公开(公告)号：US07988812B2

公开(公告)日：2011-08-02

申请号：US11711124

申请日：2007-02-27

申请人： Ki-Sang Kim ,  Kyue-Sang Choi ,  Byong-Kyu Seo ,  Soon-Chon Park

发明人： Ki-Sang Kim ,  Kyue-Sang Choi ,  Byong-Kyu Seo ,  Soon-Chon Park

IPC分类号： C23F1/00 ,  C23C16/00 ,  H01L21/306

CPC分类号： H01L21/67161 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67766 ,  Y10S414/135

摘要： A substrate treatment apparatus is provided. The substrate treatment apparatus includes a process room, a load port in which a container receiving wafers is disposed, and a wafer transfer module disposed between the load port and the process room to transfer the wafers between the load port and the process room. The wafer transfer module includes a first barrier, a second barrier extending from a first end of the first barrier or from a portion near the first end of the first barrier at a predetermined inclined angle with respect to the first barrier, and a third barrier extending from a second end of the first barrier or from a portion near the second end of the first barrier at a predetermined inclined angle. The load portion is provided along the first barrier. The process room includes a plurality of chambers arranged along the second and third barriers.

摘要翻译： 提供了一种基板处理装置。 基板处理装置包括处理室，其中设置有容纳晶片的容器的负载端口和设置在负载端口和处理室之间的晶片传送模块，以在载体端口和处理室之间传送晶片。 晶片传送模块包括第一屏障，从第一屏障的第一端或第一屏障的第一端附近的部分以相对于第一屏障预定的倾斜角延伸的第二屏障，以及第三屏障延伸 从第一屏障的第二端或从第一屏障的第二端附近的部分以预定的倾斜角度。 负载部分沿着第一屏障设置。 处理室包括沿着第二和第三屏障布置的多个室。

公开(公告)号：US20070217896A1

公开(公告)日：2007-09-20

申请号：US11711124

申请日：2007-02-27

申请人： Ki-Sang Kim ,  Kyue-Sang Choi ,  Byong-Kyu Seo ,  Soon-Chon Park

发明人： Ki-Sang Kim ,  Kyue-Sang Choi ,  Byong-Kyu Seo ,  Soon-Chon Park

IPC分类号： H01L21/677 ,  B66C23/00 ,  B05C13/00

CPC分类号： H01L21/67161 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67766 ,  Y10S414/135

摘要： A substrate treatment apparatus is provided. The substrate treatment apparatus includes a process room, a load port in which a container receiving wafers is disposed, and a wafer transfer module disposed between the load port and the process room to transfer the wafers between the load port and the process room. The wafer transfer module includes a first barrier, a second barrier extending from a first end of the first barrier or from a portion near the first end of the first barrier at a predetermined inclined angle with respect to the first barrier, and a third barrier extending from a second end of the first barrier or from a portion near the second end of the first barrier at a predetermined inclined angle. The load portion is provided along the first barrier. The process room includes a plurality of chambers arranged along the second and third barriers.

摘要翻译： 提供了一种基板处理装置。 基板处理装置包括处理室，其中设置有容纳晶片的容器的负载端口和设置在负载端口和处理室之间的晶片传送模块，以在载体端口和处理室之间传送晶片。 晶片传送模块包括第一屏障，从第一屏障的第一端或第一屏障的第一端附近的部分以相对于第一屏障预定的倾斜角延伸的第二屏障，以及第三屏障延伸 从第一屏障的第二端或从第一屏障的第二端附近的部分以预定的倾斜角度。 负载部分沿着第一屏障设置。 处理室包括沿着第二和第三屏障布置的多个室。