Fin FET devices from bulk semiconductor and method for forming
    4.
    发明授权
    Fin FET devices from bulk semiconductor and method for forming 有权
    来自散装半导体的翅片FET器件及其形成方法

    公开(公告)号:US06642090B1

    公开(公告)日:2003-11-04

    申请号:US10063994

    申请日:2002-06-03

    IPC分类号: H01L218238

    摘要: The present invention thus provides a device structure and method for forming fin Field Effect Transistors (FETs) that overcomes many of the disadvantages of the prior art. Specifically, the device structure and method provides the ability to form finFET devices from bulk semiconductor wafers while providing improved wafer to wafer device uniformity. Specifically, the method facilitates the formation of finFET devices from bulk semiconductor wafers with improved fin height control. Additionally, the method provides the ability to form finFETs from bulk semiconductor while providing isolation between fins and between the source and drain region of individual finFETs. Finally, the method can also provide for the optimization of fin width. The device structure and methods of the present invention thus provide the advantages of uniform finFET fabrication while using cost effect bulk wafers.

    摘要翻译: 因此,本发明提供了克服现有技术的许多缺点的用于形成鳍状场效应晶体管(FET)的器件结构和方法。 具体地,器件结构和方法提供了从批量半导体晶片形成finFET器件的能力,同时提供改进的晶片到晶片器件的均匀性。 具体地说,该方法有助于从散装半导体晶片形成finFET器件,从而改进翅片高度控制。 此外,该方法提供了从散装半导体形成finFET的能力,同时提供散热片之间的隔离以及各个finFET的源极和漏极区域之间的隔离。 最后,该方法还可以提供翅片宽度的优化。 因此,本发明的器件结构和方法提供均匀的finFET制造的优点,同时使用成本效应的体晶片。