公开(公告)号：US5800650A

公开(公告)日：1998-09-01

申请号：US543623

申请日：1995-10-16

申请人： David Allen Anderson ,  Carol Rita Myers ,  Matthew John Saari

发明人： David Allen Anderson ,  Carol Rita Myers ,  Matthew John Saari

IPC分类号： H05K1/00 ,  H05K3/28 ,  H05K3/32 ,  H05K3/36 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  C25D5/56

CPC分类号： H05K3/4635 ,  H05K3/361 ,  H05K3/388 ,  H05K3/4076 ,  H05K3/462 ,  H01L2224/293 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H05K1/0393 ,  H05K2201/09536 ,  H05K2201/10378 ,  H05K3/28 ,  H05K3/323 ,  H05K3/4623 ,  Y10T156/1056 ,  Y10T29/49126

摘要： Flexible multilayer printed circuit boards are disclosed which utilize adhesiveless laminates interconnected in a generally superposed relationship by a conductive adhesive. In one embodiment, the adhesiveless laminates have relatively thin conductive layers and metallized through holes which exhibit high delamination resistance. The metallized through holes preferably have a thickness of at most about 25 microns, yet they are capable of withstanding multilayer assembly processes. High flexibility, reliability, packaging density, and environmental resistance are consequently available in a thin multilayer construction. In a further embodiment, adhesiveless dielectric layers are interposed between adhesiveless laminates to electrically insulate portions thereof. The adhesiveless dielectric layers may define relatively small apertures therein, thus providing greater packaging density for a multilayer printed circuit board.