公开(公告)号：US20090091907A1

公开(公告)日：2009-04-09

申请号：US11905993

申请日：2007-10-09

申请人： Chung-Er Huang ,  Chien-Yu Huang

发明人： Chung-Er Huang ,  Chien-Yu Huang

IPC分类号： H05K9/00 ,  C23C30/00

CPC分类号： C23C28/00 ,  H05K1/0218 ,  H05K1/181 ,  H05K3/284 ,  H05K9/003 ,  H05K9/0032 ,  H05K9/0084 ,  H05K2203/1476

摘要： A shielding structure for electronic components includes a circuit board, at least one electronic module disposed on the circuit board and electrically connected thereto, at least one first covering layer, at least one shielding layer, and one second covering layer. Each first covering layer covers one electronic module and each first covering layer is covered by the shielding layer. The second covering layer covers the shielding layers. In the above-mentioned structure, the shielding layer is formed by coating or printing on the first covering layer in order to shield the electromagnetic radiation emitted by the function module. The time and the costs required for the manufacture of the above invention are reduced compared to the prior art.

摘要翻译： 一种用于电子部件的屏蔽结构，包括电路板，至少一个电子模块，设置在电路板上并电连接到其上，至少一个第一覆盖层，至少一个屏蔽层和一个第二覆盖层。 每个第一覆盖层覆盖一个电子模块，并且每个第一覆盖层被屏蔽层覆盖。 第二覆盖层覆盖屏蔽层。 在上述结构中，屏蔽层通过在第一覆盖层上进行涂布或印刷而形成，以屏蔽由功能模块发射的电磁辐射。 与现有技术相比，制造上述发明所需的时间和成本降低。

公开(公告)号：US08242381B2

公开(公告)日：2012-08-14

申请号：US11856223

申请日：2007-09-17

申请人： Chung-Er Huang ,  Chien-Yu Huang

发明人： Chung-Er Huang ,  Chien-Yu Huang

IPC分类号： H05K1/11

CPC分类号： H01L23/66 ,  H01L2924/0002 ,  H01L2924/00

摘要： A through-hole structure for a wafer level packaging includes a wafer, a RF passage penetrating through the wafer, and a through-hole structure disposed around the RF passage. The through-hole structure has three types of structure. The through hole structure includes a plurality of holes filled with metal material thereinside. On the other hand, the through hole structure can be a plurality of holes coated with a metal layer on the internal surface thereof. Alternatively, the through hole structure has both of the two above hole structure. Depending on the structure, the through hole structure performs an electric reference for preventing the RF signal from decay or interference.

摘要翻译： 用于晶片级封装的通孔结构包括晶片，穿透晶片的RF通道和设置在RF通道周围的通孔结构。 通孔结构有三种结构。 通孔结构包括多个填充有金属材料的孔。 另一方面，通孔结构可以是在其内表面上涂覆有金属层的多个孔。 或者，通孔结构具有上述两个孔结构。 根据结构，通孔结构执行用于防止RF信号衰减或干扰的电参考。

公开(公告)号：USD647864S1

公开(公告)日：2011-11-01

申请号：US29381721

申请日：2010-12-22

申请人： Chien-Yu Huang ,  Pu-Cheng Yeh ,  Chen-Chi Tseng ,  Zhi-Yuan Liang

设计人： Chien-Yu Huang ,  Pu-Cheng Yeh ,  Chen-Chi Tseng ,  Zhi-Yuan Liang

公开(公告)号：US07946058B2

公开(公告)日：2011-05-24

申请号：US12015327

申请日：2008-01-16

申请人： Daniel A. Johnson ,  Chien-Yu Huang

发明人： Daniel A. Johnson ,  Chien-Yu Huang

IPC分类号： A43B1/10

CPC分类号： A43B13/141 ,  A43B3/0057 ,  A43B13/12 ,  A43B13/122 ,  A43B13/125 ,  A43B13/16

摘要： An article of footwear may have an upper and a sole structure secured to the upper. The sole structure includes a midsole and an outsole. The midsole has an upper surface and an opposite lower surface. The upper surface defines a plurality of depressions, and the lower surface defines a plurality of indentations extending toward the depressions. The outsole forms projections that extend into the indentations of the midsole, and the outsole has grooves located opposite the projections.

