公开(公告)号：US20110309441A1

公开(公告)日：2011-12-22

申请号：US12819856

申请日：2010-06-21

Applicant: Matthias Stecher ,  Hans Weber ,  Lincoln O'Riain ,  Birgit von Ehrenwall

Inventor： Matthias Stecher ,  Hans Weber ,  Lincoln O'Riain ,  Birgit von Ehrenwall

IPC: H01L27/092 ,  H01L29/06 ,  H01L21/76

CPC classification number: H01L27/1207 ,  H01L21/187 ,  H01L21/743 ,  H01L21/76283 ,  H01L27/0251 ,  H01L27/1203 ,  H01L29/04 ,  H01L29/0878 ,  H01L29/1087 ,  H01L29/66681 ,  H01L29/7816

Abstract: An integrated semiconductor device is provided. The integrated semiconductor device has a first semiconductor region of a second conductivity type, a second semiconductor region of a first conductivity type forming a pn-junction with the first semiconductor region, a non-monocrystalline semiconductor layer of the first conductivity type arranged on the second semiconductor region, a first well and at least one second well of the first conductivity type arranged on the non-monocrystalline semiconductor layer and an insulating structure insulating the first well from the at least one second well and the non-monocrystalline semiconductor layer. Further, a method for forming a semiconductor device is provided.

Abstract translation: 提供集成半导体器件。 集成半导体器件具有第二导电类型的第一半导体区域，与第一半导体区域形成pn结的第一导电类型的第二半导体区域，布置在第二导电类型的第二导电类型的非单晶半导体层 半导体区域，布置在非单晶半导体层上的第一导电类型的第一阱和至少一个第二阱以及使第一阱与至少一个第二阱和非单晶半导体层绝缘的绝缘结构。 此外，提供了一种用于形成半导体器件的方法。

公开(公告)号：US08749018B2

公开(公告)日：2014-06-10

申请号：US12819856

申请日：2010-06-21

Applicant: Matthias Stecher ,  Hans Weber ,  Lincoln O'Riain ,  Birgit von Ehrenwall

Inventor： Matthias Stecher ,  Hans Weber ,  Lincoln O'Riain ,  Birgit von Ehrenwall

IPC: H01L21/70

CPC classification number: H01L27/1207 ,  H01L21/187 ,  H01L21/743 ,  H01L21/76283 ,  H01L27/0251 ,  H01L27/1203 ,  H01L29/04 ,  H01L29/0878 ,  H01L29/1087 ,  H01L29/66681 ,  H01L29/7816

Abstract: An integrated semiconductor device is provided. The integrated semiconductor device has a first semiconductor region of a second conductivity type, a second semiconductor region of a first conductivity type forming a pn-junction with the first semiconductor region, a non-monocrystalline semiconductor layer of the first conductivity type arranged on the second semiconductor region, a first well and at least one second well of the first conductivity type arranged on the non-monocrystalline semiconductor layer and an insulating structure insulating the first well from the at least one second well and the non-monocrystalline semiconductor layer. Further, a method for forming a semiconductor device is provided.

Abstract translation: 提供集成半导体器件。 集成半导体器件具有第二导电类型的第一半导体区域，与第一半导体区域形成pn结的第一导电类型的第二半导体区域，布置在第二导电类型的第二导电类型的非单晶半导体层 半导体区域，布置在非单晶半导体层上的第一导电类型的第一阱和至少一个第二阱以及使第一阱与至少一个第二阱和非单晶半导体层绝缘的绝缘结构。 此外，提供了一种用于形成半导体器件的方法。