公开(公告)号：US4649460A

公开(公告)日：1987-03-10

申请号：US701221

申请日：1985-02-13

申请人： Giuseppe Marchisi ,  Carlo C. De Martiis

发明人： Giuseppe Marchisi ,  Carlo C. De Martiis

IPC分类号： H01L23/04 ,  H01L21/02 ,  H01L21/683 ,  H01L23/02 ,  H01L23/047 ,  H01L23/367 ,  H01L23/40 ,  H01L23/50

CPC分类号： H01L23/047 ,  H01L23/3675 ,  H01L23/4006 ,  H01L2023/405 ,  H01L2023/4087 ,  H01L2924/0002 ,  Y10T29/49121

摘要： An insulating package premolded on a metallic frame with electrical contacts contains in an inner space a semiconductor chip which rests on a thermic dissipator and is connected to the electrical contacts. The inner space of the package is closed on top by a cover provided with a lateral extension with a bent end, which operates not only as a cover, but also as a means for fastening and thrusting the package toward a support surface.

摘要翻译： 在具有电触头的金属框架上预先包覆的绝缘封装在内部空间中包含一个半导体芯片，该半导体芯片放置在热消散器上并连接到电触头。 包装的内部空间在顶部由盖子封闭，盖子具有弯曲端部的横向延伸部分，其不仅作为盖子操作，而且还用作将包装件紧固并推向支撑表面的装置。

公开(公告)号：US5357160A

公开(公告)日：1994-10-18

申请号：US006307

申请日：1993-01-22

申请人： Isao Kaneda ,  Kohei Yonemura ,  Sandro Cerato ,  Carlo C. De Martiis

发明人： Isao Kaneda ,  Kohei Yonemura ,  Sandro Cerato ,  Carlo C. De Martiis

IPC分类号： H02K3/52 ,  H02K3/50 ,  H02K5/22 ,  H02K11/00 ,  H02K21/22 ,  H02K29/00 ,  H02K7/14 ,  H02K7/08

CPC分类号： H02K5/225 ,  H02K11/01 ,  H02K11/33 ,  H02K11/40 ,  H02K2203/03 ,  H02K2211/03 ,  H02K3/50

摘要： A DC motor having a housing, a hub member rotatably supported by the housing, a flexible printed circuit board fixedly mounted on the housing, and an IC chip mounted on the flexible printed circuit board and located facing a recess formed in the housing. The hub member has a shaft rotatably supported by a bearing within the recess. The flexible printed circuit board has a metal layer for mounting the IC chip, the metal layer being isolated from a wiring pattern formed on the printed circuit board. The wiring pattern on the flexible printed circuit board is directly connected to a connection pin connected to the motor wiring.

摘要翻译： 一种具有壳体的直流电动机，由壳体可旋转地支撑的轮毂构件，固定地安装在壳体上的柔性印刷电路板，以及安装在柔性印刷电路板上并面向形成在壳体中的凹部的IC芯片。 毂构件具有由凹部内的轴承可旋转地支撑的轴。 柔性印刷电路板具有用于安装IC芯片的金属层，金属层与形成在印刷电路板上的布线图案隔离。 柔性印刷电路板上的布线图形直接连接到与马达布线相连的连接引脚上。

公开(公告)号：US5244838A

公开(公告)日：1993-09-14

申请号：US784303

申请日：1991-10-31

申请人： Paolo Casati ,  Carlo C. De Martiis ,  Giuseppe Marchisi

发明人： Paolo Casati ,  Carlo C. De Martiis ,  Giuseppe Marchisi

IPC分类号： H01L21/56 ,  H01L23/433

CPC分类号： H01L23/4334 ,  H01L21/565 ,  H01L2924/0002 ,  Y10S425/228 ,  Y10T29/49121

摘要： A die-stamped frame is fastened to a heat sink metal baseplate by wedging flexible tabs into receiving indentations of the baseplate while keeping the frame substantially in contact with the surface of the baseplate. The wire welding operations may then take place on the end of the fingers of the patterned metal frame while the same are solidly resting on the surface of the baseplate thus facilitating the welding. The backing-off of the metal frame from the surface of the heat sink baseplate takes place upon the closing of the mold used for encapsulating in resin the device. The injection of the resin and its solidification "freezes" the pins in the backed-off position imposed by the mold upon closing, thus ensuring the electrical isolation between the pins and the integral heat sink baseplate.

公开(公告)号：US5370517A

公开(公告)日：1994-12-06

申请号：US45983

申请日：1993-04-09

申请人： Paolo Casati ,  Carlo C. De Martiis ,  Giuseppe Marchisi

发明人： Paolo Casati ,  Carlo C. De Martiis ,  Giuseppe Marchisi

IPC分类号： H01L21/56 ,  H01L23/433 ,  B29C ,  B29C45/14

CPC分类号： H01L23/4334 ,  H01L21/565 ,  H01L2924/0002 ,  Y10S425/228 ,  Y10T29/49121

摘要： A die-stamped frame is fastened to a heat sink metal baseplate by wedging flexible tabs into receiving indentations of the baseplate while keeping the frame substantially in contact with the surface of the baseplate. The wire welding operations may then take place on the end of the fingers of the patterned metal frame while the same are solidly resting on the surface of the baseplate thus facilitating the welding. The backing-off of the metal frame from the surface of the heat sink baseplate takes place upon the closing of the mold used for encapsulating in resin the device. The injection of the resin and its solidification "freezes" the pins in the backed-off position imposed by the mold upon closing, thus ensuring the electrical isolation between the pins and the integral heat sink baseplate.

摘要翻译： 模压框架通过将柔性突片楔入接收底板的凹槽中而紧固到散热器金属底板上，同时保持框架基本上与基板的表面接触。 然后，线焊接操作可以在图案化的金属框架的指状物的端部上发生，同时固定在基板的表面上，从而便于焊接。 金属框架从散热器基板表面的脱落发生在用于封装在树脂中的模具的封闭件上。 树脂的注入及其固化在关闭时由模具施加的退回位置中的销钉“冻结”，从而确保销和整体式散热器基板之间的电气隔离。