luke G. England ,  Brent Keeth ,  Jaspreet Gandhi

IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/42 ,  H01L25/065 ,  H01L25/18

CPC分类号： H01L23/36 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/3736 ,  H01L23/42 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2225/06589 ,  H01L2924/15311

摘要： Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a plurality of first semiconductor dies arranged in a stack and a second semiconductor die carrying the first semiconductor dies. The second semiconductor die can include a peripheral portion that extends laterally outward beyond at least one side of the first semiconductor dies. The semiconductor die assembly can further include a thermal transfer feature at the peripheral portion of the second semiconductor die. The first semiconductor dies can define a first thermal path, and the thermal transfer feature can define a second thermal path separate from the first semiconductor dies.

摘要翻译： 本文公开了具有多个热路径和相关系统和方法的堆叠的半导体管芯组件。 在一个实施例中，半导体管芯组件可以包括布置在堆叠中的多个第一半导体管芯和承载第一半导体管芯的第二半导体管芯。 第二半导体管芯可以包括横向向外延伸超过第一半导体管芯的至少一侧的周边部分。 半导体管芯组件还可以包括在第二半导体管芯的周边部分处的热传递特征。 第一半导体管芯可以限定第一热路径，并且热转移特征可以限定与第一半导体管芯分离的第二热路径。

公开(公告)号：US07183485B2

公开(公告)日：2007-02-27

申请号：US10386757

申请日：2003-03-11

申请人： Steven K. Groothuis ,  Steven R. Smith ,  Steve Baughman ,  Bernard Ball ,  T. Michael O'Connor

发明人： Steven K. Groothuis ,  Steven R. Smith ,  Steve Baughman ,  Bernard Ball ,  T. Michael O'Connor

IPC分类号： H05K5/06

CPC分类号： H01L23/4951 ,  H01L23/3107 ,  H01L23/49544 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, the invention provides a microelectronic component assembly that includes spaced-apart first and second lead frame members. A packaged element is disposed between the lead frame members and attached thereto only by a plurality of elongate, flexible links that permit the packaged element to accommodate thermally induced stresses by floating with respect to the first and second lead frame members.

摘要翻译： 本公开提出了用于制造微电子部件组件的各种微电子部件组件设计和方法。 在一个具体实施方式中，本发明提供一种微电子部件组件，其包括间隔开的第一和第二引线框架部件。 封装元件设置在引线框架构件之间并且仅通过多个细长的柔性连接件连接，其允许封装元件通过相对于第一引线框架构件和第二引线框架构件浮动来适应热引起的应力。

公开(公告)号：US5950069A

公开(公告)日：1999-09-07

申请号：US810956

申请日：1997-02-27

申请人： Steven K. Groothuis

发明人： Steven K. Groothuis

IPC分类号： H01L21/48 ,  H01L23/10 ,  H01L23/498 ,  H01L21/44 ,  H01L21/50

CPC分类号： H01L23/49811 ,  H01L21/4853 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S65/11 ,  Y10S65/12

摘要： A method of embedding a magnetically attractable member (25) in a ceramic material (1) and a system therefor wherein there are provided a magnetically attractable member and a ceramic member capable of being placed in a molten state. The magnetically attractable member is disposed over the ceramic member and the ceramic member is placed in a molten state. The magnetically attractable member is then disposed in the molten ceramic member by magnetic attraction and the molten ceramic member is then hardened around the magnetically attractable member. The magnetically attractable member is taken from the class consisting of Alloy 42 and Kovar. The ceramic member is preferably a glass. The ceramic member is preferably disposed on a semiconductor package and the magnetically attractable member is preferably at least a portion of a semiconductor lead frame.

摘要翻译： 一种将磁性吸引构件（25）嵌入陶瓷材料（1）的方法及其系统，其中设置有可磁化的构件和能够处于熔融状态的陶瓷构件。 磁性吸引构件设置在陶瓷构件上方，并且陶瓷构件被置于熔融状态。 然后通过磁吸引将磁性吸引构件设置在熔融陶瓷构件中，然后熔融的陶瓷构件在磁性吸引构件周围硬化。 磁性吸引部件取自由合金42和科瓦尔组成的一类。 陶瓷构件优选为玻璃。 陶瓷构件优选地设置在半导体封装上，并且磁性可吸引构件优选地是半导体引线框架的至少一部分。