摘要翻译： 鞋类物品可以具有固定到鞋面的鞋底和鞋底结构。 鞋底结构包括中底和外底。 中底具有上表面和相对的下表面。 上表面限定多个凹陷，并且下表面限定朝向凹部延伸的多个凹陷。 外底形成延伸到中底凹陷中的突起，并且外底具有与突起相对的凹槽。

公开(公告)号：US07841108B2

公开(公告)日：2010-11-30

申请号：US11754772

申请日：2007-05-29

申请人： Daniel A. Johnson ,  Chien-Yu Huang ,  Hui-Chin Chen

发明人： Daniel A. Johnson ,  Chien-Yu Huang ,  Hui-Chin Chen

IPC分类号： A43B23/00 ,  A43B13/18

CPC分类号： A43B13/181 ,  A43B1/0027 ,  A43B1/0072 ,  A43B3/0078 ,  A43B21/26 ,  A43B23/24

摘要： An article of footwear with a sole system including a transparent heel portion is disclosed. The transparent heel portion includes a cavity configured to receive a support member comprising a plurality of support columns and an indicia member associated with the support member. The indicia and the support member are both visible along a bottom surface of the heel portion.

摘要翻译： 公开了一种具有包括透明鞋跟部分的鞋底系统的鞋类物品。 透明鞋跟部分包括构造成接收包括多个支撑柱的支撑构件和与支撑构件相关联的标记构件的空腔。 标记和支撑构件都沿跟部的底部表面可见。

公开(公告)号：US20090021329A1

公开(公告)日：2009-01-22

申请号：US11856223

申请日：2007-09-17

申请人： CHUNG-ER HUANG ,  CHIEN-YU HUANG

发明人： CHUNG-ER HUANG ,  CHIEN-YU HUANG

IPC分类号： H01P5/00

CPC分类号： H01L23/66 ,  H01L2924/0002 ,  H01L2924/00

摘要： A through-hole structure for a wafer level packaging includes a wafer, a RF passage penetrating through the wafer, and a through-hole structure disposed around the RF passage. The through-hole structure has three types of structure. The through hole structure includes a plurality of holes filled with metal material thereinside. On the other hand, the through hole structure can be a plurality of holes coated with a metal layer on the internal surface thereof. Alternatively, the through hole structure has both of the two above hole structure. Depending on the structure, the through hole structure performs an electric reference for preventing the RF signal from decay or interference.

摘要翻译： 用于晶片级封装的通孔结构包括晶片，穿透晶片的RF通道和设置在RF通道周围的通孔结构。 通孔结构有三种结构。 通孔结构包括多个填充有金属材料的孔。 另一方面，通孔结构可以是在其内表面上涂覆有金属层的多个孔。 或者，通孔结构具有上述两个孔结构。 根据结构，通孔结构执行用于防止RF信号衰减或干扰的电参考。

公开(公告)号：US20080229617A1

公开(公告)日：2008-09-25

申请号：US12015327

申请日：2008-01-16

申请人： Daniel A. Johnson ,  Chien-Yu Huang

发明人： Daniel A. Johnson ,  Chien-Yu Huang

IPC分类号： A43B1/00 ,  A43B13/00 ,  A43B23/00 ,  A43C15/00

CPC分类号： A43B13/141 ,  A43B3/0057 ,  A43B13/12 ,  A43B13/122 ,  A43B13/125 ,  A43B13/16

摘要： An article of footwear may have an upper and a sole structure secured to the upper. The sole structure includes a midsole and an outsole. The midsole has an upper surface and an opposite lower surface. The upper surface defines a plurality of depressions, and the lower surface defines a plurality of indentations extending toward the depressions. The outsole forms projections that extend into the indentations of the midsole, and the outsole has grooves located opposite the projections.

摘要翻译： 鞋类物品可以具有固定到鞋面的鞋底和鞋底结构。 鞋底结构包括中底和外底。 中底具有上表面和相对的下表面。 上表面限定多个凹陷，并且下表面限定朝向凹部延伸的多个凹陷。 外底形成延伸到中底凹陷中的突起，并且外底具有与突起相对的凹槽。

公开(公告)号：US07216138B2

公开(公告)日：2007-05-08

申请号：US09783875

申请日：2001-02-14

申请人： Mohammad Abdallah ,  Prasad Modali ,  Chien-Yu Huang, legal representative ,  Thomas R. Huff ,  Vladimir Pentkovski ,  Patrice Roussel ,  Shreekant S. Thakkar

发明人： Hsien-Cheng E. Hsieh, deceased

IPC分类号： G06F7/00 ,  G06F9/30

CPC分类号： H03M7/24

摘要： A method and apparatus are described for converting a number from a floating point format to an integer format or from an integer format to a floating point format responsive to a control signal of a control signal format.Numbers are stored in the floating point format in a register of a first set of architectural registers in a packed format. One or more numbers in the floating point format are converted to the integer format and placed in a register of a second set of architectural registers in a packed format. Conversion from integer format to floating point format is performed in a similar manner.A floating point arithmetic apparatus is described that provides for converting a plurality of numbers between integer formats and a floating point formats, further providing for conversion operations that require a greater data path width than floating-point arithmetic operations.

摘要翻译： 描述了一种方法和装置，用于响应于控制信号格式的控制信号将数字从浮点格式转换为整数格式或从整数格式转换为浮点格式。 数字以浮点格式存储在打包格式的第一组结构寄存器的寄存器中。 浮点格式中的一个或多个数字被转换为整数格式，并以打包格式放置在第二组体系结构寄存器的寄存器中。 以类似的方式执行从整数格式到浮点格式的转换。 描述了一种浮点运算装置，其提供了整数格式和浮点格式之间的多个数字的转换，进一步提供了需要比浮点算术运算更大的数据路径宽度的转换操作。

公开(公告)号：US20080295361A1

公开(公告)日：2008-12-04

申请号：US11754772

申请日：2007-05-29

申请人： Daniel A. Johnson ,  Chien-Yu Huang ,  Hui-Chin Chen

发明人： Daniel A. Johnson ,  Chien-Yu Huang ,  Hui-Chin Chen

IPC分类号： A43B13/00

CPC分类号： A43B13/181 ,  A43B1/0027 ,  A43B1/0072 ,  A43B3/0078 ,  A43B21/26 ,  A43B23/24

摘要： An article of footwear with a sole system including a transparent heel portion is disclosed. The transparent heel portion includes a cavity configured to receive a support member comprising a plurality of support columns and an indicia member associated with the support member. The indicia and the support member are both visible along a bottom surface of the heel portion.

摘要翻译： 公开了一种具有包括透明鞋跟部分的鞋底系统的鞋类物品。 透明鞋跟部分包括构造成接收包括多个支撑柱的支撑构件和与支撑构件相关联的标记构件的空腔。 标记和支撑构件都沿跟部的底部表面可见。

公开(公告)号：US08059425B2

公开(公告)日：2011-11-15

申请号：US12153907

申请日：2008-05-28

申请人： Chung-Er Huang ,  Chien-Yu Huang

发明人： Chung-Er Huang ,  Chien-Yu Huang

IPC分类号： H03B1/00

CPC分类号： H05K9/0022 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0201 ,  H05K1/0243 ,  H05K3/284 ,  H05K2201/062 ,  H05K2201/09072 ,  H05K2201/10371 ,  H05K2203/1316

摘要： An integrated circuit module with temperature compensation crystal oscillator (TCXO) applying to an electronic device comprises: one substrate having one top surface; one temperature compensation crystal oscillator (TCXO) disposed on the top surface; at least one chip disposed on the top surface; one encapsulating piece formed on the top surface for covering the TCXO and the chip. As above-described structure, TCXO is prevented from exchanging heat due to the temperature difference so that the stability of the TCXO is improved.

摘要翻译： 一种应用于电子设备的温度补偿晶体振荡器（TCXO）的集成电路模块包括：具有一个顶表面的一个基板; 一个温度补偿晶体振荡器（TCXO）设置在顶表面上; 至少一个芯片设置在顶表面上; 一个封装件形成在顶表面上，用于覆盖TCXO和芯片。 由于上述结构，TCXO由于温度差而不能进行热交换，所以TCXO的稳定性提高。